JPWO2024225011A1 - - Google Patents
Info
- Publication number
- JPWO2024225011A1 JPWO2024225011A1 JP2025516681A JP2025516681A JPWO2024225011A1 JP WO2024225011 A1 JPWO2024225011 A1 JP WO2024225011A1 JP 2025516681 A JP2025516681 A JP 2025516681A JP 2025516681 A JP2025516681 A JP 2025516681A JP WO2024225011 A1 JPWO2024225011 A1 JP WO2024225011A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023072527 | 2023-04-26 | ||
| PCT/JP2024/014296 WO2024225011A1 (ja) | 2023-04-26 | 2024-04-08 | 半導体装置、および、半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024225011A1 true JPWO2024225011A1 (https=) | 2024-10-31 |
| JPWO2024225011A5 JPWO2024225011A5 (https=) | 2026-01-29 |
Family
ID=93256301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025516681A Pending JPWO2024225011A1 (https=) | 2023-04-26 | 2024-04-08 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024225011A1 (https=) |
| WO (1) | WO2024225011A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0691118B2 (ja) * | 1986-11-28 | 1994-11-14 | 富士通株式会社 | 半導体装置およびその製造方法 |
| JPH1167808A (ja) * | 1997-08-21 | 1999-03-09 | Hitachi Ltd | 半導体装置の製造方法および半導体装置 |
| JP6316086B2 (ja) * | 2014-05-09 | 2018-04-25 | 三菱電機株式会社 | 樹脂封止型電力用半導体装置及びその製造方法 |
| JP2018110169A (ja) * | 2016-12-28 | 2018-07-12 | 富士電機株式会社 | 半導体装置および半導体装置製造方法 |
-
2024
- 2024-04-08 JP JP2025516681A patent/JPWO2024225011A1/ja active Pending
- 2024-04-08 WO PCT/JP2024/014296 patent/WO2024225011A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024225011A1 (ja) | 2024-10-31 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20251017 |