JP5214525B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP5214525B2 JP5214525B2 JP2009102270A JP2009102270A JP5214525B2 JP 5214525 B2 JP5214525 B2 JP 5214525B2 JP 2009102270 A JP2009102270 A JP 2009102270A JP 2009102270 A JP2009102270 A JP 2009102270A JP 5214525 B2 JP5214525 B2 JP 5214525B2
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- 239000004065 semiconductor Substances 0.000 title claims description 146
- 239000000758 substrate Substances 0.000 claims description 61
- 229910000679 solder Inorganic materials 0.000 claims description 30
- 239000010410 layer Substances 0.000 description 100
- 239000012535 impurity Substances 0.000 description 23
- 239000011347 resin Substances 0.000 description 14
- 229920005989 resin Polymers 0.000 description 14
- 238000007789 sealing Methods 0.000 description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 13
- 229910052710 silicon Inorganic materials 0.000 description 13
- 239000010703 silicon Substances 0.000 description 13
- 230000005540 biological transmission Effects 0.000 description 12
- 230000008054 signal transmission Effects 0.000 description 11
- 230000000694 effects Effects 0.000 description 7
- 230000008878 coupling Effects 0.000 description 6
- 238000010168 coupling process Methods 0.000 description 6
- 238000005859 coupling reaction Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 229920003209 poly(hydridosilsesquioxane) Polymers 0.000 description 5
- 238000009413 insulation Methods 0.000 description 4
- 230000001939 inductive effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 229920000090 poly(aryl ether) Polymers 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- DYZHZLQEGSYGDH-UHFFFAOYSA-N 7-bicyclo[4.2.0]octa-1,3,5-trienyl-[[7,8-bis(ethenyl)-7-bicyclo[4.2.0]octa-1,3,5-trienyl]oxy]silane Chemical compound C1C2=CC=CC=C2C1[SiH2]OC1(C=C)C2=CC=CC=C2C1C=C DYZHZLQEGSYGDH-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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Description
前記一つまたは二つの半導体チップは、
信号を生成する第1回路と、
前記信号を処理する第2回路と、
前記配線層に形成され、前記第1回路及び前記第2回路の一方に接続された第1インダクタと、
前記配線層の最上層に形成され、前記第1回路及び前記第2回路の他方に接続しているチップ側接続端子と、
を有し、
前記配線基板は、
前記第1インダクタの上方に位置する第2インダクタと、
前記第2インダクタに接続しており、前記チップ側接続端子の上方に位置する基板側接続端子と、
を有し、
前記チップ側接続端子と前記基板側接続端子は、第1ハンダボール又は第1バンプを介して接続している半導体装置が提供される。
図1は、第1の実施形態に係る半導体装置の構成を示す断面図である。この半導体装置は、二つの半導体チップ10,20及び配線基板60を備える。半導体チップ10は多層配線層400を有しており、半導体チップ20は多層配線層500を有している。
