TWI680561B - 電子模組 - Google Patents

電子模組 Download PDF

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Publication number
TWI680561B
TWI680561B TW107117088A TW107117088A TWI680561B TW I680561 B TWI680561 B TW I680561B TW 107117088 A TW107117088 A TW 107117088A TW 107117088 A TW107117088 A TW 107117088A TW I680561 B TWI680561 B TW I680561B
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TW
Taiwan
Prior art keywords
electronic component
substrate
extension
conductor layer
head
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Application number
TW107117088A
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English (en)
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TW201901920A (zh
Inventor
池田康亮
Kosuke Ikeda
松嵜理
Osamu Matsuzaki
Original Assignee
日商新電元工業股份有限公司
Shindengen Electric Manufacturing Co., Ltd.
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Application filed by 日商新電元工業股份有限公司, Shindengen Electric Manufacturing Co., Ltd. filed Critical 日商新電元工業股份有限公司
Publication of TW201901920A publication Critical patent/TW201901920A/zh
Application granted granted Critical
Publication of TWI680561B publication Critical patent/TWI680561B/zh

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Abstract

本發明的電子模組，包括：第一基板(11)；第一導體層(12)，設置在所述第一基板(11)的一側；第一電子元件(13)，設置在所述第一導體層(12)的一側；第一連接體(60)，設置在所述第一電子元件(13)的一側；第二電子元件(23)，設置在所述第一連接體(60)的一側；以及第二連接體(70)，具有：設置在所述第二電子元件(23)的一側的第二頭部(71)、以及從所述第二頭部(71)向另一側延伸的，並且與所述第一基板(11)或所述第一導體層(12)相抵接的延伸部(75)。

Description

電子模組
本發明涉及電子模組。
以往，在封裝樹脂內配置有多個電子元件的電子模組已被普遍認知(例如，參照特開2014-45157號)。這種電子模組被要求實現小型化。
作為實現小型化的手段之一，可以考慮採用將電子元件疊層。當疊層時，可以考慮在電子元件的一側(例如正面側)配置連接體，並在該連接體的一側配置別的電子元件。
