TW201901816A - 電子模組 - Google Patents

電子模組 Download PDF

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Publication number
TW201901816A
TW201901816A TW107114699A TW107114699A TW201901816A TW 201901816 A TW201901816 A TW 201901816A TW 107114699 A TW107114699 A TW 107114699A TW 107114699 A TW107114699 A TW 107114699A TW 201901816 A TW201901816 A TW 201901816A
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TW
Taiwan
Prior art keywords
electronic component
electronic
head
substrate
support
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Application number
TW107114699A
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English (en)
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TWI683373B (zh
Inventor
池田康亮
松嵜理
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日商新電元工業股份有限公司
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Publication of TW201901816A publication Critical patent/TW201901816A/zh
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Publication of TWI683373B publication Critical patent/TWI683373B/zh

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Abstract

本發明的電子模組，包括：第一電子單元，具有第一基板(11)、配置在所述第一基板(11)的一側的第一導體層(12)、以及配置在所述第一導體層(12)的一側的第一電子元件(13)；第一連接體(60)，配置在所述第一電子元件(13)的一側；以及第二電子單元，具有配置在的所述第一連接體(60)的一側的第二電子元件(23)。其中，所述第一連接體(60)具有第一頭部(61)、以及從所述第一頭部(61)延伸的多個支撐部(65)，所述支撐部(65)與所述第一基板(11)或所述第一導體層(12)抵接。

Description

電子模組
本發明涉及電子模組。
以往，在封裝樹脂內配置有多個電子元件的電子模組已被普遍認知（例如，參照特許公開2014-45157號）。這種電子模組被要求實現小型化。
作為實現小型化的手段之一，可以考慮採用將電子元件疊層。當疊層時，可以考慮在電子元件的一側（例如正面側）配置連接體，並在該連接體的一側配置別的電子元件。
像這樣在採用在連接體的一側配置電子元件的形態的情況下，在第二電子元件安裝時或安裝後可能會因該第二電子元件自身的重量導致連接體發生傾斜。另外，由於第一電子元件與第二電子元件是相互靠近配置的，這樣就容易使熱量集聚，因此還需要提高散熱性。
