IT1395561B1 - Apparato di collaudo e relativo procedimento - Google Patents

Apparato di collaudo e relativo procedimento

Info

Publication number
IT1395561B1
IT1395561B1 ITUD2009A000146A ITUD20090146A IT1395561B1 IT 1395561 B1 IT1395561 B1 IT 1395561B1 IT UD2009A000146 A ITUD2009A000146 A IT UD2009A000146A IT UD20090146 A ITUD20090146 A IT UD20090146A IT 1395561 B1 IT1395561 B1 IT 1395561B1
Authority
IT
Italy
Prior art keywords
procedure
test system
test
Prior art date
Application number
ITUD2009A000146A
Other languages
English (en)
Inventor
Michele Vazzoler
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to ITUD2009A000146A priority Critical patent/IT1395561B1/it
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to DE202010018093.7U priority patent/DE202010018093U1/de
Priority to EP10752540.4A priority patent/EP2473862B1/en
Priority to CN201410411864.2A priority patent/CN104181449B/zh
Priority to DE202010018086U priority patent/DE202010018086U1/de
Priority to PCT/EP2010/062831 priority patent/WO2011026875A1/en
Priority to TW099129742A priority patent/TWI451103B/zh
Priority to KR1020127008522A priority patent/KR101862245B1/ko
Priority to CN201080039570.1A priority patent/CN102483437B/zh
Priority to TW103126444A priority patent/TWI550290B/zh
Priority to JP2012527310A priority patent/JP2013504050A/ja
Priority to DE202010018088.0U priority patent/DE202010018088U1/de
Priority to US13/394,127 priority patent/US9412898B2/en
Publication of ITUD20090146A1 publication Critical patent/ITUD20090146A1/it
Application granted granted Critical
Publication of IT1395561B1 publication Critical patent/IT1395561B1/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876—Particular processes or apparatus for batch treatment of the devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S50/00—Monitoring or testing of PV systems, e.g. load balancing or fault identification
    • H02S50/10—Testing of PV devices, e.g. of PV modules or single PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
ITUD2009A000146A 2009-09-03 2009-09-03 Apparato di collaudo e relativo procedimento IT1395561B1 (it)

Priority Applications (13)

Application Number Priority Date Filing Date Title
ITUD2009A000146A IT1395561B1 (it) 2009-09-03 2009-09-03 Apparato di collaudo e relativo procedimento
CN201080039570.1A CN102483437B (zh) 2009-09-03 2010-09-02 测试设备与相关方法
CN201410411864.2A CN104181449B (zh) 2009-09-03 2010-09-02 测试设备与相关方法
DE202010018086U DE202010018086U1 (de) 2009-09-03 2010-09-02 Testvorrichtung
PCT/EP2010/062831 WO2011026875A1 (en) 2009-09-03 2010-09-02 Testing apparatus and relative method
TW099129742A TWI451103B (zh) 2009-09-03 2010-09-02 測試設備與相關方法
DE202010018093.7U DE202010018093U1 (de) 2009-09-03 2010-09-02 Testvorrichtung
EP10752540.4A EP2473862B1 (en) 2009-09-03 2010-09-02 Testing apparatus and relative method
TW103126444A TWI550290B (zh) 2009-09-03 2010-09-02 用於電子裝置的測試設備
JP2012527310A JP2013504050A (ja) 2009-09-03 2010-09-02 試験装置および関連方法
DE202010018088.0U DE202010018088U1 (de) 2009-09-03 2010-09-02 Testvorrichtung
US13/394,127 US9412898B2 (en) 2009-09-03 2010-09-02 Apparatus and method of testing a substrate using a supporting nest and testing probes
KR1020127008522A KR101862245B1 (ko) 2009-09-03 2010-09-02 시험 장치 및 관련 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITUD2009A000146A IT1395561B1 (it) 2009-09-03 2009-09-03 Apparato di collaudo e relativo procedimento

Publications (2)