像這樣在採用在連接體上配置電子元件的形態的情況下，由於第一電子元件與第二電子元件是相互靠近配置的，因此就容易使熱量集聚，因此還需要提高散熱性。
本發明的目的，是提供一種電子模組，其即便是在將第一電子元件與第二電子元件疊層的情況下，也實現高散熱性。
本發明涉及的電子模組，可以包括：第一基板； 第一導體層，設置在所述第一基板的一側；第一電子元件，設置在所述第一導體層的一側；第二電子元件，設置在所述第一電子元件的一側；以及第二連接體，具有：設置在所述第二電子元件的一側的第二頭部、以及從所述第二頭部向另一側延伸的，並且與所述第一基板或所述第一導體層相抵接的延伸部。
在本發明的電子模組中，可以是：所述第二連接體具有多個延伸部。
在本發明涉及的電子模組中，可以是：所述延伸部具有：從所述第二頭部向面方向延伸的面方向延伸部、以及從所述面方向延伸部向另一側延伸的高度方向延伸部。
在本發明式涉及的電子模組中，可以是：所述延伸部具有在面方向上延伸的延伸基端部。
在本發明涉及的電子模組中，可以進一步包括：第一連接體，設置在所述第一電子元件的一側，所述第二電子元件的另一側，所述第一連接體具有：在一側設置有所述第二電子元件的第一頭部、以及從所述第一頭部向另一側延伸並且與所述第一基板或所述第一導體層相抵接的支撐部。
在本發明涉及的電子模組中，可以是：所述第二連接體具有多個延伸部，所述第一連接體具有多個支撐部。
在本發明涉及的電子模組中，可以是：各延伸部具有面方向延伸部， 各支撐部具有面方向支撐部，從平面看，所述面方向延伸部不與所述面方向支撐部相重合。
本發明涉及的電子模組，可以包括：第一基板；第一電子元件，設置在所述第一基板的一側；第二電子元件，設置在所述第一電子元件的一側；以及第二連接體，具有：設置在所述第二電子元件的一側的第二頭部、以及從所述第二頭部向另一側延伸的，並且與所述第一基板相抵接的延伸部。
作為本發明的一種形態，當採用第二連接體具有：設置在第二電子元件的一側的第二頭部、以及從第二頭部向另一側延伸的，並且與第一基板或第一導體層相抵接的延伸部的情況下，就能夠在高效地將來自於第二電子元件的熱量進行散熱。
11‧‧‧第一基板
12‧‧‧第一導體層
13‧‧‧第一電子元件
13g‧‧‧第一閘極端子
13s‧‧‧第一源極端子
21‧‧‧第二基板
22‧‧‧第二導體層
23‧‧‧第二電子元件
23g‧‧‧第二閘極端子
23s‧‧‧第二源極端子
60‧‧‧第一連接體
61‧‧‧第一頭部
62‧‧‧第一柱部
64‧‧‧第一溝槽部
65(65a、65b、65c)‧‧‧支撐部
69(69a、69b、69c)‧‧‧支撐基端部
70‧‧‧第二連接體
71‧‧‧第二頭部
72‧‧‧第二柱部
75(75a、75b、75c)‧‧‧延伸部
79(79a、79b、79c)‧‧‧延伸基端部
80‧‧‧第三連接體
81‧‧‧第三頭部
82‧‧‧第三柱部
85‧‧‧連接件
90‧‧‧封裝部
165(165a、165b、165c)‧‧‧高度方向支撐部
166(166a、166b、166c)‧‧‧面方向支撐部
175(175a、175b、175c)‧‧‧高度方向延伸部
176(176a、176b、176c)‧‧‧面方向延伸部
第1圖是可在本發明第一實施方式中使用的電子模組的縱截面圖。
第2圖是可在本發明第一實施方式中使用的電子模組的平面圖。
第3a圖是可在本發明第一實施方式中使用的第一連接體的縱截面圖，第3b圖是可在本發明第一實施方式中使用的別的第一連接體的縱截面圖。
第4圖是可在本發明第一實施方式中使用的電子模組的縱截面圖，圖中展示的是不同於第1圖的截面。
第5圖是可在本發明第二實施方式中使用的電子模組的平面圖。
第6圖是可在本發明第二實施方式中使用的電子模組的側面圖。