本發明的目的，是提供一種電子模組，其能夠在第二電子元件安裝時或安裝後防止因該第二電子元件自身的重量導致連接體發生傾斜，並且還能夠提高散熱性。
本實施方式涉及的電子模組，可以包括：第一電子單元，具有第一基板、配置在所述第一基板的一側的第一導體層、以及配置在所述第一導體層的一側的第一電子元件；第一連接體，配置在所述第一電子元件的一側；以及第二電子單元，具有配置在的所述第一連接體的一側的第二電子元件，其中，所述第一連接體具有第一頭部、以及從所述第一頭部延伸的多個支撐部，所述支撐部與所述第一基板或所述第一導體層抵接。
在本發明涉及的電子模組中，可以是：複數個所述支撐部與所述第一導體層相連接，與所述支撐部相連接的第一導體層不與別的第一導體層、所述第一電子元件以及所述第二電子元件電氣連接。
在本發明涉及的電子模組中，可以是：配置有三個以上的所述支撐部。
在本發明涉及的電子模組中，可以是：所述支撐部從所述第一頭部的另一側向所述第一基板或所述第一導體層直線延伸。
在本發明涉及的電子模組中，可以是：所述第一頭部從平面看呈矩形，所述支撐部對應所述第一頭部的三個邊或四個邊配置。
在本發明涉及的電子模組中，可以是：所述第一連接體具有從所述第一頭部向另一側延伸的第一柱部。
在本發明涉及的電子模組中，可以是：從平面看，所述第一電子元件從所述第一頭部露出。
在本發明涉及的電子模組中，可以是：所述第二電子元件的一側配置有第二連接體。
在本發明涉及的電子模組中，可以是：所述第二連接體具有第二頭部、以及從所述第二頭部向另一側延伸的第二柱部。
本發明涉及的電子模組，可以包括：第一電子單元，具有第一基板、以及配置在所述第一基板的一側的第一電子元件；第一連接體，配置在所述第一電子元件的一側；以及第二電子單元，具有配置在的所述第一連接體的一側的第二電子元件，其中，所述第一連接體具有第一頭部、以及從所述第一頭部延伸的複數個支撐部，所述第一基板為金屬基板，所述支撐部與所述第一基板抵接。
第一實施方式
《構成》
在本實施方式中，「一側」指的是第1圖中的上方側，「另一側」指的是第1圖中的下方側。另外，將第1圖中的上下方向稱為「第一方向」、 左右方向稱為「第二方向」、紙面的表裡方向稱為「第三方向」。將包含第二方向以及第三方向的面內方向稱為「面方向」，將從一側進行觀看稱為“從平面看”。
本實施方式中的電子模組，可以具有第一電子單元、以及第二電子單元。
如第1圖所示，第一電子單元可以具有：第一基板11、配置在第一基板11的一側的複數個第一導體層12、以及配置在第一導體層12的一側的第一電子元件13。第一電子元件13可以是開關元件，也可以是控制元件。當第一電子元件13是開關元件時，可以為MOSFET、IGBT等。第一電子元件13以及後述的第二電子元件23可以分別由各自的半導體元件構成，作為半導體材料，可以是矽、碳化矽、氮化鎵等。第一電子元件13的另一側的面可以藉由焊錫等導電性接合劑與第一導體層12相連接。
第一電子元件13的一側可以配置有第一連接體60。第一連接體60可以具有第一頭部61、以及從第一頭部61向另一側延伸的複數個支撐部65。可以配置有三個以上的支撐部65。
雖然如第2圖所示在本實施方式的形態中，配置有四個支撐部65（65a至65d），但並不僅限於此，例如也可以如第二實施方式所示，配置有三個支撐部65。第一連接體60可以藉由焊錫等導電性接合劑與第一電子元件13的一側的面相連接。支撐部65可以各自具有在面方向上延伸的，並且與第一基板11或第一導體層12抵接的支撐基端部69（69a至69d）。另外，第2圖中所示的電子模組與第1圖中所示的電子模組是不同的電子模組，將分別舉例進行說明。
如第1圖所示，在第一連接體60的一側可以配置有第二電子單元。第二電子單元可以具有配置在第一連接體60的一側的第二電子元件23。另外，第二電子單元還可以具有第二基板21、以及配置在第二基板21的另一側的第二導體層22。第二導體層22的另一側可以配置有第二連接體70。