Publication Number Publication Date
ITUD20090146A1 ITUD20090146A1 (it) 2011-03-04
IT1395561B1 true IT1395561B1 (it) 2012-09-28

Family

ID=42355406

Family Applications (1)

Application Number Title Priority Date Filing Date
ITUD2009A000146A IT1395561B1 (it) 2009-09-03 2009-09-03 Apparato di collaudo e relativo procedimento

Country Status (9)

Country Link
US (1) US9412898B2 (it)
EP (1) EP2473862B1 (it)
JP (1) JP2013504050A (it)
KR (1) KR101862245B1 (it)
CN (2) CN104181449B (it)
DE (3) DE202010018086U1 (it)
IT (1) IT1395561B1 (it)
TW (2) TWI550290B (it)
WO (1) WO2011026875A1 (it)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2848164C (en) * 2011-09-05 2018-01-23 Kabushiki Kaisha Nihon Micronics Evaluation apparatus and evaluation method of sheet type cell
ITUD20110166A1 (it) * 2011-10-18 2013-04-19 Applied Materials Italia Srl Dispositivo di test per collaudare piastre per circuiti elettronici e relativo procedimento
CN103063996B (zh) * 2012-12-14 2015-08-05 浙江晶科能源有限公司 一种背接触太阳能电池片测试装置
CN105358991B (zh) * 2013-07-11 2019-03-19 约翰国际有限公司 用于微电路和晶圆级ic测试的测试装置和方法
JP2015049137A (ja) * 2013-09-02 2015-03-16 三菱電機株式会社 半導体チップ試験装置及び方法
US9825585B2 (en) 2013-12-03 2017-11-21 Lg Electronics Inc. Solar cell measuring apparatus
CN103956973A (zh) * 2014-05-20 2014-07-30 常州亿晶光电科技有限公司 一种片状材料耐老化测试用支架
CN112018013A (zh) * 2014-12-02 2020-12-01 应用材料意大利有限公司 在生产太阳能电池基板上印刷的装置及传输该基板的方法
WO2018077423A1 (en) * 2016-10-28 2018-05-03 Applied Materials Italia S.R.L. Apparatus for testing solar cells, system for production of solar cells, and method for controlling an irradiation device for simulating a spectrum of solar radiation
TWI627400B (zh) * 2017-04-11 2018-06-21 Defective rejection method for passive component batch detection and rejection system thereof
CN112014600B (zh) * 2019-05-31 2023-11-24 三赢科技（深圳）有限公司 测试治具及测试机台
CN115485295A (zh) 2020-03-10 2022-12-16 麻省理工学院 NPM1c阳性癌症的免疫疗法的组合物和方法
DE102020114669A1 (de) * 2020-06-02 2021-12-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Elektrische vorrichtung

