BR112012000713A2 - dissipador térmico para um componente eletrônico ou elétrico - Google Patents

dissipador térmico para um componente eletrônico ou elétrico

Info

Publication number
BR112012000713A2
BR112012000713A2 BR112012000713A BR112012000713A BR112012000713A2 BR 112012000713 A2 BR112012000713 A2 BR 112012000713A2 BR 112012000713 A BR112012000713 A BR 112012000713A BR 112012000713 A BR112012000713 A BR 112012000713A BR 112012000713 A2 BR112012000713 A2 BR 112012000713A2
Authority
BR
Brazil
Prior art keywords
electronic
heat sink
electrical component
electrical
component
Prior art date
Application number
BR112012000713A
Other languages
English (en)
Inventor
Verplaetse Daniel
Molle Franz
Konstantatos Nicolas
Original Assignee
Verplaetse Daniel
Konstantatos Nicolas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Verplaetse Daniel, Konstantatos Nicolas filed Critical Verplaetse Daniel
Publication of BR112012000713A2 publication Critical patent/BR112012000713A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/005—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Led Device Packages (AREA)
BR112012000713A 2009-07-14 2010-07-08 dissipador térmico para um componente eletrônico ou elétrico BR112012000713A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
BE2009/0429A BE1018825A3 (fr) 2009-07-14 2009-07-14 Dissipateur thermique pour un composant electronique ou electrique.
PCT/EP2010/059782 WO2011006819A1 (fr) 2009-07-14 2010-07-08 Dissipateur thermique pour un composant electronique ou electrique

Publications (1)

Publication Number Publication Date
BR112012000713A2 true BR112012000713A2 (pt) 2019-09-24

Family

ID=42046420

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112012000713A BR112012000713A2 (pt) 2009-07-14 2010-07-08 dissipador térmico para um componente eletrônico ou elétrico

Country Status (8)

Country Link
US (1) US8848373B2 (pt)
EP (1) EP2454550B1 (pt)
JP (1) JP2012533183A (pt)
CN (1) CN102472600B (pt)
BE (1) BE1018825A3 (pt)
BR (1) BR112012000713A2 (pt)
CA (1) CA2767555A1 (pt)
WO (1) WO2011006819A1 (pt)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102847843A (zh) * 2011-07-01 2013-01-02 善品科技股份有限公司 灯具的散热装置的制造方法
FR2983030B1 (fr) * 2011-11-17 2013-12-27 Valeo Vision Dispositif d'evacuation de chaleur pour systeme electronique
JP6191141B2 (ja) * 2012-01-26 2017-09-06 Ａｐｓジャパン株式会社 照明装置
CN104976525A (zh) * 2014-04-02 2015-10-14 方与圆电子(深圳)有限公司 照明装置及其制造方法
CN106550586B (zh) * 2015-09-18 2021-02-12 西蒙独资有限公司 散热器
KR101618217B1 (ko) * 2015-09-21 2016-05-04 (주)티플러스조명 전자 부품 및 회로 모듈 방열을 위한 히트싱크
JP2017079226A (ja) * 2015-10-19 2017-04-27 富士通株式会社 ヒートシンクおよび電子機器
CN107191796B (zh) * 2017-06-15 2023-09-19 华南理工大学 一种大功率led散热灯及一种非均匀润湿性图案化表面的制备方法
CN107559618A (zh) * 2017-10-23 2018-01-09 德清县大同金属制品有限公司 一种灯泡的铝质散热结构及其生产方法
FR3082003B1 (fr) 2018-05-31 2020-06-05 Continental Automotive France Procede d'appairage d'un module de mesure et de sa roue associee avec filtration de la position angulaire
US10966335B2 (en) 2019-04-29 2021-03-30 Semiconductor Components Industries, Llc Fin frame assemblies
CN111207372A (zh) * 2020-02-28 2020-05-29 红壹佰照明有限公司 一种灯具光源板散热器