第7圖是可在本發明第三實施方式中使用的電子模組的斜視圖。
第8圖是可在本發明第三實施方式中使用的電子模組的平面圖。
第9圖是可在本發明第三實施方式中使用的電子模組的側面圖。
第10圖是可在本發明第四實施方式中使用的電子模組的平面圖。
第11圖是可在本發明第五實施方式中使用的電子模組的縱截面圖。
第12圖是可在本發明第五實施方式中使用的在與第11圖不同的方向上進行切割後的電子模組的縱截面圖。
第一實施方式
《構成》
在本實施方式中，“一側”指的是第1圖中的上方側，“另一側”指的是第1圖中的下方側。另外，將第1圖中的上下方向稱為“第一方向”、左右方向稱為“第二方向”、紙面的表裡方向稱為“第三方向”。將包含第二方向以及第三方向的面內方向稱為“面方向”，將從第1圖的上方進行觀看稱為“從平面看”。
本實施方式中的電子模組，可以具有第一電子單元、以及第二電子單元。
如第1圖所示，第一電子單元可以具有：第一基板11、配置在第一基板11的一側的多個第一導體層12、以及配置在第一導體層12的一側的第一 電子元件13。第一電子元件13可以是開關元件，也可以是控制元件。當第一電子元件13是開關元件時，可以為MOSFET。第一電子元件13以及後述的第二電子元件23可以分別由各自的半導體元件構成，作為半導體材料，可以是矽、碳化矽、氮化鎵等。第一電子元件13的另一側的面可以藉由焊錫等導電性接合劑與第一導體層12相連接。
第一電子元件13的一側可以配置有第一連接體60。第一連接體60可以藉由導電性接合劑與第一電子元件13的一側的面相連接。
如第1圖所示，在第一連接體60的一側可以配置有第二電子單元。第二電子單元可以具有配置在第一連接體60的一側的第二電子元件23。另外，第二電子單元還可以具有第二基板21、以及配置在第二基板21的另一側的第二導體層22。第二導體層22的另一側可以配置有第二連接體70。
當配置有第二導體層22的時，與第1圖中所示的形態不同，第二導體層22上可以配置有第二電子元件23。第二連接體70可以藉由焊錫等導電性接合劑與第二電子元件23的一側的面以及第二導體層22的另一側的面相連接。
第二電子元件23可以是開關元件，也可以是控制元件。當第二電子元件23是開關元件時，第一電子元件13可以為MOSFET。
第一連接體60可以具有：第一頭部61、以及從第一頭部61向另一側延伸的第一柱部62。第二連接體70可以具有：第二頭部71、以及從第二頭部71向另一側延伸的第二柱部72。
第一頭部61的界面可以大致呈T字形。本實施方式中的第二連接體70可以具有從第二頭部71向另一側延伸的一個以上的延伸部75，也可以如第1圖所示，具有兩個延伸部75(75a、75b)。在本實施方式中，雖然將採用設置有兩個延伸部75的形態來進行說明，但並不僅限於此，也可以採用後述第二實施方式中使用三個延伸部75的形態，還可以採用使用四個以上延伸部75的形態。
延伸部75可以具有在面方向上延伸的延伸基端部79。當延伸部75具有第一延伸部75a以及第二延伸部75b的情況下，第一延伸部75a具有第一延伸基端部79a，第二延伸部75b具有第二延伸基端部79b。
延伸部75可以各自與第一基板11或第一導體層12向抵接。作為一例，延伸部75可以各自與第一導體層12相抵接。與延伸部75相連接的第一導體層12可以不與別的第一導體層12、第二導體層22、第一電子元件13以及第二電子元件23電連接。
第1圖所示的延伸部75雖然具有向高度方向(第一方向)延伸的高度方向延伸部175(175a、175b)，但其並不具有第二實施方式中說明的，從第二頭部71向面方向延伸額面方向延伸部176。
第二頭部71從平面看可以大致呈矩形。只要具有四條相對的邊就符合本實施方式中的“大致矩形”，其角部可以為直角，也可以為圓弧形。