當配置有第二導體層22的時，與第1圖中所示的形態不同，第二導體層22上可以配置有第二電子元件23。第二連接體70可以藉由焊錫等導電性接合劑與第二電子元件23的一側的面以及第二導體層22的另一側的面相連接。
第二電子元件23可以是開關元件，也可以是控制元件。當第二電子元件23是開關元件時，可以為MOSFET、IGBT等。
作為一例，支撐部65可以各自與第一導體層12抵接。與支撐部65相連接的第一導體層12可以不與別的第一導體層12、第二導體層22、第一電子元件13以及第二電子元件23電氣連接。
第一頭部61從平面看可以呈矩形（參照第2圖）。此情況下，支撐部65對應第一頭部61的三個邊或四個邊配置。只要具有四條相對的邊就符合本實施方式中的“大致矩形”，其角部可以為直角，也可以為圓弧形。在本實施方式中，雖然以採用配置有四個支撐部65的形態來進行說明，但並不僅限於此，也可以如後述第二實施方式般，採用配置有三個支撐部65的形態。
支撐部65的寬度可以是互不相同的。在第2圖所示形態中，與配置在第2圖左側的第一支撐部65a相比，配置在第2圖右側的第二支撐部65b更寬，而與該第二支撐部65b相比，配置在第2圖上側的第三支撐部65c以及下側的第四支撐部65d則更寬。在第2圖所示形態中，第三支撐部65c與第四支撐部65d的寬度相同。
如第1圖所示，第一連接體60可以具有從第一頭部61向另一側延伸的第一柱部62。如第2圖所示，可以在第一頭部61的一側的面上配置第一溝槽部64。第一溝槽部64從平面看可以配置在第一柱部62邊緣的至少一部分上，也可以配置在第一柱部62的整個邊緣上。第一溝槽部64的截面可以如第3圖（b）所示呈矩形，也可以如第3圖（a）所示呈矩形呈三角形。當呈三角形時，可以是直角三角形，也可以是等邊三角形。
如第1圖所示，第二連接體70可以具有第二頭部71、以及從第二頭部71向另一側延伸的第二柱部72。
如第4圖所示，可以在第二電子元件23的一側配置第三連接體80。第三連接體80可以具有第三頭部81、以及從第三頭部81向另一側延伸的第三柱部82。第三連接體80可以藉由焊錫等導電性接合劑與第二導體層22的另一側的面以及第二電子元件23的一側的面相連接。作為第三連接體80，可以不使用具有第三柱部82且縱截面呈大致T字形的部件，而可以使用一般的連接件85（參照第12圖）。
如第2圖所示，從平面看，第一電子元件13可以採用從第一頭部61向外部露出的形態。當第一電子元件13為MOSFET等開關元件的情況下，可以在露出至於外部的部分上配置第一閘極端子13g等。同時，當第二電子元件23為MOSFET等開關元件的情況下，可以一側的面上配置第二閘極端子23g等。如第2圖所示，在第一電子元件13的一側的面上具有第一閘極端子13g與第一源極端子13s，在第二電子元件23的一側的面上具有第二閘極端子23g與第二源極端子23s。此情況下，第二連接體70可以藉由焊錫等導電性接合劑與第二電子元件23的第二源極端子23s相連接，第三連接體80可以藉由焊錫等導電性接合劑與第二電子元件23的第二閘極端子23g相連接。另外，第一連接體60可以藉由焊錫等導電性接合劑將第一電子元件13的一源極端子13s與配置在第二電子元件23的另一側的第二汲極端子連接。配置第一電子元件13的另一側的第一汲極端子可以藉由焊錫等導電性接合劑與第一導體層12相連接。第一電子元件13的第一閘極端子13g可以藉由導電性接合劑與第四連接體（例如第5圖中的連接件85）相連接，該第四連接體可以藉由導電性接合劑與第一導體層12相連接。
當第一電子元件13以及第二電子元件23中僅任意一方為開關元件時，可以考慮將載置在第一連接體60上的第二電子元件23作為發熱量較低的控制元件，而將第一電子元件13設為開關元件。反之，也可以考慮將載置在第一連接體60上的第二電子元件23作為開關元件，而將第一電子元件13設為發熱量較低的控制元件。
