WO2018211685A1 - 電子モジュール - Google Patents

電子モジュール Download PDF

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Publication number
WO2018211685A1
WO2018211685A1 PCT/JP2017/018829 JP2017018829W WO2018211685A1 WO 2018211685 A1 WO2018211685 A1 WO 2018211685A1 JP 2017018829 W JP2017018829 W JP 2017018829W WO 2018211685 A1 WO2018211685 A1 WO 2018211685A1
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WO
WIPO (PCT)
Prior art keywords
electronic element
extending
substrate
connection body
electronic
Prior art date
Application number
PCT/JP2017/018829
Other languages
English (en)
French (fr)
Inventor
康亮 池田
理 松嵜
Original Assignee
新電元工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新電元工業株式会社 filed Critical 新電元工業株式会社
Priority to US16/614,316 priority Critical patent/US11276663B2/en
Priority to PCT/JP2017/018829 priority patent/WO2018211685A1/ja
Priority to JP2018538251A priority patent/JP6952042B2/ja
Priority to CN201780090149.5A priority patent/CN110612604A/zh
Priority to NL2020939A priority patent/NL2020939B1/en
Priority to TW107117088A priority patent/TWI680561B/zh
Publication of WO2018211685A1 publication Critical patent/WO2018211685A1/ja

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Definitions

  • the present invention relates to an electronic module.
  • connection body on one side (for example, the front surface side) of the electronic element and provide another electronic element on one side of the connection body.
  • the present invention provides an electronic module that can provide high heat dissipation even when the first electronic element and the second electronic element are stacked.
  • An electronic module comprises: A first substrate; A first conductor layer provided on one side of the first substrate; A first electronic element provided on one side of the first conductor layer; A second electronic element provided on one side of the first electronic element; A second head portion provided on one side of the second electronic element, and a second head portion extending from the second head portion to the other side and contacting the first substrate or the first conductor layer. Connected body, May be provided.
  • the second connection body may have a plurality of extending portions.
  • the extending portion may include a surface extending portion extending in the surface direction from the second head portion and a height extending portion extending from the surface extending portion to the other side.
  • the extension part may have an extension base end part extending in the surface direction.
  • An electronic module comprises: A first connection body provided on one side of the first electronic element and on the other side of the second electronic element;
  • the first connection body includes a first head portion on which the second electronic element is provided on one side, and a support portion that extends from the first head portion to the other side and contacts the first substrate or the first conductor layer. You may have.
  • the second connection body has a plurality of extending portions;
  • the first connection body may have a plurality of support portions.
  • Each extension has a surface extension
  • Each support part has a surface direction support part
  • the planar extension portion may not overlap the planar support portion.
  • An electronic module comprises: A first substrate; A first electronic element provided on one side of the first substrate; A second electronic element provided on one side of the first electronic element; A second connection body having a second head portion provided on one side of the second electronic element, and an extending portion extending from the second head portion to the other side and in contact with the first substrate;
  • the first substrate may be a metal substrate.
  • a second head portion provided on one side of the second electronic element, and an extending portion that extends from the second head portion to the other side and contacts the first substrate or the first conductor layer.
  • FIG. 1 is a longitudinal sectional view of an electronic module that can be used in the first embodiment of the present invention.
  • FIG. 2 is a plan view of an electronic module that can be used in the first embodiment of the present invention.
  • FIG. 3A is a longitudinal sectional view of a first connection body that can be used in the first embodiment of the present invention, and FIG. 3B is used in the first embodiment of the present invention. It is a longitudinal cross-sectional view of another possible first connection body.
  • FIG. 4 is an electronic module that can be used in the first embodiment of the present invention, and is a longitudinal sectional view cut along a cross section different from FIG.
  • FIG. 5 is a plan view of an electronic module that can be used in the second embodiment of the present invention.
  • FIG. 6 is a side view of an electronic module that can be used in the second embodiment of the present invention.
  • FIG. 7 is a perspective view of an electronic module that can be used in the third embodiment of the present invention.
  • FIG. 8 is a plan view of an electronic module that can be used in the third embodiment of the present invention.
  • FIG. 9 is a side view of an electronic module that can be used in the third embodiment of the present invention.
  • FIG. 10 is a plan view of an electronic module that can be used in the fourth embodiment of the present invention.
  • FIG. 11 is a longitudinal sectional view of an electronic module that can be used in the fifth embodiment of the present invention.
  • FIG. 12 is a longitudinal sectional view of an electronic module that can be used in the fifth embodiment of the present invention, and is a longitudinal sectional view cut in a direction different from FIG.
  • first direction the left and right direction
  • second direction the front and back direction of the paper surface
  • third direction An in-plane direction including the second direction and the third direction
  • plane direction when viewed from above in FIG.
  • the electronic module of the present embodiment may have a first electronic unit and a second electronic unit.
  • the first electronic unit is provided on a first substrate 11, a plurality of first conductor layers 12 provided on one side of the first substrate 11, and one side of the first conductor layer 12.
  • the first electronic element 13 may be included.
  • the first electronic element 13 may be a switching element or a control element.
  • the first electronic element 13 may be a MOSFET.
  • Each of the first electronic element 13 and the second electronic element 23 described later may be composed of a semiconductor element, and the semiconductor material may be silicon, silicon carbide, gallium nitride, or the like.
  • the other surface of the first electronic element 13 may be connected to the first conductor layer 12 via a conductive adhesive such as solder.
  • the first connection body 60 may be provided on one side of the first electronic element 13.
  • the first connection body 60 may be connected to one surface of the first electronic element 13 via a conductive adhesive such as solder.
  • a second electronic unit may be provided on one side of the first connection body 60.
  • the second electronic unit may have a second electronic element 23 provided on one side of the first connection body 60.
  • the second electronic unit may include a second substrate 21 and a second conductor layer 22 provided on the other side of the second substrate 21.
  • a second connection body 70 may be provided on the other side of the second conductor layer 22.
  • the second electronic element 23 may be provided on the second conductor layer 22, unlike the embodiment shown in FIG. 1.
  • the second connection body 70 may be connected to one surface of the second electronic element 23 and the other surface of the second conductor layer 22 via a conductive adhesive such as solder.
  • the second electronic element 23 may be a switching element or a control element.
  • the first electronic element 13 may be a MOSFET.
  • the first connection body 60 may include a first head portion 61 and a first column portion 62 extending from the first head portion 61 to the other side.