図4は、第2の実施形態に係る半導体装置の構成を示す断面図である。この半導体装置は、半導体チップ20と配線基板60の間の空間のうち、平面視において第2インダクタ304と重なる領域724に封止樹脂722が形成されていない点を除いて、第1の実施形態と同様である。なお、領域724は封止樹脂722、配線基板60、及び半導体チップ20によって閉じた空間となっている。このため、封止樹脂722を形成するときの雰囲気が真空のときは、領域724は真空になる。
図5は、第3の実施形態に係る半導体装置の構成を示す断面図である。この半導体装置は、以下に述べる点を除いて第1の実施形態と同様である。まず、配線基板60のうち配線624が形成されている面が、半導体チップ10,20に対向している。そして、第2ダミー接続端子612が、配線624が形成されている面に形成されている。
図6は、第4の実施形態に係る半導体装置の構成を示す断面図である。この半導体装置は、配線基板60において、第2インダクタの中心側の端部と基板側接続端子610の接続構造を除いて、第1の実施形態と同様の構成である。
図7は、第5の実施形態に係る半導体装置の構成を示す平面図である。本図は第1の実施形態における図3に相当している。本実施形態に係る半導体装置は、半導体チップ10と半導体チップ20が双方向で通信する。この半導体装置は、以下に述べる点を除いて、第1〜第3の実施形態のいずれかと同様の構成である。
図8は、第6の実施形態に係る半導体装置の構成を示す平面図である。本図は、第5の実施形態における図7に相当している。本実施形態に係る半導体装置は、第5の実施形態と同様に、第1回路100、第1インダクタ302、第2回路200、2つのチップ側接続端子545、第2インダクタ304、及び2つの基板側接続端子610を2組有している。この半導体装置は、以下に述べる点を除いて、第5の実施形態に係る半導体装置と同様の構成である。
図9は、第7の実施形態に係る半導体装置の構成を示す断面図である。この半導体装置は、半導体チップ10の第1基板102をSOI基板にして、半導体チップ20を半導体チップ10と一体化した点を除いて、第1〜第6の実施形態のいずれかと同様の構成である。なお図9は、第1の実施形態と同様の構成である場合を示している。
(付記1)
配線層を有する一つまたは二つの半導体チップ、及び前記一つまたは二つの半導体チップの配線層側に取り付けられた配線基板を備え、
前記一つまたは二つの半導体チップは、
信号を生成する第1回路と、
前記信号を処理する第2回路と、
前記配線層に形成され、前記第1回路及び前記第2回路の一方に接続された第1インダクタと、
前記配線層の最上層に形成され、前記第1回路及び前記第2回路の他方に接続しているチップ側接続端子と、
を有し、
前記配線基板は、
前記第1インダクタの上方に位置する第2インダクタと、
前記第2インダクタに接続しており、前記チップ側接続端子の上方に位置する基板側接続端子と、
を有し、
前記チップ側接続端子と前記基板側接続端子は、第1ハンダボール又は第1バンプを介して接続している半導体装置。
(付記2)
付記1に記載の半導体装置において、
前記一つまたは二つの半導体チップの前記配線層の最上層に設けられた第1ダミー接続端子と、
前記配線基板に設けられ、前記第1ダミー接続端子の上方に位置する第2ダミー接続端子と、
前記第1ダミー接続端子と前記第2ダミー接続端子は、第2ハンダボール又は第2バンプを介して接続している半導体装置。
(付記3)
付記1又は2に記載の半導体装置において、
前記一つまたは二つの半導体チップと前記配線基板の間の空間を封止する封止樹脂を備え、
前記封止樹脂は、平面視において前記第2インダクタと重なる領域には形成されていない半導体装置。
(付記4)
付記1〜3のいずれか一つに記載の半導体装置において、
前記第2インダクタは、前記配線基板の一面側に形成されており、
前記第2インダクタの中心側の端部は、前記配線基板を貫通する貫通配線、及び前記配線基板の他面側に設けられた配線を介して前記基板側接続端子に接続している半導体装置。
(付記5)
付記1〜3のいずれか一つに記載の半導体装置において、
前記配線基板は多層配線層を有しており、
前記第2インダクタは、前記多層配線層中に形成されており、
前記第2インダクタの中心側の端部は、前記多層配線層のうち前記第2インダクタと異なる層に形成された配線、及びビアを介して前記基板側接続端子に接続している半導体装置。
(付記6)
付記1〜5のいずれか一つに記載の半導体装置において、
前記一つまたは二つの半導体チップに設けられた前記第1回路、前記第1インダクタ、前記第2回路、及び前記2つのチップ側接続端子、並びに前記配線基板に設けられた前記第2インダクタ及び前記基板側接続端子を2組有しており、
前記2組の前記2つのチップ側接続端子と、前記2組の前記基板側接続端子は、それぞれ前記第1ハンダボール又は前記第1バンプを介して接続している半導体装置。
(付記7)
付記6に記載の半導体装置において、
前記一つまたは二つの半導体チップとして、第1の半導体チップ及び第2の半導体チップを有しており、
前記配線基板は、前記第1の半導体チップ上から前記第2の半導体チップ上に渡って取り付けられており、
第1組の前記第1回路及び前記第1インダクタ、並びに第2組の前記第2回路及び前記2つのチップ側接続端子は前記第1の半導体チップに形成されており、
前記第2組の前記第1回路及び前記第1インダクタ、並びに前記第1組の前記第2回路及び前記2つのチップ側接続端子は前記第2の半導体チップに形成されている半導体装置。