支撐部65如第2圖所示，可以具有從第一頭部61向面方向延伸的面方向支撐部166（166a至166d）、以及從面方向支撐部166向高度方向（第一方向）延伸的高度方向支撐部165（參照第1圖）。另外，面方向支撐部166指的是在寬度方向上大小比第一頭部61更小的部分。
電子模組可以具有由用於封裝第一電子元件13、第二電子元件23、第一連接體60、第二連接體70、第三連接體80、第一導體層12以及第二導體層22的封裝樹脂等所構成的封裝部90。
第一導體層12可以與端子部（未圖示）相連接，端子部的前端側向封裝部90 的外部露出並可與外部裝置相連接。
另外，也可以藉由第一電子元件13、第二電子元件23、第一連接體60、第二連接體70、第三連接體80以及第四連接體來構成晶片模組。此情況下，可以將具有第一電子元件13、第二電子元件23、第一連接體60、第二連接體70、第三連接體80以及第四連接體的晶片模組，在配置在配置有第一導體層12的第一基板11以及配置有第二導體層22的第二基板21之間後，在藉由利用封裝部90來進行封裝，從而來製造電子模組。
作為第一基板11以及第二基板21，可以採用陶瓷基板、絕緣樹脂層等材料。作為導電性接合劑，除了焊錫以外，還可以使用以Ag和Cu為主要成分的材料。作為第一連接體60以及第二連接體70的材料，可以使用Cu等金屬。作為基板11、21，例如可以使用經過將電路圖案化後的金屬基板，此情況下，基板11、21可以兼做導體層12、21來使用。
端子部與導體層12、22之間的接合，不僅可以藉由使用焊錫等導電性接合劑來完成，還可以利用雷射焊接、以及超聲波焊接來完成。
《作用・效果》
接下來，將對由上述結構構成的本實施方式的作用以及效果進行說明。另外，可以將在《作用・效果》中說明的任何形態適用於上述結構。
在本實施方式中，如第1圖以及第2圖所示，在採用具有從第一頭部61延伸的複數個支撐部65，並且支撐部65與第一基板11或第一導體層12抵接的形態的情況下，在第二電子元件23安裝時或安裝後就能夠防止因該第二電子元件23自身的重量導致第一連接體60發生傾斜。另外，由於支撐部65與第一基板11或第一導體層12抵接，因此還能夠提高散熱性。特別是在支撐部65與第一基板11抵接的情況下，有利於進一步提高散熱效果。
另外，當第一電子元件13以及第二電子元件23各自為開關元件時，熱量就容易集聚，而當採用複數個支撐部65與第一基板11或第一導體層12抵接的形態時，則有利於有效地將該熱量進行散熱。
當採用與支撐部65相連接的第一導體層12不與別的第一導體層12、第二導體層22、第一電子元件13以及第二電子元件23電氣連接從而不發揮電氣功能的形態的情況下，有利於防止第一電子元件12以及第二電子元件23顯示支撐部65導通後出現意外的運作。
藉由採用配置有三個以上的支撐部65的形態，有利於實現高穩定性以及散熱性，如第2圖所示，藉由採用配置有四個支撐部65的形態，有利於實現更高的穩定性以及散熱性。
如第1圖所示，在採用第一連接體60具有第一柱部62的形態的情況下，就能夠使第一電子元件13與第二電子元件23在一定程度上分開，這有利於熱量的散逸。
如第2圖所示，在採用從平面看第一電子元件13從第一頭部61露出的形態的情況下，就能夠使第一電子元件13與配置在第一頭部61上的第二電子元件23在面方向上錯開，進而有利於更加容易地使熱量散逸。另外，之所以能夠在配置有四個支撐部65的情況下，從平面看使第一電子元件13從第一頭部61露出，是因為配置有面方向支撐部166的緣故。
另外，如第2圖所示，在採用從平面看如第一電子元件13的第一閘極端子13g這樣的第一端子從第一頭部61露出的形態的情況下，就能夠在第一連接體60載置完成後再進行將連接件和導線與第一閘極端子13g連接的步驟。
