JPWO2024225011A5 - - Google Patents

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Publication number
JPWO2024225011A5
JPWO2024225011A5 JP2025516681A JP2025516681A JPWO2024225011A5 JP WO2024225011 A5 JPWO2024225011 A5 JP WO2024225011A5 JP 2025516681 A JP2025516681 A JP 2025516681A JP 2025516681 A JP2025516681 A JP 2025516681A JP WO2024225011 A5 JPWO2024225011 A5 JP WO2024225011A5
Authority
JP
Japan
Prior art keywords
wire
lead
junction
distance
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025516681A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024225011A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/014296 external-priority patent/WO2024225011A1/ja
Publication of JPWO2024225011A1 publication Critical patent/JPWO2024225011A1/ja
Publication of JPWO2024225011A5 publication Critical patent/JPWO2024225011A5/ja
Pending legal-status Critical Current

Links

JP2025516681A 2023-04-26 2024-04-08 Pending JPWO2024225011A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023072527 2023-04-26
PCT/JP2024/014296 WO2024225011A1 (ja) 2023-04-26 2024-04-08 半導体装置、および、半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPWO2024225011A1 JPWO2024225011A1 (https=) 2024-10-31
JPWO2024225011A5 true JPWO2024225011A5 (https=) 2026-01-29

Family

ID=93256301

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025516681A Pending JPWO2024225011A1 (https=) 2023-04-26 2024-04-08

Country Status (2)

Country Link
JP (1) JPWO2024225011A1 (https=)
WO (1) WO2024225011A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0691118B2 (ja) * 1986-11-28 1994-11-14 富士通株式会社 半導体装置およびその製造方法
JPH1167808A (ja) * 1997-08-21 1999-03-09 Hitachi Ltd 半導体装置の製造方法および半導体装置
JP6316086B2 (ja) * 2014-05-09 2018-04-25 三菱電機株式会社 樹脂封止型電力用半導体装置及びその製造方法
JP2018110169A (ja) * 2016-12-28 2018-07-12 富士電機株式会社 半導体装置および半導体装置製造方法

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