IT1404038B1 - Dispositivo elettronico a semiconduttore provvisto di un elemento isolatore galvanico integrato, e relativo procedimento di assemblaggio - Google Patents

Dispositivo elettronico a semiconduttore provvisto di un elemento isolatore galvanico integrato, e relativo procedimento di assemblaggio

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Publication number
IT1404038B1
IT1404038B1 ITTO2010A001080A ITTO20101080A IT1404038B1 IT 1404038 B1 IT1404038 B1 IT 1404038B1 IT TO2010A001080 A ITTO2010A001080 A IT TO2010A001080A IT TO20101080 A ITTO20101080 A IT TO20101080A IT 1404038 B1 IT1404038 B1 IT 1404038B1
Authority
IT
Italy
Prior art keywords
semiconductor device
device provided
assembly procedure
electronic semiconductor
insulator element
Prior art date
Application number
ITTO2010A001080A
Other languages
English (en)
Inventor
Santo Alessandro Smerzi
Antonello Santangelo
Original Assignee
St Microelectronics Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by St Microelectronics Srl filed Critical St Microelectronics Srl
Priority to ITTO2010A001080A priority Critical patent/IT1404038B1/it
Priority to US13/338,733 priority patent/US8592944B2/en
Publication of ITTO20101080A1 publication Critical patent/ITTO20101080A1/it
Application granted granted Critical
Publication of IT1404038B1 publication Critical patent/IT1404038B1/it

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    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/645—Inductive arrangements
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
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    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
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    • H01L2224/732—Location after the connecting process
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
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    • H01L2924/19104—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device on the semiconductor or solid-state device, i.e. passive-on-chip

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
ITTO2010A001080A 2010-12-29 2010-12-29 Dispositivo elettronico a semiconduttore provvisto di un elemento isolatore galvanico integrato, e relativo procedimento di assemblaggio IT1404038B1 (it)

Priority Applications (2)

Application Number Priority Date Filing Date Title
ITTO2010A001080A IT1404038B1 (it) 2010-12-29 2010-12-29 Dispositivo elettronico a semiconduttore provvisto di un elemento isolatore galvanico integrato, e relativo procedimento di assemblaggio
US13/338,733 US8592944B2 (en) 2010-12-29 2011-12-28 Semiconductor electronic device with an integrated device with an integrated galvanic isolator element and related assembly process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITTO2010A001080A IT1404038B1 (it) 2010-12-29 2010-12-29 Dispositivo elettronico a semiconduttore provvisto di un elemento isolatore galvanico integrato, e relativo procedimento di assemblaggio

Publications (2)

Publication Number Publication Date
ITTO20101080A1 ITTO20101080A1 (it) 2012-06-30
IT1404038B1 true IT1404038B1 (it) 2013-11-08

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ITTO2010A001080A IT1404038B1 (it) 2010-12-29 2010-12-29 Dispositivo elettronico a semiconduttore provvisto di un elemento isolatore galvanico integrato, e relativo procedimento di assemblaggio

Country Status (2)

Country Link
US (1) US8592944B2 (it)
IT (1) IT1404038B1 (it)

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JP6395304B2 (ja) 2013-11-13 2018-09-26 ローム株式会社 半導体装置および半導体モジュール
US9160423B2 (en) 2013-12-12 2015-10-13 Freescale Semiconductor, Inc. Die-to-die inductive communication devices and methods
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