如第2圖所示，在採用向第一電子元件13的第一閘極端子13g這樣的端子所配置的方向延伸的第一支撐部65a的面方向支撐部166a的寬度比別的支撐部65b至65d的面方向支撐部166b至166d的寬度更窄的形態的情況下，有利於確保用於將連接件和導線連接在第一閘極端子13g上的空間。
如第1圖所示，在採用第二連接體70具有從第二頭部71向另一側延伸的第二柱部72的形態的情況下，就能夠在第二電子元件23的一側騰出空間，從而防止第二電子元件所產生的熱量的聚集。同樣的，如第4圖所示，在採用第三連接體80具有從第三頭部81向另一側延伸的第三柱部82的形態的情況下，也能夠在第二電子元件23的一側騰出空間，從而防止第二電子元件所產生的熱量在此聚集。
第二實施方式
接下來，對本發明的第二實施方式進行說明。
在本實施方式中，如第5圖以及第6圖所示，配置有三個支撐部65（65a至65c）。關於其他的結構，由於與第一實施方式一樣，因此能夠採用第一實施方式中說明的任何一種形態。另外，將使用在第一實施方式說明中所使用的同一符號來進行說明。
根據如本實施方式般使用三個支撐部65的形態，與配置有四個或更多的支撐部65的形態相比，由於減少了支撐部65的數量，因此從片面看有利於減小面積。另外，即便僅配置有三個支撐部65，也能夠穩定地進行支撐。
藉由採用配置三個支撐部65的形態，即便是在例如採用不配置面方向支撐部166的形態的情況下，也能夠將第一電子元件13與第二電子元件23從平面上錯開配置。而藉由將第一電子元件13與第二電子元件23錯開配置，就能夠抑制兩者的熱量互相疊加後導致的散熱效率低下。
另外，如第7圖所示在沿第二方向觀看時，藉由在不配置有第二支撐部65b以及第三支撐部65c的部位上配置第一柱部62，就能夠以非常穩定的形態來配置第一連接體60。
另外，例如當第一電子元件13以及第二電子元件23各自由開關元件構成且發熱量較高時，可以考慮採用如第一實施方式般配置有四個或五個以上的支撐部65的形態。另一方面，當第一電子元件13以及第二電子元件23中僅一方為開關元件時，則可以考慮採用如第二實施方式般配置有三個支撐部65的形態。
第三實施方式
接下來，對本發明的第三實施方式進行說明。
在本實施方式中，如第8圖以及第9圖所示，支撐部65不具有面方向支撐部166而僅具有高度方向支撐部165，並從第一頭部61的另一側的面向第一基板11或第一導體層12直線延伸。另外，在本實施方式中，不配置有在面方向上延伸的支撐基端部。關於其他的結構，由於與上述各實施方式一樣，因此能夠採用上述各實施方式中說明的任何一種形態。另外，將使用在上述各實施方式說明中所使用的同一符號來進行說明。
根據本實施方式方式，由於支撐部65從第一頭部61的另一側的面向第一基板11或第一導體層12直線延伸，因此有利於減小其在面方向（第二方向以及第三方向）上的尺寸。
如第9圖所示藉由採用三個支撐部65（65a至65d），就能夠將第一電子元件13與第二電子元件23面方向上錯開配置，這樣就有利於減小兩者的熱量互相疊加的區域的面積。
另外，雖然上述中已說明了不配置支撐基端部69，但不限於此，也可以配置支撐基端部69。另外，也不必在複數個支撐部65的每一個上都配置支撐基端部69，而是可以僅在複數個支撐部65中的一部分上配置支撐基端部69，而其餘的一部分上不配置支撐基端部69。
第四實施方式
接下來，對本發明的第四實施方式進行說明。
在第三實施方式中，雖然採用了支撐部65不具有面方向支撐部166而具有三個支撐部65，並且各個支撐部65從第一頭部61的另一側的面向第一基板11或第一導體層12直線延伸的形態，但在本實施方式中，如第10圖所示，則採用了支撐部65不具有面方向支撐部166而具有四個支撐部65（65a至65d），並且各個支撐部65從第一頭部61的另一側的面向第一基板11或第一導體層12直線延伸的形態。關於其他的結構，由於與上述各實施方式一樣，因此能夠採用上述各實施方式中說明的任何一種形態。另外，將使用在上述各實施方式說明中所使用的同一符號來進行說明。另外，在第三實施方式以及第四實施方式中，雖然已對支撐部65為三個以及四個的形態進行了說明，但並不僅限於此，也可以是第一頭部61從平面看呈五角形以上，即配置有五個以上的支撐部65。