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4491173A (en) * 1982-05-28 1985-01-01 Temptronic Corporation Rotatable inspection table
US4561541A (en) * 1983-09-26 1985-12-31 Spectrolab, Incorporated Carrier system for photovoltaic cells
US4771234A (en) * 1986-11-20 1988-09-13 Hewlett-Packard Company Vacuum actuated test fixture
JPH073833B2 (ja) 1987-03-30 1995-01-18 東京エレクトロン株式会社 プローブ装置
US4814698A (en) * 1987-10-14 1989-03-21 Everett/Charles Contact Products, Inc. Technique for elimination of static in printed circuit board test fixtures
US4841231A (en) * 1987-10-30 1989-06-20 Unisys Corporation Test probe accessibility method and tool
US5027063A (en) * 1990-04-24 1991-06-25 John Fluke Mfg. Co., Inc. Vacuum-actuated test fixture for testing electronic components
JPH07263526A (ja) * 1994-03-17 1995-10-13 Hitachi Ltd ウェハチャックおよび半導体素子の冷却方法
JPH0829499A (ja) 1994-07-15 1996-02-02 Nec Corp 回路基板の検査装置
US5708222A (en) 1994-08-01 1998-01-13 Tokyo Electron Limited Inspection apparatus, transportation apparatus, and temperature control apparatus
DE4428797C2 (de) * 1994-08-13 1997-04-17 Kommunikations Elektronik Vorrichtung zum Prüfen von Leiterkarten und/oder Flachbaugruppen
JPH08236594A (ja) 1995-02-28 1996-09-13 Hitachi Ltd 半導体装置の検査装置
US5742173A (en) 1995-03-18 1998-04-21 Tokyo Electron Limited Method and apparatus for probe testing substrate
JP3320706B2 (ja) 1999-08-18 2002-09-03 イビデン株式会社 ウエハプローバ、ウエハプローバに使用されるセラミック基板およびウエハプローバ装置
JP3735556B2 (ja) 2001-10-23 2006-01-18 株式会社ルネサステクノロジ 半導体装置の製造方法及び半導体装置
JP4483795B2 (ja) * 2001-12-25 2010-06-16 東京エレクトロン株式会社 受け渡し機構及び処理装置
US6894479B2 (en) * 2002-08-26 2005-05-17 Agilent Technologies, Inc. Connector cable and method for probing vacuum-sealable electronic nodes of an electrical testing device
DE10331565A1 (de) * 2003-05-28 2004-12-30 Osram Opto Semiconductors Gmbh Vorrichtung zum Haltern von Wafern, Messvorrichtung zum Vermessen von Wafern sowie Verfahren zum Vermessen von Wafern
JP2005156317A (ja) 2003-11-25 2005-06-16 Sony Corp 電子部品測定装置及び電子部品測定方法
US7355418B2 (en) * 2004-02-12 2008-04-08 Applied Materials, Inc. Configurable prober for TFT LCD array test
US20060038554A1 (en) * 2004-02-12 2006-02-23 Applied Materials, Inc. Electron beam test system stage
US20060000806A1 (en) * 2004-06-30 2006-01-05 Golzarian Reza M Substrate carrier for surface planarization
DE102004050463B3 (de) * 2004-10-16 2006-04-20 Manz Automation Ag Testsystem für Solarzellen
JP4600655B2 (ja) * 2004-12-15 2010-12-15 セイコーエプソン株式会社 基板保持方法
CN100395879C (zh) * 2005-12-05 2008-06-18 深圳市矽电半导体设备有限公司 一种半导体晶圆片多路测试方法和多路测试探针台
CN101212016A (zh) * 2006-12-31 2008-07-02 中国科学院半导体研究所 一种互补式金属氧化层半导体磁传感器
JP4991495B2 (ja) 2007-11-26 2012-08-01 東京エレクトロン株式会社 検査用保持部材及び検査用保持部材の製造方法
JP5088167B2 (ja) * 2008-02-22 2012-12-05 東京エレクトロン株式会社 プローブ装置、プロービング方法及び記憶媒体
CN201233434Y (zh) 2008-04-14 2009-05-06 无锡市易控系统工程有限公司 全自动晶圆测试平台装置

Also Published As

Publication number Publication date
WO2011026875A1 (en) 2011-03-10
TWI451103B (zh) 2014-09-01
US20120229156A1 (en) 2012-09-13
DE202010018088U1 (de) 2014-01-08
ITUD20090146A1 (it) 2011-03-04
CN102483437A (zh) 2012-05-30
CN104181449B (zh) 2017-08-04
TW201443459A (zh) 2014-11-16
DE202010018093U1 (de) 2014-01-09
KR101862245B1 (ko) 2018-05-29
US9412898B2 (en) 2016-08-09
EP2473862A1 (en) 2012-07-11
CN102483437B (zh) 2015-06-17
KR20120058604A (ko) 2012-06-07
TW201126183A (en) 2011-08-01
JP2013504050A (ja) 2013-02-04
EP2473862B1 (en) 2018-06-20
CN104181449A (zh) 2014-12-03
DE202010018086U1 (de) 2013-12-16
TWI550290B (zh) 2016-09-21

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