如第2圖所示，可以在第一頭部61的一側的面上配置第一溝槽部64。第一溝槽部64從平面看可以配置在第一柱部62邊緣的至少一部分上，也可以配置在第一柱部62的整個邊緣上。第一溝槽部64的截面可以如第3b圖所示呈矩形，也可以如第3a圖所示呈矩形呈三角形。當呈三角形時，可以是直角三角形，也可以是二等邊三角形。
在第二頭部71的一側的面上也可以配置第二溝槽部(未圖示)。第二溝槽部從平面看可以配置在第二柱部72邊緣的至少一部分上，也可以配置在第二柱部的整個邊緣上。第二溝槽部的截面可以如第3b圖所示呈矩形，也可以如第3a圖所示呈矩形呈三角形。當呈三角形時，可以是直角三角形，也可以是二等邊三角形。
如第4圖所示，可以在第二電子元件23的一側配置第三連接體80。第三連接體80可以具有第三頭部81、以及從第三頭部81向另一側延伸的第 三柱部82。第三連接體80可以藉由焊錫等導電性接合劑與第二導體層22的另一側的面以及第二電子元件23的一側的面相連接。第4圖為在未設置有延伸部75的部位上進行切割後的縱截面圖，因此未圖示有延伸部75。另外，作為第三連接體80，可以不使用具有第三柱部82且縱截面呈大致T字形的部件，而可以使用一般的連接件85(參照第7圖)。
如第2圖所示，從平面看，第一電子元件13可以採用從第二頭部71向外部露出的形態。當第一電子元件13為MOSFET等開關元件的情況下，可以在一側的面上配置第一閘極端子13g等。同時，當第二電子元件23為MOSFET等開關元件的情況下，可以一側的面上配置第二閘極端子23g等。如第2圖所示，在第一電子元件13的一側的面上具有第一閘極端子13g與第一源極端子13s，在第二電子元件23的一側的面上具有第二閘極端子23g與第二源極端子23s。此情況下，第二連接體70可以藉由焊錫等導電性接合劑與第二電子元件23的第二源極端子23s相連接，第三連接體80可以藉由焊錫等導電性接合劑與第二電子元件23的第二閘極端子23g相連接。另外，第一連接體60可以藉由焊錫等導電性接合劑將第一電子元件13的一源極端子13s與配置在第二電子元件23的另一側的第二漏極端子連接。配置第一電子元件13的另一側的第一漏極端子可以藉由焊錫等導電性接合劑與第一導體層12相連接。第一電子元件13的第一閘極端子13g可以藉由導電性接合劑與第四連接體(例如連接件85)相連接，該第四連接體可以藉由導電性接合劑與第一導體層12相連接。
當第一電子元件13以及第二電子元件23中僅任意一方為開關元件時，可以考慮將載置在第一連接體60上的第二電子元件23作為發熱量較低的控制元件，而將第一電子元件13設為開關元件。反之，也可以考慮將載置在第一連接體60上的第二電子元件23作為開關元件，而將第一電子元件13設為發熱量較低的控制元件。
電子模組可以具有由用於封裝第一電子元件13、第二電子元件23、第一連接體60、第二連接體70、第三連接體80、第一導體層12以及第二導體層22的封裝樹脂等所構成的封裝部90。
第一導體層12可以與端子部(未圖示)相連接，端子部的前端側向封裝部90的外部露出並可與外部裝置相連接。
另外，也可以藉由第一電子元件13、第二電子元件23、第一連接體60、第二連接體70、第三連接體80以及第四連接體來構成芯片模組。此情況下，可以將具有第一電子元件13、第二電子元件23、第一連接體60、第二連接體70、第三連接體80以及第四連接體的芯片模組，在配置在配置有第一導體層12的第一基板11以及配置有第二導體層22的第二基板21之間後，在藉由利用封裝部90來進行封裝，從而來製造電子模組。
作為第一基板11以及第二基板21，可以採用陶瓷基板、絕緣樹脂層等材料。作為導電性接合劑，除了焊錫以外，還可以使用以Ag和Cu為主要成分的材料。作為第一連接體60以及第二連接體70的材料，可以使用Cu等金屬。作為基板11、21，例如可以使用經過將電路圖案化後的金屬基板，此情況下，基板11、21可以兼做導體層12、21來使用。