  • the second connector 70 may include a second head portion 71 and a second column portion 72 extending from the second head portion 71 to the other side.
  • the first connection body 60 may have a substantially T-shaped cross section.
  • the second connection body 70 of the present embodiment may have one or more extending portions 75 extending from the second head portion 71 to the other side, and as shown in FIG. 75a, 75b). Further, in the present embodiment, description will be made using an aspect in which two extending portions 75 are provided, but the present invention is not limited to this, and three extending portions as in a second embodiment to be described later. 75 may be used, and four or more extending portions 75 may be used.
  • the extended portion 75 may have an extended proximal end portion 79 extending in the surface direction.
  • the extension part 75 has the 1st extension part 75a and the 2nd extension part 75b
  • the 1st extension part 75a has the 1st extension base end part 79a
  • the 2nd extension part 75b You may have the 2nd extension base end part 79b.
  • Each of the extending portions 75 may contact the first substrate 11 or the first conductor layer 12. As an example, each of the extending portions 75 may abut on the first conductor layer 12. The first conductor layer 12 connected to the extending portion 75 may not be electrically connected to the other first conductor layer 12, the second conductor layer 22, the first electronic element 13, and the second electronic element 23. Good.
  • the extending portion 75 shown in FIG. 1 has a height extending portion 175 (175a, 175b) extending in the height direction (first direction), as will be described in the second embodiment.
  • the surface extending portion 176 extending in the surface direction from the second head portion 71 is not provided.
  • the second head portion 71 may have a substantially rectangular shape in plan view. If it has four opposing sides, it corresponds to the “substantially rectangular shape” of the present embodiment, and even if it has a right-angled corner or an arc-shaped corner, Corresponds to “shape”.
  • a first groove portion 64 may be provided on one surface of the first head portion 61.
  • the first groove portion 64 may be provided on at least a part of the periphery of the first column portion 62 or may be provided on the entire periphery of the first column portion 62 in plan view.
  • the cross section of the first groove portion 64 may be rectangular as shown in FIG. 3B, or may be triangular as shown in FIG.
  • the triangle shape may be a right triangle or an isosceles triangle.
  • a second groove may also be provided on one surface of the second head portion 71.
  • the second groove portion may be provided on at least a part of the peripheral edge of the second pillar portion 72 in plan view, or may be provided on the entire peripheral edge of the second pillar portion.
  • the cross section of the second groove may also be rectangular as shown in FIG. 3B, or may be triangular as shown in FIG.
  • the triangle shape may be a right triangle or an isosceles triangle.
  • a third connection body 80 may be provided on one side of the second electronic element 23.
  • the third connection body 80 may have a third head portion 81 and a third column portion 82 extending from the third head portion 81 to the other side.
  • the third connector 80 may be connected to the other surface of the second conductor layer 22 and the one surface of the second electronic element 23 via a conductive adhesive such as solder.
  • FIG. 4 is a longitudinal sectional view cut at a location where the extension portion 75 is not provided, and the extension portion 75 is not shown.
  • the vertical cross section which has the 3rd pillar part 82 does not become a substantially T shape, and you may utilize the general connector 85 (refer FIG. 7).
  • the first electronic element 13 may be exposed outward from the second head portion 71 in plan view.
  • the first electronic element 13 is a switching element such as a MOSFET
  • the first gate terminal 13g or the like may be provided on one surface.
  • the second electronic element 23 is a switching element such as a MOSFET
  • a second gate terminal 23g or the like may be provided on one surface.
  • the first electronic element 13 shown in FIG. 2 has a first gate terminal 13g and a first source terminal 13s on one side
  • the second electronic element 23 has a second gate terminal 23g and a first source terminal 13s on one side. Two source terminals 23s are provided.
  • the second connection body 70 is connected to the second source terminal 23s of the second electronic element 23 via a conductive adhesive
  • the third connection body 80 is conductive to the second gate terminal 23g of the second electronic element 23. It may be connected via an adhesive.
  • the 1st connection body 60 may connect the 1st source terminal 13s of the 1st electronic element 13, and the 2nd drain terminal provided in the other side of the 2nd electronic element 23 via a conductive adhesive.
  • the first drain terminal provided on the other side of the first electronic element 13 may be connected to the first conductor layer 12 via a conductive adhesive.
  • the first gate terminal 13g of the first electronic element 13 is connected to a fourth connection body (for example, a connector) via a conductive adhesive, and the fourth connection body is connected to the first conductor layer 12 via the conductive adhesive. May be connected.
  • the second electronic element 23 placed on the first connection body 60 is a control element having low heat generation
  • the electronic element 13 may be a switching element
  • the first electronic element 13 may be a control element having low heat generation
  • the electronic module seals the first electronic element 13, the second electronic element 23, the first connection body 60, the second connection body 70, the third connection body 80, the first conductor layer 12 and the second conductor layer 22.
  • the first conductor layer 12 may be connected to a terminal portion (not shown), and the distal end side of the terminal portion may be exposed to the outside of the sealing portion 90 so that it can be connected to an external device.
  • a chip module may be comprised by the 1st electronic element 13, the 2nd electronic element 23, the 1st connection body 60, the 2nd connection body 70, the 3rd connection body 80, and the 4th connection body.
  • the chip module having the first electronic element 13, the second electronic element 23, the first connection body 60, the second connection body 70, the third connection body 80, and the fourth connection body is connected to the first conductor layer 12.
  • the electronic module may be manufactured by sealing between the first substrate 11 provided with the second substrate 21 provided with the second conductor layer 22 and then sealing with the sealing portion 90.
  • the first substrate 11 and the second substrate 21 a ceramic substrate, an insulating resin layer, or the like can be adopted.
  • a material mainly composed of Ag or Cu can be used.
  • a metal such as Cu can be used.
  • the bonding between the terminal portion and the conductor layers 12 and 22 is not limited to a mode in which a conductive adhesive such as solder is used, but laser welding may be used or ultrasonic bonding may be used.
  • the heat from the second electronic element 23 can be efficiently radiated, and a high heat radiating effect can be realized.
  • a repulsive force that pushes the second substrate 21 back to one side by the second connecting body 70 can be applied. That is, a force is applied to the first substrate 11 and the second substrate 21 to be warped or distorted by the application of heat in the manufacturing process or the like, but by using the second connection body 70 having a plurality of extending portions 75. This is advantageous in that warpage and distortion of the first substrate and the second substrate can be prevented.
  • the second head portion 71 of the second connection body 70 may be provided so as to straddle the second electronic element 23.