(付記8)
付記1〜5のいずれか一つに記載の半導体装置において、
前記一つまたは二つの半導体チップとして、第1の半導体チップ及び第2の半導体チップを有しており、
前記第1回路及び前記第1インダクタは前記第1の半導体チップに形成されており、
前記第2回路は前記第2の半導体チップに形成されており、
前記配線基板は、前記第1の半導体チップ上から前記第2の半導体チップ上に渡って取り付けられている半導体装置。
(付記9)
付記1〜6のいずれか一つに記載の半導体装置において、
前記第1回路、前記第2回路、前記第1インダクタ、及び前記チップ側接続端子は一つの前記半導体チップに形成されており、
前記第1回路及び前記第1インダクタは前記半導体チップの第1領域に形成されており、
前記第2回路及び前記チップ側接続端子は前記半導体チップの第2領域に形成されており、
前記第1領域及び前記第2領域は絶縁されている半導体装置。
12 第1領域
14 第2領域
20 半導体チップ
60 配線基板
100 第1回路
102 第1基板
104 シリコン基板
106 絶縁層
108 シリコン層
109 絶縁分離層
120 ウェル
121 第1トランジスタ
122 不純物領域
124 不純物領域
126 ゲート電極
140 ウェル
141 第1トランジスタ
142 不純物領域
144 不純物領域
146 ゲート電極
200 第2回路
202 第2基板
220 ウェル
221 第2トランジスタ
222 不純物領域
224 不純物領域
226 ゲート電極
240 ウェル
241 第2トランジスタ
242 不純物領域
244 不純物領域
246 ゲート電極
300 信号伝達素子
302 第1インダクタ
304 第2インダクタ
400 多層配線層
410 絶縁層
412 配線層
420 絶縁層
422 配線層
430 絶縁層
432 配線層
440 絶縁層
442 配線層
445 第1ダミー接続端子
500 多層配線層
510 絶縁層
512 配線層
520 絶縁層
522 配線層
530 絶縁層
532 配線層
540 絶縁層
542 配線層
545 チップ側接続端子
602 基板
604 保護層
610 基板側接続端子
612 第2ダミー接続端子
622 貫通配線
624 配線
626 貫通配線
642 プラグ
644 配線
646 プラグ
650 多層配線層
700 第1ハンダボール
702 第2ハンダボール
720 封止樹脂
722 封止樹脂
724 領域
Claims (1)
- 配線層を有する一つまたは二つの半導体チップ、及び前記一つまたは二つの半導体チップの配線層側に取り付けられた配線基板を備え、
前記一つまたは二つの半導体チップは、
信号を生成する第1回路と、
前記信号を処理する第2回路と、
前記配線層に形成され、前記第1回路及び前記第2回路の一方に接続された第1インダクタと、
前記配線層の最上層に形成され、前記第1回路及び前記第2回路の他方に接続しているチップ側接続端子と、
を有し、
前記配線基板は、
前記第1インダクタの上方に位置する第2インダクタと、
前記第2インダクタに接続しており、前記チップ側接続端子の上方に位置する基板側接続端子と、
を有し、
前記チップ側接続端子と前記基板側接続端子は、第1ハンダボール又は第1バンプを介して接続している半導体装置。
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US12/761,628 US8283752B2 (en) | 2009-04-20 | 2010-04-16 | Semiconductor device |
US13/610,543 US8692354B2 (en) | 2009-04-20 | 2012-09-11 | Semiconductor device |
US14/176,193 US8896095B2 (en) | 2009-04-20 | 2014-02-10 | Semiconductor device with circuits connected to each other in contactless manner |
US14/518,024 US9355998B2 (en) | 2009-04-20 | 2014-10-20 | Semiconductor device with circuits connected to each other in contactless manner |
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US20130001742A1 (en) | 2013-01-03 |
US9355998B2 (en) | 2016-05-31 |
US8283752B2 (en) | 2012-10-09 |
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US8896095B2 (en) | 2014-11-25 |
JP2010251662A (ja) | 2010-11-04 |
US20150035116A1 (en) | 2015-02-05 |
US20140151904A1 (en) | 2014-06-05 |
US20100265024A1 (en) | 2010-10-21 |
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