端子部與導體層12、22之間的接合，不僅可以藉由使用焊錫等導電性接合劑來完成，還可以利用激光焊接、以及超聲波焊接來完成。
《作用‧效果》
接下來，將對由上述結構構成的本實施方式的作用以及效果進行說明。另外，可以將在《作用‧效果》中說明的任何形態適用於上述結構。
當採用本實施方式中的延伸部75的情況下，就能夠在高效地將來自於第二電子元件23的熱量進行散熱，從而實現高散熱效果。
當採用兩個以上的延伸部75的情況下，就能夠藉由第二連接體70實現更高的散熱效果。
藉由採用本實施方式中的形態，就能夠藉由第二連接體70來施加將第二基板21推回一側的反彈力。也就是說，雖然在製造製程中會施加使第一基板11以及第二基板21發生翹曲或變形的力，但藉由使用具有多個延伸部75的第二連接體70，就有助於防止第一基板以及第二基板發生翹曲或變形。
第二連接體70的第二頭部71可以跨越第二電子元件23進行設置。如圖1所示，延伸部75可以具有從第二頭部71的一個邊緣部延伸的第一延伸部75a、以及從別的邊緣部延伸的第二延伸部75b。此情況下，有助於將第二連接體70更加均衡地設置在第一基板11或第一導體層12上。
當延伸部75具有在面方向上延伸的延伸基端部79時，就能夠將第二連接體70更加均衡地設置在第一基板11或第一導體層12上。另外，由於能夠藉由延伸基端部79來增加與第一基板11或第一導體層12之間的接觸面積，因此能夠提升散熱效果。
當採用第二連接體70具有從第二頭部71向另一側延伸的第二柱部72的形態的情況下，就能夠在第二電子元件23的一側留出空間，從而防止來自於第二電子元件23的熱量聚集。同樣的，如第4圖所示，當採用第三連接體80具有從第三頭部81向另一側延伸的第三柱部82的形態的情況下，就能夠在第二電子元件23的一側留出空間，從而防止來自於第二電子元件23的熱量聚集。
如第1圖所示，當採用第一連接體60具有第一柱部62的形態的情況下，就能夠在一定程度上將第一電子元件13與第二電子元件23隔開，從而有助於熱量的逃散。
另外，雖然當第一電子元件13以及第二電子元件23各自為開關元件時容易是熱量聚集，但是當採用多個延伸部75與第一基板11或第一導體層12相抵接的形態的情況下，有助於高效地使這些熱量逃散。
第二實施方式
接下來，對本發明的第二實施方式進行說明。
雖然在第一實施方式中，設置有兩個延伸部75，但在第二實施方式中，如第5圖以及第6圖所示，設置有三個延伸部75(75a-75c)。另外，延伸部75還具有從第二頭部71向面方向延伸的面方向延伸部176(176a-176c)、以及從面方向延伸部176向高度方向(第一方向)延伸的高度方向延伸部175(175a-175c)。關於第二實施方式的其他結構，由於與第一實施方式一樣，因此能夠採用第一實施方式中說明的任何一種形態。另外，將使用在第一實施方式說明中所使用的同一符號來進行說明。
面方向延伸部176是指在寬度方向上比第二頭部71尺寸更小的部分。
如第5圖以及第6圖所示，在本實施方式中，第一延伸部75a具有第一面方向延伸部176a以及第一高度方向延伸部175a，第二延伸部75b具有第二面方向延伸部176b以及第二高度方向延伸部175b，第三延伸部75c具有第三面方向延伸部176c以及第三高度方向延伸部175c。
由於在本實施方式中設置有三個延伸部75，因此相比設置有一個或兩個延伸部75的形態，就能夠實現更高的散熱效果。
另外，藉由採用三個延伸部75，有利於進一步加強或更加平衡地依靠第二連接體70來施加將第二基板21推向一側的反彈力。
第三實施方式
接下來，對本發明的第三實施方式進行說明。
