IT1402181B1 - Dispositivo microelettromeccanico elettro-attivo e relativo procedimento di rivelazione - Google Patents

Dispositivo microelettromeccanico elettro-attivo e relativo procedimento di rivelazione

Info

Publication number
IT1402181B1
IT1402181B1 ITTO2010A000748A ITTO20100748A IT1402181B1 IT 1402181 B1 IT1402181 B1 IT 1402181B1 IT TO2010A000748 A ITTO2010A000748 A IT TO2010A000748A IT TO20100748 A ITTO20100748 A IT TO20100748A IT 1402181 B1 IT1402181 B1 IT 1402181B1
Authority
IT
Italy
Prior art keywords
microelettromechanical
electro
active
detection procedure
relative detection
Prior art date
Application number
ITTO2010A000748A
Other languages
English (en)
Inventor
Adriana Passaseo
Vittorio Massimo De
Antonio Qualtieri
Gianmichele Epifani
Francesco Rizzi
Maria Teresa Todaro
Original Assignee
Fond Istituto Italiano Di Tecnologia
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fond Istituto Italiano Di Tecnologia filed Critical Fond Istituto Italiano Di Tecnologia
Priority to ITTO2010A000748A priority Critical patent/IT1402181B1/it
Priority to US13/822,208 priority patent/US20130283922A1/en
Priority to EP11773859.1A priority patent/EP2617074B1/en
Priority to PCT/IB2011/053997 priority patent/WO2012035491A1/en
Publication of ITTO20100748A1 publication Critical patent/ITTO20100748A1/it
Application granted granted Critical
Publication of IT1402181B1 publication Critical patent/IT1402181B1/it

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P5/00—Measuring speed of fluids, e.g. of air stream; Measuring speed of bodies relative to fluids, e.g. of ship, of aircraft
    • G01P5/02—Measuring speed of fluids, e.g. of air stream; Measuring speed of bodies relative to fluids, e.g. of ship, of aircraft by measuring forces exerted by the fluid on solid bodies, e.g. anemometer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
    • G01Q10/00—Scanning or positioning arrangements, i.e. arrangements for actively controlling the movement or position of the probe
    • G01Q10/04—Fine scanning or positioning
    • G01Q10/045—Self-actuating probes, i.e. wherein the actuating means for driving are part of the probe itself, e.g. piezoelectric means on a cantilever probe
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/03—Assembling devices that include piezoelectric or electrostrictive parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2041—Beam type
    • H10N30/2042—Cantilevers, i.e. having one fixed end
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y35/00—Methods or apparatus for measurement or analysis of nanostructures
ITTO2010A000748A 2010-09-13 2010-09-13 Dispositivo microelettromeccanico elettro-attivo e relativo procedimento di rivelazione IT1402181B1 (it)

Priority Applications (4)

Application Number Priority Date Filing Date Title
ITTO2010A000748A IT1402181B1 (it) 2010-09-13 2010-09-13 Dispositivo microelettromeccanico elettro-attivo e relativo procedimento di rivelazione
US13/822,208 US20130283922A1 (en) 2010-09-13 2011-09-13 Electro-active microelectromechanical device and corresponding detection process
EP11773859.1A EP2617074B1 (en) 2010-09-13 2011-09-13 Electro-active microelectromechanical device and corresponding detection process
PCT/IB2011/053997 WO2012035491A1 (en) 2010-09-13 2011-09-13 Electro-active microelectromechanical device and corresponding detection process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITTO2010A000748A IT1402181B1 (it) 2010-09-13 2010-09-13 Dispositivo microelettromeccanico elettro-attivo e relativo procedimento di rivelazione

Publications (2)

Publication Number Publication Date
ITTO20100748A1 ITTO20100748A1 (it) 2012-03-14
IT1402181B1 true IT1402181B1 (it) 2013-08-28

Family

ID=43739139

Family Applications (1)

Application Number Title Priority Date Filing Date
ITTO2010A000748A IT1402181B1 (it) 2010-09-13 2010-09-13 Dispositivo microelettromeccanico elettro-attivo e relativo procedimento di rivelazione

Country Status (4)