根據本實施方式，由於四個支撐部65a至65d的高度方向支撐部165a至165d從第一頭部61的另一側的面向第一基板11或第一導體層12直線延伸，因此與第三實施方式相比，能夠更穩定地配置第一連接體60。由於支撐部65的數量比第三實施方式更多，因此與第三實施方式相比，還可以期待藉由第一連接體60來實現高散熱性。
另一方面，在本實施方式中，由於支撐部65是從大致矩形上的第一頭部61的各個邊延伸的，因此第一電子元件13就會被從四面進行包圍。不過，由於藉由配置有四個支撐部65，就能夠將來自於第二電子元件23的熱量藉由有效地進行散熱，因此採用本實施方式則更為理想。
在本實施方式中，可以配置有支撐基端部69，也可以不配置有支撐基端部69。另外，也不必在複數個支撐部65的每一個上都配置支撐基端部69，而是可以僅在複數個支撐部65中的一部分上配置支撐基端部69，而其餘的一部分上不配置支撐基端部69。
第五實施方式
接下來，對本發明的第五實施方式進行說明。
在上述各實施方式中，雖然對截面為T字形的第二連接體70來進行了說明，但在本實施方式中，如第11圖所示，第二連接體70具有從第二頭部71向另一側延伸的延伸部75。關於其他的結構，由於與上述各實施方式一樣，因此能夠採用上述各實施方式中說明的任何一種形態。另外，將使用在上述各實施方式說明中所使用的同一符號來進行說明。另外，在第11圖中，由於支撐部65是重複疊加在延伸部75上的，因此圖中看不見支撐部65。
延伸部75可以各自與第一基板11或第一導體層12抵接。作為一例，延伸部75可以各自與第一導體層12抵接。與延伸部75相連接的第一導體層12可以不與別的第一導體層12、第二導體層22、第一電子元件13以及第二電子元件23電氣連接。
根據本實施方式，由於配置有延伸部75，因此能夠將來自於第二電子元件23的熱量有效地進行散熱，還能夠藉由第二連接體70實現高散熱性。
當採用在第一導體層12的一側配置有兩個以上的延伸部75的形態的情況下，就能夠藉由第二連接體70實現更高的散熱性。在本實施方式中，雖然配置有兩個延伸部75，但不僅限於此，可以如後述的第六實施方式般配置有三個延伸部75，甚至可以配置有四個以上的延伸部75。
藉由採用本實施方式，就能夠藉由第二連接體70來施加將第二基板21推回一側的排斥力。也就是說，雖然在製造步驟中會因加熱會對第一基板11以及第二基板21施加產生翹曲變形的力，但藉由使用具有複數個延伸部75的第二連接體70，則有利於防止第一基板11以及第二基板21產生翹曲變形。
第二連接體70的第二頭部71可以被配置為跨越第二電子元件23。如第11圖所示，延伸部75可以具有從第二頭部71的一個邊緣部延伸的第一延伸部75a、以及從第二頭部71的其他邊緣部延伸的第一延伸部75b。在採用此形態的情況下，有利於將第二連接體70更加均衡地配置在第一基板11或第一導體層12上。
當延伸部75具有在面方向上延伸的延伸基端部79時，就能夠將第二連接體70更加均衡地配置在第一基板11或第一導體層12上，並且還能夠藉由延伸基端部79來增加與第一基板11或第一導體層12之間的接觸面積，從而提升散熱效果。
另外，當延伸部75具有第一延伸部75a以及第二延伸部75b時，可以是第一延伸部75a具有第一延伸基端部79a，第二延伸部75b具有第二延伸基端部79b。
第六實施方式
接下來，對本發明的第六實施方式進行說明。
在第五實施方式中，雖然配置有兩個延伸部75，但在本實施方式中，則配置有三個延伸部75（75a至75c）。關於其他的結構，由於與上述各實施方式一樣，因此能夠採用上述各實施方式中說明的任何一種形態。另外，將使用在上述各實施方式說明中所使用的同一符號來進行說明。