雖然在第一實施方式中，使用了截面大致呈T字形的第一連接體60，但是本實施方式中的第一連接體60如第7圖至第9圖所示，具有第一頭部61、以及從第一頭部61向另一側延伸的三個支撐部65(65a-65c)。支撐部65與第一導體層12或第一基板11相抵接。關於第三實施方式的其他結構，由於與上述各實施方式一樣，因此能夠採用上述實施方式中說明的任何一種形態。另外，將使用在上述各實施方式說明中所使用的同一符號來進行說明。
支撐部65可以各自具有在面方向上延伸的，並且與第一基板11或第一導體層12相抵接的支撐基端部69(69a-69c)。另外，沒有必要在多個支撐部65上各自設置支撐基端部69，可以在多個支撐部65中一部分上設置支撐基端部69，而在其餘的支撐部65上不設置支撐基端部69。
當設置有這樣的支撐基端部69的情況下，就能夠將第一連接體60均衡地配置在第一基板11或第一導體層12上，另外，由於能夠藉由延支撐基端部69來增加與第一基板11或第一導體層12之間的接觸面積，因此能夠提升散熱效果。
支撐部65可以各自與第一基板11或第一導體層12抵接。作為一例，支撐部65可以各自與第一導體層12抵接。當採用與支撐部65相連接的第一導體層12可以不與別的第一導體層12、第二導體層22、第一電子元件13以及第二電子元件23電連接，從而不發揮電氣功能的形態的情況下，有助於防止在支撐部65導通後使第一電子元件13以及第二電子元件23出現預想之外的運作的情況。
第一頭部61從平面看可以大致呈矩形。此情況下，支撐部65可以對應第一頭部61的三個邊進行配置(參照第8圖)。
延伸部75可以具有從第二頭部71向面方向延伸的面方向延伸部176(176a-176c)、以及從面方向延伸部176向高度方向(第一方向)延伸的高 度方向延伸部175(175a-175c)。支撐部65可以具有從第一頭部61向面方向延伸的面方向支撐部166(166a-166c)、以及從面方向支撐部166向高度方向(第一方向)延伸的高度方向支撐部165(165a-165c)。另外，面方向支撐部166指的是在寬度方向上大小比第一頭部61更小的部分。
面方向延伸部176與面方向支撐部166從平面看可以各自不重合。此情況下，有利於縮小其在面方向上的大小。
具體來說，在第7圖至第9圖所示的形態中，配置有第一延伸部75a、第二延伸部75b、以及第三延伸部75c，並且還配置有第一支撐部65a、第二支撐部65b、以及第三支撐部65c。而且，第一延伸部75a具有第一面方向延伸部176a以及第一高度方向延伸部175a，第二延伸部75b具有第二面方向延伸部176b以及第二高度方向延伸部175b，第三延伸部75c具有第三面方向延伸部176c以及第三高度方向延伸部175c。第一支撐部65a具有第一面方向支撐部166a以及第一高度方向支撐部165a，第二支撐部65b具有第二面方向支撐部166b以及第二高度方向支撐部165b，第三支撐部65c具有第三面方向支撐部166c以及第三高度方向支撐部165c。
並且，如第8圖所示，第一面方向延伸部176a從第二頭部71延伸的方向(第8圖中的右方向)與第一面方向支撐部166a從第一頭部61延伸的方向(第8圖中的左方向)從平面看正好相反。另外，雖然第二面方向延伸部176b從第二頭部71延伸的方向(第8圖中的上方向)與第三面方向支撐部166c從第一頭部61延伸的方向(第8圖中的上方向)相同，但它們在面方向即第三方向上是錯開配置的。再有，雖然第三面方向延伸部176c從第二頭部71延伸的方向(第8圖中的下方向)與第二面方向支撐部166b從第一頭部61延伸的方向(第8圖中的下方向)相同，但它們在面方向即第三方向上是錯開配置的。
另外，如第8圖所示，在採用將第一電子元件13以及第二電子元件23在面方向即第三方向上錯開配置的同時，從片面看，第一閘極端子13g等第一端子與第二閘極端子23g等第二端子各自從第二頭部71露出的形態的情況下，有利於確保用於將連接件和導線連接在第一閘極端子13g以及第二閘極端子23g上的空間。藉由採用這種形態，還有利於在完成載置第一連接體60以及第二連接體70的製程後，再將連接件和導線連接在第一閘極端子13g以及第二閘極端子23g上。