  • the extending portion 75 includes a first extending portion 75 a extending from one of the peripheral portions of the second head portion 71, and a second extending portion 75 b extending from another peripheral portion of the head portion. You may have.
  • this mode it is beneficial in that the second connection body 70 can be arranged on the first substrate 11 or the first conductor layer 12 in a more balanced manner.
  • the second connecting body 70 can be disposed on the first substrate 11 or the first conductor layer 12 in a more balanced manner, and the extending portion 75 can be extended. Since the contact area with the 1st board
  • the second connecting body 70 has the second column portion 72 extending from the second head portion 71 to the other side
  • a space can be provided on one side of the second electronic element 23, It is possible to prevent heat generated from the electronic element 23 from being generated.
  • the third connecting body 80 has a third column portion 82 extending from the third head portion 81 to the other side
  • one side of the second electronic element 23 is also used. Thus, it is possible to prevent the heat generated from the second electronic element 23 from being generated.
  • the first connection body 60 adopts an embodiment having the first column portion 62
  • the first electronic element 13 and the second electronic element 23 can be separated to a certain extent, It is beneficial in that it can escape.
  • each of the 1st electronic element 13 and the 2nd electronic element 23 is a switching element, it is easy to heat, but the aspect which the some extension part 75 contact
  • first embodiment two extending portions 75 are provided.
  • second embodiment as shown in FIGS. 5 and 6, three extending portions 75 (75a) are provided.
  • -75c) is provided.
  • the extending portion 75 extends in the surface direction from the second head portion 71 in the surface direction 176 (176a-176c) and extends from the surface direction extending portion 176 in the height direction (first direction).
  • All the aspects demonstrated in 1st Embodiment are employable.
  • the members described in the first embodiment will be described using the same reference numerals.
  • the surface direction extending part 176 means a part where the size in the width direction is smaller than that of the second head part 71.
  • the first extending portion 75a has a first surface direction extending portion 176a and a first height direction extending portion 175a
  • 75b has a second surface direction extending portion 176b and a second height direction extending portion 175b
  • a third extending portion 75c has a third surface direction extending portion 176c and a third height direction extending portion 175c.
  • the first connection body 60 having a substantially T-shaped cross section is used.
  • the first connection body 60 of the present embodiment is One head portion 61 and three support portions 65 (65a-65c) extending from the first head portion 61 to the other side are provided.
  • the support 65 is in contact with the first conductor layer 12 or the first substrate 11.
  • all the aspects demonstrated by said each embodiment are employable.
  • the members described in the above embodiments will be described using the same reference numerals.
  • Each of the support portions 65 may have a support base end portion 69 (69a-69c) that extends in the surface direction and contacts the first substrate 11 or the first conductor layer 12. Further, it is not necessary to provide the support base end portion 69 in each of the plurality of support portions 65, the support base end portion 69 is provided in a part of the plurality of support portions 65, and the support base end portion 69 is provided in the remaining portion. It may not be provided.
  • the first connection body 60 can be arranged on the first substrate 11 or the first conductor layer 12 in a more balanced manner. Since the contact area with the 1st board
  • Each of the support portions 65 may contact the first substrate 11 or the first conductor layer 12. As an example, each of the support portions 65 may abut on the first conductor layer 12.
  • the first conductor layer 12 connected to the support portion 65 is not electrically connected to the other first conductor layer 12, second conductor layer 22, first electronic element 13, and second electronic element 23.
  • the first head portion 61 may have a substantially rectangular shape in plan view.
  • the support part 65 may be provided corresponding to the three sides of the first head part 61 (see FIG. 8).
  • the extending portion 75 includes a surface extending portion 176 (176a-176c) extending in the surface direction from the second head portion 71 and a height extending from the surface extending portion 176 in the height direction (first direction). You may have the direction extension part 175 (175a-175c).
  • the support portion 65 includes a surface direction support portion 166 (166a to 166c) extending in the surface direction from the first head portion 61 and a height direction extending from the surface direction support portion 166 in the height direction (first direction). Support portions 165 (165a to 165c) may be included.
  • the surface direction support part 166 means the part where the magnitude
  • Each of the surface direction extending portion 176 and the surface direction supporting portion 166 may not overlap in plan view. Employing such an aspect is advantageous in that the size in the surface direction can be reduced.
  • a first extending portion 75a, a second extending portion 75b, and a third extending portion 75b are provided, and the first supporting portion 65a and the second supporting portion are provided. 65b and a third support portion 65b are provided.
  • the 1st extension part 75a has the 1st surface direction extension part 176a and the 1st height direction extension part 175a
  • the 2nd extension part 75b has the 2nd surface direction extension part 176b and the 2nd height.
  • the third extending portion 75c has a third surface extending portion 176c and a third height extending portion 175c.
  • the first support portion 65a has a first surface direction support portion 166a and a first height direction support portion 165a
  • the second support portion 65b has a second surface direction support portion 166b and a second height direction support portion 165b
  • the third support portion 65c has a third surface direction support portion 166c and a third height direction support portion 165c.
  • the direction in which the first surface direction extending portion 176a extends from the second head portion 71 (the right direction in FIG. 8) and the direction in which the first surface direction support portion 166a extends from the first head portion 61 are provided.
  • (Left direction in FIG. 8) is opposite to the plan view.
  • the second surface direction extending portion 176b extends from the second head portion 71 (upward direction in FIG. 8) and the third surface direction support portion 166c extends from the first head portion 61 (upward direction in FIG. 8).
  • the third surface direction extending portion 176c extends from the second head portion 71 (downward in FIG. 8) and the second surface direction support portion 166b extends from the first head portion 61 (downward in FIG. 8).
  • the first electronic element 13 and the second electronic element 23 are arranged so as to be shifted in the plane direction, and the first terminal such as the first gate terminal 13g and the second terminal such as the second gate terminal 23g are arranged.
  • a space for connecting a connector or a wire to the first gate terminal 13g and the second gate terminal 23g can be secured.
  • the process of connecting a connector or a wire to the first gate terminal 13g and the second gate terminal 23g can be performed after the first connection body 60 and the second connection body 70 are placed. It is beneficial in that it can be done.
  • the support portion 65 includes the surface direction support portion 166, as shown in FIG. 9, the first electronic element 13 and the second electronic element 23 can be arranged shifted in the third direction of the surface direction, This is advantageous in that the area where the heat generation of the first electronic element 13 and the second electronic element 23 overlaps can be reduced.