延伸部75可以具有從第二頭部71向面方向延伸的面方向延伸部176（176a至176c）、以及從面方向延伸部176向高度方向（第一方向）延伸的高度方向延伸部175（175a至175c）。另外，面方向延伸部176指的是在寬度方向上大小比第二頭部71更小的部分。
延伸部75的面方向延伸部176與支撐部65的面方向延伸部166從平面看可以各自向不重複的方向延伸。此情況下，有利於縮小其在面方向上的大小。
具體來說，在第12圖至第14圖所示的形態中，配置有第一延伸部75a、第二延伸部75b以及第三延伸部75c，並且還配置有第一支撐部65a、第二支撐部65b以及第三支撐部65c。而且，第一延伸部75a具有第一面方向延伸部176a以及第一高度方向延伸部175a，第二延伸部75b具有第二面方向延伸部176b以及第二高度方向延伸部175b，第三延伸部75c具有第三面方向延伸部176c以及第三高度方向延伸部175c。第一支撐部65a具有第一面方向支撐部166a以及第一高度方向支撐部165a，第二支撐部65b具有第二面方向支撐部166b以及第二高度方向支撐部165b，第三支撐部65c具有第三面方向支撐部166c以及第三高度方向支撐部165c。
如第13圖所示，第一面方向延伸部176a從第二頭部71延伸的方向（第13圖中的右方向）與第一面方向支撐部166a從第一頭部61延伸的方向（第13圖中的左方向）從平面看正好相反。另外，雖然第二面方向延伸部176b從第二頭部71延伸的方向（第13圖中的上方向）與第三面方向支撐部166c從第一頭部61延伸的方向（第13圖中的上方向）相同，但它們在面方向即第三方向上是錯開配置的。再有，雖然第三面方向延伸部176c從第二頭部71延伸的方向（第13圖中的下方向）與第二面方向支撐部166b從第一頭部61延伸的方向（第13圖中的下方向）相同，但它們在面方向即第三方向上是錯開配置的。
藉由支撐部65具有面方向支撐部166，就能夠如第14圖所示般，將第一電子元件13以及第二電子元件23在面方向即第三方向上錯開配置，這樣就有利於減少第一電子元件13與第二電子元件23之間的重複發熱區域。
另外，如第13圖所示，在將第一電子元件13以及第二電子元件23在面方向即第三方向上錯開配置的同時，由於從片面看，第一閘極端子13g等第一端子與第二閘極端子23g等第二端子各自從第二頭部71露出，因此有利於確保用於將連接件和導線連接在第一閘極端子13g以及第二閘極端子23g上的空間，還能夠在完成載置第一連接體60以及第二連接體70後，再進行將連接件和導線連接在第一閘極端子13g以及第二閘極端子23g上的步驟。
最後，上述各實施方式、變形例中的記載以及圖式中公開的圖示僅為用於說明專利申請範圍中記載的發明的一例，因此專利申請範圍中記載的發明不受上述實施方式或圖式中公開的內容所限定。本申請最初的專利申請範圍中的記載僅僅是一個例子，可以根據說明書、圖式等的記載對專利申請範圍中的記載進行適宜的變更。
11‧‧‧第一基板
12‧‧‧第一導體層
13‧‧‧第一電子元件
21‧‧‧第二基板
22‧‧‧第二導體層
23‧‧‧第二電子元件
60‧‧‧第一連接體
61‧‧‧第一頭部
62‧‧‧第一柱部
64‧‧‧第一溝槽部
65、65a、65b、65c、65d‧‧‧支撐部
69、69a、69b、69c、69d‧‧‧支撐基端部
70‧‧‧第二連接體
71‧‧‧第二頭部
72‧‧‧第二柱部
75、75a、75b、75c‧‧‧延伸部
79、79a、79b‧‧‧延伸基端部
80‧‧‧第三連接體
81‧‧‧第三頭部
82‧‧‧第三柱部
90‧‧‧封裝部
165、165a、165b、165c、165d‧‧‧高度方向支撐部
166、166a、166b、166c、166d‧‧‧面方向支撐部
175、175a、175b、175c‧‧‧高度方向延伸部
176、176a、176b、176c‧‧‧面方向延伸部