藉由支撐部65具有面方向支撐部166，就能夠如圖9所示般，將第一電子元件13以及第二電子元件23在面方向即第三方向上錯開配置，這樣就有利於減少第一電子元件13與第二電子元件23之間的重複發熱區域。
藉由採用設置有三個以上的支撐部65的形態，有利於實現更高的穩定性以及散熱性。但是，又不僅限於次形態，也可以設置有四個支撐部65，還可以如後述的第四實施方式以及第五實施方式般僅使用兩個支撐部65。
藉由將支撐部65的數量設置為三個以下，即便是在採用未設置有面方向支撐部166的形態的情況下，也能夠將第一電子元件13與第二電子元件23相互錯開配置。藉由將第一電子元件13與第二電子元件23相互錯開配置，就能夠抑制因相互的熱量重疊而導致降低散熱效率。
第四實施方式
接下來，對本發明的第四實施方式進行說明。
雖然在第三實施方式中，設置有三個延伸部75和三個支撐部65，但在本實施方式中，設置有兩個延伸部75和兩個支撐部65。關於第四實施方式的其他結構，由於與上述各實施方式一樣，因此能夠採用上述實施方式中說明的任何一種形態。另外，將使用在上述各實施方式說明中所使用的同一符號來進行說明。
在本實施方式中，設置有第一延伸部75a以及第二延伸部75b，並且設置有第一支撐部65a以及第二支撐部65b。第一延伸部75a具有第一面方向延伸部176a以及第一高度方向延伸部175a，第二延伸部75b具有第二面方向延伸部176b以及第二高度方向延伸部175b，第一支撐部65a具有第一面方向支撐部166a以及第一高度方向支撐部165a，第二支撐部65b具有第二面方向支撐部166b以及第二高度方向支撐部165b。
並且，第一面方向延伸部176a從第二頭部71延伸的方向以及第二面方向延伸部176b從第二頭部71延伸的方向(第10圖中的左右方向，即第二方向)，與第一面方向支撐部166a從第一頭部61延伸的方向以及第二面方向支撐部166b從第一頭部61延伸的方向(第10圖中的上下方向，即第三方向)從平面看相互垂直。
藉由採用本實施方式中的形態，有助於在增大延伸部75以及支撐部65的寬度的同時，防止這些部位相互之間產生干擾。藉由增大延伸部75的寬度，還有助於提升延伸部75的散熱性，並且有利於增加延伸部75的穩定性。同樣的，藉由增大支撐部65的寬度，還有助於提升支撐部65的散熱性，並且有利於增加支撐部65的穩定性。
另外，由於支撐部65具有面方向支撐部166，因此即便延伸部75以及支撐部65的寬度變大，也能夠將第一電子元件13與第二電子元件23在面方向上錯開配置，這樣就有利於減少第一電子元件13與第二電子元件23之間的發熱重疊區域。
第五實施方式
接下來，對本發明的第五實施方式進行說明。
雖然在第四實施方式中，第一延伸部75a具有第一面方向延伸部176a以及第一高度方向延伸部175a，第二延伸部75b具有第二面方向延伸部176b 以及第二高度方向延伸部175b，第一支撐部65a具有第一面方向支撐部166a以及第一高度方向支撐部165a，第二支撐部65b具有第二面方向支撐部166b以及第二高度方向支撐部165b。但在本實施方式中，未設置有第一面方向延伸部176a、第二面方向延伸部176b、第一面方向支撐部166a、以及第二面方向支撐部166b，如展示沿第二方向的縱截面的第12圖所示，第一延伸部75a具有第一高度方向延伸部175a，第二延伸部75b具有第二高度方向延伸部175b，如展示沿第三方向的縱截面的第11圖所示，第一支撐部65a具有第一高度方向支撐部165a，第二支撐部65b具有第二高度方向支撐部165b。關於第五實施方式的其他結構，由於與上述各實施方式一樣，因此能夠採用上述實施方式中說明的任何一種形態。另外，將使用在上述各實施方式說明中所使用的同一符號來進行說明。