Country Link
US (1) US20130283922A1 (it)
EP (1) EP2617074B1 (it)
IT (1) IT1402181B1 (it)
WO (1) WO2012035491A1 (it)

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US20140283604A1 (en) * 2012-10-26 2014-09-25 The Regents Of The University Of Michigan Three-dimensional microelectromechanical systems structure
US9038269B2 (en) * 2013-04-02 2015-05-26 Xerox Corporation Printhead with nanotips for nanoscale printing and manufacturing
US10667410B2 (en) 2013-07-11 2020-05-26 Hsio Technologies, Llc Method of making a fusion bonded circuit structure
US10179728B2 (en) * 2014-07-09 2019-01-15 Emx Advanced Technologies, Llc Micro-bolometer having an adjustable dynamic range
US9755335B2 (en) * 2015-03-18 2017-09-05 Hsio Technologies, Llc Low profile electrical interconnect with fusion bonded contact retention and solder wick reduction
US9761787B2 (en) * 2015-06-02 2017-09-12 The Board Of Trustees Of The University Of Alabama Consensus-based multi-piezoelectric microcantilever sensor
RU2727067C2 (ru) * 2015-08-31 2020-07-17 Конинклейке Филипс Н.В. Преобразователь для преобразования электрического и/или радиационного сигнала в перемещение или наоборот
US10353503B2 (en) 2015-10-29 2019-07-16 Texas Instruments Incorporated Integrated force sensing element
US10782164B2 (en) 2015-11-20 2020-09-22 University Of Virginia Patent Foundation Flexible, self-rolled superficial flow sensor
US10191076B1 (en) * 2015-11-24 2019-01-29 Board Of Trustees Of The University Of Alabama, For And On Behalf Of The University Of Alabama In Huntsville Airflow sensing systems and methods
JP6073512B1 (ja) * 2016-03-10 2017-02-01 株式会社フジクラ 差圧検出素子、流量計測装置、及び、差圧検出素子の製造方法
US11243125B2 (en) 2017-02-09 2022-02-08 Nextinput, Inc. Integrated piezoresistive and piezoelectric fusion force sensor
EP3580539A4 (en) 2017-02-09 2020-11-25 Nextinput, Inc. INTEGRATED DIGITAL FORCE SENSORS AND RELATED METHOD OF MANUFACTURING
WO2019023552A1 (en) * 2017-07-27 2019-01-31 Nextinput, Inc. PIEZORESISTIVE AND PIEZOELECTRIC FORCE SENSOR ON WAFER AND METHODS OF MANUFACTURING THE SAME
WO2019079420A1 (en) 2017-10-17 2019-04-25 Nextinput, Inc. SHIFT TEMPERATURE COEFFICIENT COMPENSATION FOR FORCE SENSOR AND STRAIN GAUGE
US11047874B1 (en) * 2017-10-18 2021-06-29 Government Of The United States As Represented By The Secretary Of The Air Force System, apparatus and method for predicting aerodynamic parameters using artifical hair sensor array
US10952642B2 (en) * 2017-11-09 2021-03-23 Amorepacific Corporation Strain sensor unit and skin sensor module comprising the same
US11874185B2 (en) 2017-11-16 2024-01-16 Nextinput, Inc. Force attenuator for force sensor
US11220422B2 (en) * 2019-03-14 2022-01-11 Taiwan Semiconductor Manufacturing Company Ltd. MEMS device
CN112885729B (zh) * 2019-11-29 2022-12-13 成都辰显光电有限公司 Led测试头、led测试装置及led测试装置的制备方法
US11864465B2 (en) * 2020-05-22 2024-01-02 Wisconsin Alumni Research Foundation Integration of semiconductor membranes with piezoelectric substrates
CN111965384B (zh) * 2020-08-03 2022-08-12 上海交通大学 基于双稳态势能调节的仿生纤毛微传感器及其制备方法
CN112816733A (zh) * 2020-12-31 2021-05-18 上海芯物科技有限公司 一种压电风速计及其制作方法

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Also Published As

Publication number Publication date
ITTO20100748A1 (it) 2012-03-14
WO2012035491A1 (en) 2012-03-22
EP2617074A1 (en) 2013-07-24
US20130283922A1 (en) 2013-10-31
EP2617074B1 (en) 2017-04-26

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