JPWO2023002795A5 - - Google Patents
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- Publication number
- JPWO2023002795A5 JPWO2023002795A5 JP2023536659A JP2023536659A JPWO2023002795A5 JP WO2023002795 A5 JPWO2023002795 A5 JP WO2023002795A5 JP 2023536659 A JP2023536659 A JP 2023536659A JP 2023536659 A JP2023536659 A JP 2023536659A JP WO2023002795 A5 JPWO2023002795 A5 JP WO2023002795A5
- Authority
- JP
- Japan
- Prior art keywords
- region
- pad
- main electrode
- semiconductor device
- semiconductor substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 14
- 239000000758 substrate Substances 0.000 claims 7
- 230000015572 biosynthetic process Effects 0.000 claims 5
- 230000002093 peripheral effect Effects 0.000 claims 2
- 230000001681 protective effect Effects 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024127824A JP7782627B2 (ja) | 2021-07-20 | 2024-08-02 | 半導体装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021119227 | 2021-07-20 | ||
| JP2021119227 | 2021-07-20 | ||
| PCT/JP2022/024840 WO2023002795A1 (ja) | 2021-07-20 | 2022-06-22 | 半導体装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024127824A Division JP7782627B2 (ja) | 2021-07-20 | 2024-08-02 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023002795A1 JPWO2023002795A1 (https=) | 2023-01-26 |
| JPWO2023002795A5 true JPWO2023002795A5 (https=) | 2023-12-13 |
| JP7540600B2 JP7540600B2 (ja) | 2024-08-27 |
Family
ID=84979979
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023536659A Active JP7540600B2 (ja) | 2021-07-20 | 2022-06-22 | 半導体装置 |
| JP2024127824A Active JP7782627B2 (ja) | 2021-07-20 | 2024-08-02 | 半導体装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024127824A Active JP7782627B2 (ja) | 2021-07-20 | 2024-08-02 | 半導体装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20240072045A1 (https=) |
| JP (2) | JP7540600B2 (https=) |
| CN (1) | CN117581383A (https=) |
| WO (1) | WO2023002795A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2025077262A (ja) * | 2023-11-06 | 2025-05-19 | 株式会社デンソー | 半導体装置 |
| JP2025091867A (ja) * | 2023-12-08 | 2025-06-19 | ミネベアパワーデバイス株式会社 | 半導体装置 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009111188A (ja) * | 2007-10-30 | 2009-05-21 | Denso Corp | 半導体装置 |
| JP5637175B2 (ja) * | 2008-12-24 | 2014-12-10 | 株式会社デンソー | 半導体装置 |
| WO2016006263A1 (ja) * | 2014-07-11 | 2016-01-14 | 新電元工業株式会社 | 半導体装置及び半導体装置の製造方法 |
| JP6728638B2 (ja) | 2015-11-10 | 2020-07-22 | 富士電機株式会社 | 半導体デバイスの製造方法 |
| JP6565815B2 (ja) | 2016-07-21 | 2019-08-28 | 株式会社デンソー | 半導体装置 |
| JP6624300B2 (ja) * | 2016-10-17 | 2019-12-25 | 富士電機株式会社 | 半導体装置 |
| JP6666292B2 (ja) | 2017-03-22 | 2020-03-13 | トヨタ自動車株式会社 | 半導体装置 |
| JP7075876B2 (ja) | 2018-12-25 | 2022-05-26 | 株式会社日立製作所 | 炭化ケイ素半導体装置、電力変換装置、３相モータシステム、自動車および鉄道車両 |
| JP7243845B2 (ja) | 2019-09-25 | 2023-03-22 | 富士電機株式会社 | 半導体装置 |
| JP7363586B2 (ja) | 2020-03-04 | 2023-10-18 | 株式会社デンソー | 半導体装置 |
| JP7403386B2 (ja) * | 2020-05-27 | 2023-12-22 | 三菱電機株式会社 | 半導体装置 |
| CN117242580A (zh) * | 2021-04-26 | 2023-12-15 | 三菱电机株式会社 | 半导体装置 |
| JP7706415B2 (ja) * | 2022-04-26 | 2025-07-11 | 三菱電機株式会社 | 半導体装置および電力変換装置 |
-
2022
- 2022-06-22 JP JP2023536659A patent/JP7540600B2/ja active Active
- 2022-06-22 CN CN202280046746.9A patent/CN117581383A/zh active Pending
- 2022-06-22 WO PCT/JP2022/024840 patent/WO2023002795A1/ja not_active Ceased
-
2023
- 2023-11-06 US US18/502,456 patent/US20240072045A1/en active Pending
-
2024
- 2024-08-02 JP JP2024127824A patent/JP7782627B2/ja active Active
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