在本實施方式中，由於未設置有第一面方向延伸部176a、第二面方向延伸部176b、第一面方向支撐部166a、以及第二面方向支撐部166b，因此就能夠減小在面方向上的尺寸。
另外，並不僅限於第四實施方式以及第五實施方式中的形態，也可以採用延伸部75具有面方向延伸部176，而支撐部65不具有面方向支撐部166的形態。反之，也可以採用延伸部75不具有面方向延伸部176，而支撐部65具有面方向支撐部166的形態。
最後，上述各實施方式、變形例中的記載以及圖式中公開的圖示僅為用於說明申請專利範圍中記載的發明的一例，因此申請專利範圍中記載的發明不受上述實施方式或圖式中公開的內容所限定。本申請最初的申請專利範圍中的記載僅僅是一個示例，可以根據說明書、圖式等的記載對申請專利範圍中的記載進行適宜的變更。

Claims (8)

  1. 一種電子模組，其包括：第一基板；第一導體層，設置在該第一基板的一側；第一電子元件，設置在該第一導體層的一側；第二電子元件，設置在該第一基板的一側；以及第二連接體，具有：設置在該第二電子元件的一側的第二頭部、以及從該第二頭部向另一側延伸的，並且與該第一基板或該第一導體層相抵接的複數個延伸部，其中，該第二電子元件的一側的面上具有一側端子，另一側的面上具有另一側端子，該第二連接體在具有從該第二頭部向另一側延伸的第二柱部的同時，該第二柱部與該第二電子元件的該一側端子相連接，與該複數個延伸部中的至少一個相抵接的第一導體層不發揮電氣功能，與該複數個延伸部中的至少一個相抵接的第一導體層發揮電氣功能。
  2. 如申請專利範圍第1項所述的電子模組，其中，配置有三個以上的該延伸部，與該延伸部相抵接的第一導體層中的至少兩個第一導體層不發揮電氣功能，至少一個第一導體層發揮電氣功能。
  3. 如申請專利範圍第1項所述的電子模組，其進一步包括：第一連接體，設置在該第一電子元件的一側，該第二電子元件的另一側，其中，在該第一連接體的另一側設置有一個該第一電子元件，在該第一連接體的一側設置有一個該第二電子元件。
  4. 如申請專利範圍第1項所述的電子模組，其中，該延伸部具有在面方向上延伸的延伸基端部。
  5. 如申請專利範圍第1項所述的電子模組，其進一步包括：第一連接體，設置在該第一電子元件的一側，該第二電子元件的另一側，其中，該第一連接體具有：在一側設置有該第二電子元件的第一頭部、以及從該第一頭部向另一側延伸並且與該第一基板或該第一導體層相抵接的支撐部，該電子模組具有：該第一電子元件、第一閘極端子、第一源極端子以及第一漏極端子。
  6. 如申請專利範圍第5項所述的電子模組，其中：該第二連接體具有複數個延伸部，該第一連接體具有複數個支撐部。
  7. 如申請專利範圍第5項所述的電子模組，其中：各該延伸部具有面方向延伸部，各該支撐部具有面方向支撐部，從平面看，該面方向延伸部不與該面方向支撐部相重合。
  8. 一種電子模組，其包括：第一基板；第一電子元件，設置在該第一基板的一側；第二電子元件，設置在該第一基板的一側；以及第二連接體，具有：設置在該第二電子元件的一側的第二頭部、以及從該第二頭部向另一側延伸的，並且與該第一基板相抵接的複數個延伸部，其中，該第一基板為金屬基板，該第二電子元件的一側的面上具有一側端子，另一側的面上具有另一側端子，該第二連接體在具有從該第二頭部向另一側延伸的第二柱部的同時，該第二柱部與該第二電子元件的該一側端子相連接，與該複數個延伸部中的至少一個相抵接的第一導體層不發揮電氣功能，與該複數個延伸部中的至少一個相抵接的第一導體層發揮電氣功能。
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