  • the present invention is not limited to this, and four or more support portions 65 may be provided. As shown in a fourth embodiment and a fifth embodiment described later, only two support portions 65 are provided. May be used.
  • the 1st electronic element 13 and the 2nd electronic element 23 are used. They can be shifted in plan view. By disposing the first electronic element 13 and the second electronic element 23 in this manner, it is possible to suppress the heat dissipation from being reduced due to the mutual heat overlap.
  • a first extension part 75a and a second extension part 75b are provided, and a first support part 65a and a second support part 65b are provided.
  • the 1st extension part 75a has the 1st surface direction extension part 176a and the 1st height direction extension part 175a
  • the 2nd extension part 75b has the 2nd surface direction extension part 176b and the 2nd height.
  • a longitudinally extending portion 175b is provided.
  • the first support portion 65a has a first surface direction support portion 166a and a first height direction support portion 165a
  • the second support portion 65b has a second surface direction support portion 166b and a second height direction support portion 165b. is doing.
  • a direction in which the first surface direction extending portion 176a extends from the second head portion 71 and a direction in which the second surface direction extending portion 176b extends from the second head portion 71 (the left-right direction in FIG. 10: the second direction);
  • the direction in which the first surface direction support portion 166a extends from the first head portion 61 and the direction in which the second surface direction support portion 166b extends from the first head portion 61 (vertical direction in FIG. 10: the third direction) are orthogonal in a plan view. It has become a direction.
  • the width of the extension part 75 and the width of the support part 65 can be increased while preventing them from interfering with each other.
  • the width of the extending portion 75 in this way, it is beneficial in that the heat dissipation by the extending portion 75 can be improved and the stability of the extending portion 75 can be improved.
  • the width of the support portion 65 it is advantageous in that the heat dissipation by the support portion 65 can be improved and the stability of the support portion 65 can be improved.
  • the support part 65 has the surface direction support part 166, even if the width
  • the first extending portion 75a has a first surface direction extending portion 176a and a first height direction extending portion 175a, and the second extending portion 75b extends in the second surface direction.
  • the support portion 166a and the second surface direction support portion 166b are not provided, and the first extension portion 75a extends in the first height direction as shown in FIG. 12 showing a longitudinal section along the second direction.
  • Part 175a, the second extension part 75b has a second height direction extension part 175b, in the third direction
  • the first support portion 65a has a first height direction support portion 165a
  • the second support portion 65b has a second height direction support portion 165b. It has become.