13g‧‧‧第一閘極端子
13s‧‧‧第一源極端子
23g‧‧‧第二閘極端子
23s‧‧‧第二源極端子
第1圖是可在本發明第一實施方式中使用的電子模組的縱截面圖。
第2圖是可在本發明第一實施方式中使用的電子模組的平面圖。
第3圖（a）是可在本發明第一實施方式中使用的第一連接體的縱截面圖，第3圖（b）是可在本發明第一實施方式中使用的別的第一連接體的縱截面圖。
第4圖是可在本發明第一實施方式中使用的電子模組的縱截面圖，圖中展示的是不同於第1圖的截面。
第5圖是可在本發明第二實施方式中使用的電子模組的斜視圖。
第6圖是可在本發明第二實施方式中使用的電子模組的平面圖。
第7圖是可在本發明第二實施方式中使用的電子模組的側面圖。
第8圖是可在本發明第三實施方式中使用的電子模組的縱截面圖。
第9圖是可在本發明第三實施方式中使用的電子模組的平面圖。
第10圖是可在本發明第四實施方式中使用的電子模組的平面圖。
第11圖是可在本發明第五實施方式中使用的電子模組的縱截面圖。
第12圖是可在本發明第六實施方式中使用的電子模組的縱截面圖。
第13圖是可在本發明第六實施方式中使用的電子模組的平面圖。
第14圖是可在本發明第六實施方式中使用的電子模組的側面圖。

Claims (9)

  1. 一種電子模組，其包括： 第一電子單元，具有第一基板、配置在該第一基板的一側的第一導體層、以及配置在該第一導體層的一側的第一電子元件； 第一連接體，配置在該第一電子元件的一側；以及 第二電子單元，具有配置在的該第一連接體的一側的第二電子元件， 其中，該第一連接體具有第一頭部、從該第一頭部向另一側延伸的第一柱部、以及從該第一頭部延伸的複數個支撐部，該複數個支撐部與該第一導體層抵接，該第一電子元件的一側的面上具有第一端子，該第二電子元件的另一側的面上具有第二端子，該第一連接體將該第一電子元件的該第一端子與該第二電子元件的該第二端子電氣連接，與該支撐部抵接的第一導體層中的至少一個不發揮電氣功能。
  2. 如申請專利範圍第1項所述的電子模組，其中，該第二電子元件的一側上配置有第二連接體，該第二連接體具有複數個延伸部，該延伸部與該支撐部從平面看向相同方向延伸，並且，從平面看不相互重疊。
  3. 如申請專利範圍第1項所述的電子模組，其中，配置有三個以上的該支撐部，與該支撐部抵接的第一導體層中的至少兩個第一導體層不發揮電氣功能，至少一個第一導體層發揮電氣功能。
  4. 如申請專利範圍第1項所述的電子模組，其中，該支撐部從該第一頭部的另一側向該第一基板或該第一導體層直線延伸。
  5. 如申請專利範圍第1項所述的電子模組，其中，該第一頭部從平面看呈矩形，該支撐部對應該第一頭部的三個邊或四個邊配置。
  6. 如申請專利範圍第1項所述的電子模組，其中，從平面看，該第一電子元件從該第一頭部露出。
  7. 如申請專利範圍第1項所述的電子模組，其中，該第二電子元件的一側配置有第二連接體。
  8. 如申請專利範圍第7項所述的電子模組，其中，該第二連接體具有第二頭部、以及從該第二頭部向另一側延伸的第二柱部。
  9. 一種電子模組，其包括： 第一電子單元，具有第一基板、以及配置在該第一基板的一側的第一電子元件； 第一連接體，配置在該第一電子元件的一側；以及 第二電子單元，具有配置在的該第一連接體的一側的第二電子元件， 其中，該第一連接體具有第一頭部、從該第一頭部向另一側延伸的第一柱部、以及從該第一頭部延伸的複數個支撐部，該第一基板為金屬基板，該複數個支撐部與該金屬基板抵接，該第一電子元件的一側的面上具有第一端子，該第二電子元件的另一側的面上具有第二端子，該第一連接體將該第一電子元件的該第一端子與該第二電子元件的該第二端子電氣連接，與該支撐部抵接的金屬基板中的至少一個不發揮電氣功能。
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