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DE3687489T2 (de) * 1985-07-15 1993-04-29 Unisys Corp Allrichtungswaermesenke, die nur niedrige spannungen verursacht, mit gewoelbtem befestigungsteil.
US4899210A (en) * 1988-01-20 1990-02-06 Wakefield Engineering, Inc. Heat sink
US5660461A (en) 1994-12-08 1997-08-26 Quantum Devices, Inc. Arrays of optoelectronic devices and method of making same
JP3431004B2 (ja) * 2000-01-14 2003-07-28 松下電器産業株式会社 ヒートシンクおよびそれを用いた冷却装置
US20010037571A1 (en) * 2000-02-08 2001-11-08 Alex Horng Heat-dissipating device and method for manufacturing a housing of the heat-dissipating device
US6826050B2 (en) 2000-12-27 2004-11-30 Fujitsu Limited Heat sink and electronic device with heat sink
JP2002329821A (ja) * 2001-04-27 2002-11-15 Toshiyuki Arai ヒートシンク
CN1404145A (zh) * 2001-08-31 2003-03-19 郑群耀 传热叶片装置
JP3087902U (ja) * 2002-02-12 2002-08-23 仰霄 陳 コンピュータ冷却装置
US7108055B2 (en) 2002-03-29 2006-09-19 Advanced Energy Technology Inc. Optimized heat sink using high thermal conducting base and low thermal conducting fins
CN2575851Y (zh) * 2002-10-15 2003-09-24 新富国际股份有限公司 具有增加散热面积的散热片
US7153004B2 (en) 2002-12-10 2006-12-26 Galli Robert D Flashlight housing
CA2483571C (en) * 2003-10-01 2013-11-19 Lorne R. Heise Fluid heater
TW200525338A (en) * 2004-01-29 2005-08-01 Asustek Comp Inc Fan fasten device and electrical apparatus thereof
TWM257092U (en) 2004-05-07 2005-02-11 Liang-Fu Huang Skived-fin type heat radiator
WO2006017301A2 (en) 2004-07-13 2006-02-16 Thorrn Micro Technologies, Inc. Micro-channel heat sink
NL1028678C2 (nl) 2005-04-01 2006-10-03 Lemnis Lighting Ip Gmbh Koellichaam, lamp en werkwijze voor het vervaardigen van een koellichaam.
US20070036161A1 (en) 2005-07-13 2007-02-15 Mahamuni Atul B System and method of routing Ethernet MAC frames using Layer-2 MAC addresses
AT503705B1 (de) * 2006-05-16 2008-05-15 Siemens Ag Oesterreich Anordnung zur kühlung von smd-leistungsbauelementen auf einer leiterplatte
US7604380B2 (en) 2006-06-30 2009-10-20 Dialight Corporation Apparatus for using heat pipes in controlling temperature of an LED light unit
KR101799504B1 (ko) 2007-05-02 2017-11-20 필립스 라이팅 홀딩 비.브이. 고체-상태 조명 디바이스
US7595989B2 (en) * 2007-12-12 2009-09-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
TWM358337U (en) * 2008-11-18 2009-06-01 Asia Vital Components Co Ltd Structure of heat sink fin assembly and its radiator and cooling module
US20100154788A1 (en) * 2008-12-19 2010-06-24 Skyline Solar, Inc. Solar receiver
CN101769524B (zh) * 2009-01-06 2012-12-26 富准精密工业(深圳)有限公司 发光二极管灯具及其光引擎

Also Published As

Publication number Publication date
EP2454550B1 (fr) 2013-09-04
BE1018825A3 (fr) 2011-09-06
US8848373B2 (en) 2014-09-30
CA2767555A1 (fr) 2011-01-20
WO2011006819A1 (fr) 2011-01-20
EP2454550A1 (fr) 2012-05-23
US20120113597A1 (en) 2012-05-10
CN102472600B (zh) 2013-10-23
JP2012533183A (ja) 2012-12-20
CN102472600A (zh) 2012-05-23

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2543 DE 01-10-2019 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.