  • Other configurations are the same as those of the fourth embodiment.
  • all aspects described in the above embodiments can be employed. The members described in the above embodiments will be described using the same reference numerals.
  • the first surface direction extending portion 176a, the second surface direction extending portion 176b, the first surface direction supporting portion 166a, and the second surface direction supporting portion 166b are not provided. Can be reduced in size.
  • the present invention is not limited to the modes of the fourth embodiment and the fifth embodiment, and the extending portion 75 includes the surface direction extending portion 176, but the support portion 65 is the surface direction support portion 166. It may be an aspect not having. On the contrary, although the extension part 75 does not have the surface direction extension part 176, the support part 65 may become the aspect which has the surface direction support part 166.

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Abstract

電子モジュールは、第一基板１１と、前記第一基板１１の一方側に設けられた第一導体層１２と、前記第一導体層１２の一方側に設けられた第一電子素子１３と、前記第一電子素子１３の一方側に設けられた第一接続体６０と、前記第一接続体６０の一方側に設けられた第二電子素子２３と、前記第二電子素子２３の一方側に設けられた第二ヘッド部７１と、前記第二ヘッド部７１から他方側に延び、前記第一基板１１又は前記第一導体層１２と当接する延在部７５とを有する第二接続体７０と、を有する。

Description

電子モジュール
　本発明は、電子モジュールに関する。
　複数の電子素子が封止樹脂内に設けられた電子モジュールが従来から知られている（例えば特開２０１４－４５１５７号参照）。このような電子モジュールに関して小型化することが望まれている。
　小型化する一つの手段として、電子素子を層状に積み重ねていく態様を採用することが考えられる。その際には、電子素子の一方側（例えばおもて面側）に接続体を設け、当該接続体の一方側に別の電子素子を設けることが考えられる。
　このように接続体に電子素子を設ける態様を採用した場合には、第一電子素子と第二電子素子とが近接した位置に位置づけられることから、熱が籠りやすく放熱性を高めることも必要になる。
　本発明は、第一電子素子と第二電子素子とを積層する態様を採用した場合であっても、高い放熱性を提供できる電子モジュールを提供する。
　本発明による電子モジュールは、
　第一基板と、
　前記第一基板の一方側に設けられた第一導体層と、
　前記第一導体層の一方側に設けられた第一電子素子と、       
　前記第一電子素子の一方側に設けられた第二電子素子と、
　前記第二電子素子の一方側に設けられた第二ヘッド部と、前記第二ヘッド部から他方側に延び、前記第一基板又は前記第一導体層と当接する延在部とを有する第二接続体と、
　を備えてもよい。
　本発明による電子モジュールにおいて、
　前記第二接続体は複数の延在部を有してもよい。
　本発明による電子モジュールにおいて、
　前記延在部は、前記第二ヘッド部から面方向に延びた面方向延在部と、前記面方向延在部から他方側に延びた高さ方向延在部とを有してもよい。
　本発明による電子モジュールにおいて、
　前記延在部は、面方向で延びた延在基端部を有してもよい。
　本発明による電子モジュールは、
　前記第一電子素子の一方側であって前記第二電子素子の他方側に設けられた第一接続体をさらに備え、
　前記第一接続体は、前記第二電子素子が一方側に設けられる第一ヘッド部と、前記第一ヘッド部から他方側に延び、前記第一基板又は前記第一導体層と当接する支持部とを有してもよい。
　本発明による電子モジュールにおいて、
　前記第二接続体は複数の延在部を有し、
　前記第一接続体は複数の支持部を有してもよい。
　本発明による電子モジュールにおいて、
　各延在部は面方向延在部を有し、
　各支持部は面方向支持部を有し、
　平面視において、前記面方向延在部は前記面方向支持部と重複しなくてもよい。
　本発明による電子モジュールは、
　第一基板と、
　前記第一基板の一方側に設けられた第一電子素子と、         
　前記第一電子素子の一方側に設けられた第二電子素子と、
　前記第二電子素子の一方側に設けられた第二ヘッド部と、前記第二ヘッド部から他方側に延び、前記第一基板と当接する延在部とを有する第二接続体と、
　を備え、
　前記第一基板が金属基板であってもよい。
　本発明の一態様として、第二電子素子の一方側に設けられた第二ヘッド部と、第二ヘッド部から他方側に延び、第一基板又は第一導体層と当接する延在部とを有する第二接続体が設けられた場合には、第二電子素子からの熱を効率よく放熱することができる。
図１は、本発明の第１の実施の形態で用いられうる電子モジュールの縦断面図である。 図２、本発明の第１の実施の形態で用いられうる電子モジュールの平面図である。 図３（ａ）は、本発明の第１の実施の形態で用いられうる第一接続体の縦断面図であり、図３（ｂ）は、本発明の第１の実施の形態で用いられうる別の第一接続体の縦断面図である。 図４は、本発明の第１の実施の形態で用いられうる電子モジュールであり、図１とは異なる断面で切断した縦断面図である。 図５は、本発明の第２の実施の形態で用いられうる電子モジュールの平面図である。 図６は、本発明の第２の実施の形態で用いられうる電子モジュールの側方図である。 図７は、本発明の第３の実施の形態で用いられうる電子モジュールの斜視図である。 図８は、本発明の第３の実施の形態で用いられうる電子モジュールの平面図である。 図９は、本発明の第３の実施の形態で用いられうる電子モジュールの側方図である。 図１０は、本発明の第４の実施の形態で用いられうる電子モジュールの平面図である。 図１１は、本発明の第５の実施の形態で用いられうる電子モジュールの縦断面図である。 図１２は、本発明の第５の実施の形態で用いられうる電子モジュールの縦断面図であり、図１１とは異なる方向で切断した縦断面図である。
第１の実施の形態
《構成》
　本実施の形態において、「一方側」は図１の上方側を意味し、「他方側」は図１の下方側を意味する。図１の上下方向を「第一方向」と呼び、左右方向を「第二方向」と呼び、紙面の表裏方向を「第三方向」と呼ぶ。第二方向及び第三方向を含む面内方向を「面方向」といい、図１の上方から見た場合には「平面視」という。
　本実施の形態の電子モジュールは、第一電子ユニットと、第二電子ユニットとを有してもよい。
　図１に示すように、第一電子ユニットは、第一基板１１と、第一基板１１の一方側に設けられた複数の第一導体層１２と、第一導体層１２の一方側に設けられた第一電子素子１３と、を有してもよい。第一電子素子１３はスイッチング素子であってもよいし、制御素子であってもよい。第一電子素子１３がスイッチング素子である場合には、第一電子素子１３はＭＯＳＦＥＴであってもよい。第一電子素子１３及び後述する第二電子素子２３の各々は半導体素子から構成されてもよく、半導体材料としてはシリコン、炭化ケイ素、窒化ガリウム等であってもよい。第一電子素子１３の他方側の面は第一導体層１２とはんだ等の導電性接着剤を介して接続されてもよい。
　第一電子素子１３の一方側には第一接続体６０が設けられてもよい。第一接続体６０は第一電子素子１３の一方側の面とはんだ等の導電性接着剤を介して接続されてもよい。
　図１に示すように、第一接続体６０の一方側には第二電子ユニットが設けられてもよい。第二電子ユニットは、第一接続体６０の一方側に設けられた第二電子素子２３を有してもよい。また、第二電子ユニットは、第二基板２１と、第二基板２１の他方側に設けられた第二導体層２２を有してもよい。第二導体層２２の他方側には第二接続体７０が設けられてもよい。
　第二導体層２２が設けられている場合には、図１に示す態様とは異なり、第二導体層２２に第二電子素子２３が設けられてもよい。第二接続体７０は第二電子素子２３の一方側の面及び第二導体層２２の他方側の面とはんだ等の導電性接着剤を介して接続されてもよい。
　第二電子素子２３はスイッチング素子であってもよいし、制御素子であってもよい。第二電子素子２３がスイッチング素子である場合には、第一電子素子１３はＭＯＳＦＥＴであってもよい。
　第一接続体６０は、第一ヘッド部６１と、第一ヘッド部６１から他方側に延びた第一柱部６２を有してもよい。第二接続体７０は、第二ヘッド部７１と、第二ヘッド部７１から他方側に延びた第二柱部７２を有してもよい。
　第一接続体６０は断面が略Ｔ字形状となってもよい。本実施の形態の第二接続体７０は、第二ヘッド部７１から他方側に延びる１つ以上の延在部７５を有してもよく、図１に示すように２つの延在部７５（７５ａ、７５ｂ）を有してもよい。また、本実施の形態では２つの延在部７５が設けられている態様を用いて説明するが、これに限られることはなく、後述する第２の実施の形態のように３つの延在部７５が用いられてもよいし、４つ以上の延在部７５が用いられてもよい。
　延在部７５は面方向で延びた延在基端部７９を有してもよい。延在部７５が第一延在部７５ａ及び第二延在部７５ｂを有する場合には、第一延在部７５ａが第一延在基端部７９ａを有し、第二延在部７５ｂが第二延在基端部７９ｂを有してもよい。
　延在部７５の各々は第一基板１１又は第一導体層１２に当接してもよい。一例として、延在部７５の各々は第一導体層１２に当接してもよい。延在部７５に接続される第一導体層１２は、他の第一導体層１２、第二導体層２２、第一電子素子１３及び第二電子素子２３に電気的に接続されていなくてもよい。
　図１に示す延在部７５は、高さ方向（第一方向）に延びた高さ方向延在部１７５（１７５ａ，１７５ｂ）を有しているが、第２の実施の形態で説明するような、第二ヘッド部７１から面方向に延びた面方向延在部１７６を有していない。
　第ニヘッド部７１は平面視において略矩形状からなってもよい。４つの対向する辺を有していれば本実施の形態の「略矩形状」に該当し、直角な角部を有していても円弧状の角部を有していても、「略矩形状」に該当する。
　図２に示すように、第一ヘッド部６１の一方側の面には第一溝部６４が設けられてもよい。第一溝部６４は、平面視において、第一柱部６２の周縁の少なくとも一部に設けられてもよいし、第一柱部６２の周縁の全部に設けられてもよい。第一溝部６４の断面は、図３（ｂ）で示すように矩形状であってもよいし、図３（ａ）で示すように三角形状であってもよい。三角形状としては、直角三角形であってもよいし、二等辺三角形であってもよい。
　第二ヘッド部７１の一方側の面にも第二溝部（図示せず）が設けられてもよい。第二溝部は、平面視において、第二柱部７２の周縁の少なくとも一部に設けられてもよいし、第二柱部の周縁の全部に設けられてもよい。第二溝部の断面も、図３（ｂ）で示すように矩形状であってもよいし、図３（ａ）で示すように三角形状であってもよい。三角形状としては、直角三角形であってもよいし、二等辺三角形であってもよい。
　図４に示すように、第二電子素子２３の一方側に第三接続体８０が設けられてもよい。この第三接続体８０は、第三ヘッド部８１と、第三ヘッド部８１から他方側に延びた第三柱部８２を有してもよい。第三接続体８０は、はんだ等の導電性接着剤を介して第二導体層２２の他方側の面及び第二電子素子２３の一方側の面に接続されてもよい。なお、図４は延在部７５が設けられていない箇所で切断した縦断面図であり、延在部７５は示されていない。また、第三接続体８０として、第三柱部８２を有する縦断面が略Ｔ字形状となっているものではなく、一般的な接続子８５（図７参照）を利用してもよい。
　図２に示すように、平面視において、第一電子素子１３は、第二ヘッド部７１から外方に露出する態様となってもよい。第一電子素子１３がＭＯＳＦＥＴ等のスイッチング素子である場合には、一方側の面に第一ゲート端子１３ｇ等が設けられてもよい。同様に、第二電子素子２３がＭＯＳＦＥＴ等のスイッチング素子である場合には、一方側の面に第二ゲート端子２３ｇ等が設けられてもよい。図２に示す第一電子素子１３は、一方側の面に第一ゲート端子１３ｇと第一ソース端子１３ｓを有し、第二電子素子２３は、一方側の面に第二ゲート端子２３ｇと第二ソース端子２３ｓを有している。この場合、第二接続体７０が第二電子素子２３の第二ソース端子２３ｓに導電性接着剤を介して接続され、第三接続体８０が第二電子素子２３の第二ゲート端子２３ｇに導電性接着剤を介して接続されてもよい。また、第一接続体６０は第一電子素子１３の第一ソース端子１３ｓと第二電子素子２３の他方側に設けられた第二ドレイン端子とを導電性接着剤を介して接続してもよい。第一電子素子１３の他方側に設けられた第一ドレイン端子は導電性接着剤を介して第一導体層１２に接続されてもよい。第一電子素子１３の第一ゲート端子１３ｇは導電性接着剤を介して第四接続体（例えば接続子）に接続され、当該第四接続体は導電性接着剤を介して第一導体層１２に接続されてもよい。
　第一電子素子１３及び第二電子素子２３のいずれか一方だけがスイッチング素子の場合には、第一接続体６０に載置される第二電子素子２３を発熱性の低い制御素子とし、第一電子素子１３をスイッチング素子にすることも考えられる。逆に、第一接続体６０に載置される第二電子素子２３をスイッチング素子とし、第一電子素子１３を発熱性の低い制御素子にすることも考えられる。
　電子モジュールは、第一電子素子１３、第二電子素子２３、第一接続体６０、第二接続体７０、第三接続体８０、第一導体層１２及び第二導体層２２を封止する封止樹脂等から構成される封止部９０を有してもよい。
　第一導体層１２は端子部（図示せず）と接続されてもよく、端子部の先端側は封止部９０の外方に露出して、外部装置と接続可能となってもよい。
　また、第一電子素子１３、第二電子素子２３、第一接続体６０、第二接続体７０、第三接続体８０及び第四接続体によってチップモジュールが構成されてもよい。この場合には、第一電子素子１３、第二電子素子２３、第一接続体６０、第二接続体７０、第三接続体８０及び第四接続体を有するチップモジュールを、第一導体層１２が設けられた第一基板１１及び第二導体層２２が設けられた第二基板２１の間に配置した後で封止部９０によって封止することで、電子モジュールが製造されてもよい。
　第一基板１１及び第二基板２１としては、セラミック基板、絶縁樹脂層等を採用することができる。導電性接着剤としては、はんだの他、ＡｇやＣｕを主成分とする材料を用いることもできる。第一接続体６０及び第二接続体７０の材料としてはＣｕ等の金属を用いることができる。なお、基板１１，２１としては例えば回路パターニングを施した金属基板を用いることもでき、この場合には、基板１１，２１が導体層１２，２２を兼ねることになる。
　端子部と導体層１２，２２との接合は、はんだ等の導電性接着剤を利用する態様だけではなく、レーザ溶接を利用してもよいし、超音波接合を利用してもよい。
《作用・効果》
　次に、上述した構成からなる本実施の形態による作用・効果の一例について説明する。なお、「作用・効果」で説明するあらゆる態様を、上記構成で採用することができる。
　本実施の形態のような延在部７５を採用する場合には、第二電子素子２３からの熱を効率よく放熱することができ、高い放熱効果を実現できる。
　２つ以上の延在部７５が設けられている態様を採用した場合には、第二接続体７０によってさらに高い放熱効果を実現できる。
　本実施の形態の態様を採用することで、第二接続体７０により第二基板２１を一方側に押し返す反発力を付与できるようになる。つまり、製造工程等で熱が加わることで第一基板１１及び第二基板２１が反ったり歪んだりしようとする力が加わるが、複数の延在部７５を有する第二接続体７０を用いることで第一基板及び第二基板の反りや歪みを防止できる点で有益である。
　第二接続体７０の第二ヘッド部７１は第二電子素子２３を跨ぐようにして設けられてもよい。図１に示すように、延在部７５は、第二ヘッド部７１の周縁部の一つから延びる第一延在部７５ａと、ヘッド部の別の周縁部から延びる第二延在部７５ｂとを有してもよい。この態様を採用した場合には、第二接続体７０をよりバランスよく、第一基板１１又は第一導体層１２に配置することができる点で有益である。
　延在部７５が面方向で延びた延在基端部７９を有する場合には、第二接続体７０をよりバランスよく第一基板１１又は第一導体層１２に配置することができ、また延在基端部７９で第一基板１１又は第一導体層１２との接触面積を増やすことができることから、放熱効果を高めることできる。
　第二接続体７０が第二ヘッド部７１から他方側に延びた第二柱部７２を有する態様を採用した場合には、第二電子素子２３の一方側に空間を設けることができ、第二電子素子２３から発生する熱が籠ることを防止できる。同様に、図４に示すように、第三接続体８０が第三ヘッド部８１から他方側に延びた第三柱部８２を有する態様を採用した場合にも、第二電子素子２３の一方側に空間を設けることができ、第二電子素子２３から発生する熱が籠ることを防止できる。
　図１に示すように、第一接続体６０が第一柱部６２を有する態様を採用した場合には、第一電子素子１３と第二電子素子２３とを一定程度離間させることができ、熱を逃がすことができる点で有益である。
　なお、第一電子素子１３及び第二電子素子２３の各々がスイッチング素子である場合には熱が籠りやすいが、複数の延在部７５が第一基板１１又は第一導体層１２に当接する態様を採用した場合には、当該熱を効率よく逃がすことができる点で有益である。
第２の実施の形態
　次に、本発明の第２の実施の形態について説明する。
　第１の実施の形態では延在部７５が２つ設けられている態様であったが、第２の実施の形態では、図５及び図６に示すように、３つの延在部７５（７５ａ－７５ｃ）が設けられている態様となっている。また、延在部７５は、第二ヘッド部７１から面方向に延びた面方向延在部１７６（１７６ａ－１７６ｃ）と、面方向延在部１７６から高さ方向（第一方向）に延びた高さ方向延在部１７５（１７５ａ－１７５ｃ）とを有している。その他の構成については、第１の実施の形態と同様であり、第１の実施の形態で説明したあらゆる態様を採用することができる。第１の実施の形態で説明した部材については同じ符号を用いて説明する。
　なお、面方向延在部１７６は、第二ヘッド部７１よりも幅方向の大きさが小さくなっている部分のことを意味している。
　図５及び図６に示すように、本実施の形態では、第一延在部７５ａが第一面方向延在部１７６ａ及び第一高さ方向延在部１７５ａを有し、第二延在部７５ｂが第二面方向延在部１７６ｂ及び第二高さ方向延在部１７５ｂを有し、第三延在部７５ｃが第三面方向延在部１７６ｃ及び第三高さ方向延在部１７５ｃを有している。
　本実施の形態では３つの延在部７５が設けられていることから、１つ又は２つの延在部７５が設けられている態様と比較してより高い放熱効果を実現できる。
　また、３つの延在部７５を採用することで、第二接続体７０により第二基板２１を一方側に押し返す反発力をより強くまたよりバランスよく作用させることができる点で有益である。
第３の実施の形態
　次に、本発明の第３の実施の形態について説明する。
　第１の実施の形態では、断面が略Ｔ字形状の第一接続体６０が用いられていたが、本実施の形態の第一接続体６０は、図７乃至図９に示すように、第一ヘッド部６１と、第一ヘッド部６１から他方側に延びた３つの支持部６５（６５ａ―６５ｃ）とを有している。支持体６５は、第一導体層１２又は第一基板１１に当接するようになっている。その他の構成については、上記各実施の形態で説明したあらゆる態様を採用することができる。上記各実施の形態で説明した部材については同じ符号を用いて説明する。
　支持部６５の各々は、面方向で延び、第一基板１１又は第一導体層１２と当接する支持基端部６９（６９ａ―６９ｃ）を有してもよい。また、複数の支持部６５の各々に支持基端部６９が設けられる必要はなく、複数の支持部６５のうちの一部に支持基端部６９が設けられ、残部に支持基端部６９が設けられないようにしてもよい。
　このような支持基端部６９が設けられている場合には、第一接続体６０をよりバランスよく第一基板１１又は第一導体層１２に配置することができ、また支持基端部６９で第一基板１１又は第一導体層１２との接触面積を増やすことができることから、放熱効果を高めることできる。
　支持部６５の各々は第一基板１１又は第一導体層１２に当接してもよい。一例として、支持部６５の各々は第一導体層１２に当接してもよい。支持部６５に接続される第一導体層１２が他の第一導体層１２、第二導体層２２、第一電子素子１３及び第二電子素子２３に電気的に接続されておらず電気的な機能を果たさない態様を採用した場合には、支持部６５が導通して予想していない挙動を第一電子素子１３及び第二電子素子２３が示すことを防止できる点で有益である。
　第一ヘッド部６１は平面視において略矩形状からなってもよい。この場合には、支持部６５は第一ヘッド部６１の３辺に対応して設けられてもよい（図８参照）。
　延在部７５は、第二ヘッド部７１から面方向に延びた面方向延在部１７６（１７６ａ―１７６ｃ）と、面方向延在部１７６から高さ方向（第一方向）に延びた高さ方向延在部１７５（１７５ａ―１７５ｃ）とを有してもよい。また、支持部６５は、第一ヘッド部６１から面方向に延びた面方向支持部１６６（１６６ａ―１６６ｃ）と、面方向支持部１６６から高さ方向（第一方向）に延びた高さ方向支持部１６５（１６５ａ―１６５ｃ）とを有してもよい。なお、面方向支持部１６６は、第一ヘッド部６１よりも幅方向の大きさが小さくなっている部分のことを意味している。
　面方向延在部１７６と面方向支持部１６６の各々は平面視において重複しないようにしてもよい。このような態様を採用した場合には、面方向における大きさを小さくすることができる点で有益である。
　より具体的には、図７乃至図９に示す態様では、第一延在部７５ａ、第二延在部７５ｂ及び第三延在部７５ｂが設けられ、第一支持部６５ａ、第二支持部６５ｂ及び第三支持部６５ｂが設けられている。そして、第一延在部７５ａが第一面方向延在部１７６ａ及び第一高さ方向延在部１７５ａを有し、第二延在部７５ｂが第二面方向延在部１７６ｂ及び第二高さ方向延在部１７５ｂを有し、第三延在部７５ｃが第三面方向延在部１７６ｃ及び第三高さ方向延在部１７５ｃを有している。第一支持部６５ａが第一面方向支持部１６６ａ及び第一高さ方向支持部１６５ａを有し、第二支持部６５ｂが第二面方向支持部１６６ｂ及び第二高さ方向支持部１６５ｂを有し、第三支持部６５ｃが第三面方向支持部１６６ｃ及び第三高さ方向支持部１６５ｃを有している。
　そして、図８に示すように、第一面方向延在部１７６ａが第二ヘッド部７１から延びる方向（図８の右方向）と第一面方向支持部１６６ａが第一ヘッド部６１から延びる方向（図８の左方向）とは平面視において逆方向となっている。また、第二面方向延在部１７６ｂが第二ヘッド部７１から延びる方向（図８の上方向）と第三面方向支持部１６６ｃが第一ヘッド部６１から延びる方向（図８の上方向）は同じ方向であるが、これらは面方向の第三方向においてずれて配置されている。また、第三面方向延在部１７６ｃが第二ヘッド部７１から延びる方向（図８の下方向）と第二面方向支持部１６６ｂが第一ヘッド部６１から延びる方向（図８の下方向）は同じ方向であるが、これらも面方向の第三方向においてずれて配置されている。
　また、図８に示すように、第一電子素子１３及び第二電子素子２３が面方向でずれて配置されるとともに、第一ゲート端子１３ｇ等の第一端子と第二ゲート端子２３ｇ等の第二端子の各々が平面視において第二ヘッド部７１から露出される態様を採用した場合には、第一ゲート端子１３ｇ及び第二ゲート端子２３ｇに接続子やワイヤを接続させるためのスペースを確保できる点で有益である。またこの態様によれば、第一ゲート端子１３ｇ及び第二ゲート端子２３ｇに接続子やワイヤを接続させる工程を、第一接続体６０及び第二接続体７０が載置された後で行うこともできるようになる点で有益である。
　また、支持部６５が面方向支持部１６６を有することで、図９に示すように、第一電子素子１３及び第二電子素子２３を面方向の第三方向でずれて配置することができ、第一電子素子１３と第二電子素子２３との発熱が重複する領域を低減することができる点で有益である。
　支持部６５が３つ以上設けられている態様を採用することで、より高い安定性及び放熱性を実現できる点で有益である。但し、これに限られることはなく、支持部６５は４つ以上設けられてもよいし、後述する第４の実施の形態及び第５の実施の形態で示すように支持部６５が２つだけ用いられてもよい。
　なお、支持部６５の数を３つ以下とすることで、仮に面方向支持部１６６が設けられていない態様を採用した場合であっても、第一電子素子１３と第二電子素子２３とを平面視においてずらして配置することができる。このように第一電子素子１３と第二電子素子２３とをずらして配置することで、互いの熱が重複して放熱効率が下がってしまうことを抑制できる。
第４の実施の形態
　次に、本発明の第４の実施の形態について説明する。
　第３の実施の形態では、３つの延在部７５が設けられ、３つの支持部６５が設けられている態様であったが、本実施の形態では、２つの延在部７５が設けられ、２つの支持部６５が設けられている。その他の構成については、上記各実施の形態で説明したあらゆる態様を採用することができる。上記各実施の形態で説明した部材については同じ符号を用いて説明する。
　本実施の形態では、第一延在部７５ａ及び第二延在部７５ｂが設けられ、第一支持部６５ａ及び第二支持部６５ｂが設けられている。そして、第一延在部７５ａが第一面方向延在部１７６ａ及び第一高さ方向延在部１７５ａを有し、第二延在部７５ｂが第二面方向延在部１７６ｂ及び第二高さ方向延在部１７５ｂを有している。第一支持部６５ａが第一面方向支持部１６６ａ及び第一高さ方向支持部１６５ａを有し、第二支持部６５ｂが第二面方向支持部１６６ｂ及び第二高さ方向支持部１６５ｂを有している。
　そして、第一面方向延在部１７６ａが第二ヘッド部７１から延びる方向及び第二面方向延在部１７６ｂが第二ヘッド部７１から延びる方向（図１０の左右方向：第二方向）と、第一面方向支持部１６６ａが第一ヘッド部６１から延びる方向及び第二面方向支持部１６６ｂが第一ヘッド部６１から延びる方向（図１０の上下方向：第三方向）とは平面視において直交する方向となっている。
　本実施の形態の態様を採用すれば、延在部７５の幅及び支持部６５の幅を太くしつつ、これらが互いに邪魔しあうことを防止できる点で有益である。なお、このように延在部７５の幅を太くすることで、延在部７５による放熱性を向上させることができ、かつ延在部７５の安定性を向上さえることができる点で有益である。同様に、支持部６５の幅を太くすることで、支持部６５による放熱性を向上させることができ、かつ支持部６５の安定性を向上さえることができる点で有益である。
　また、支持部６５が面方向支持部１６６を有することから、延在部７５の幅及び支持部６５の幅が太くなっても、第一電子素子１３と第二電子素子２３を面方向でずらして配置することができ、第一電子素子１３と第二電子素子２３との発熱が重複する領域を低減することができる点で有益である。
第５の実施の形態
　次に、本発明の第５の実施の形態について説明する。
　第４の実施の形態では、第一延在部７５ａが第一面方向延在部１７６ａ及び第一高さ方向延在部１７５ａを有し、第二延在部７５ｂが第二面方向延在部１７６ｂ及び第二高さ方向延在部１７５ｂを有し、第一支持部６５ａが第一面方向支持部１６６ａ及び第一高さ方向支持部１６５ａを有し、第二支持部６５ｂが第二面方向支持部１６６ｂ及び第二高さ方向支持部１６５ｂを有する態様であったが、本実施の形態では、第一面方向延在部１７６ａ、第二面方向延在部１７６ｂ、第一面方向支持部１６６ａ及び第二面方向支持部１６６ｂは設けられておらず、第二方向に沿った縦断面を示した図１２に示すように、第一延在部７５ａが第一高さ方向延在部１７５ａを有し、第二延在部７５ｂが第二高さ方向延在部１７５ｂを有し、第三方向に沿った縦断面を示した図１１に示すように、第一支持部６５ａが第一高さ方向支持部１６５ａを有し、第二支持部６５ｂが第二高さ方向支持部１６５ｂを有する態様となっている。その他の構成は第４の実施の形態と同様である。また、上記各実施の形態で説明したあらゆる態様を採用することができる。上記各実施の形態で説明した部材については同じ符号を用いて説明する。
　本実施の形態では、第一面方向延在部１７６ａ、第二面方向延在部１７６ｂ、第一面方向支持部１６６ａ及び第二面方向支持部１６６ｂが設けられていないことから、面方向での大きさを小さくすることができる。
　なお、第４の実施の形態及び第５の実施の形態のような態様に限られることはなく、延在部７５は面方向延在部１７６を有するが、支持部６５は面方向支持部１６６を有さない態様となっていてもよい。逆に、延在部７５は面方向延在部１７６を有さないが、支持部６５は面方向支持部１６６を有する態様となっていてもよい。
　上述した各実施の形態の記載及び図面の開示は、請求の範囲に記載された発明を説明するための一例に過ぎず、上述した実施の形態の記載又は図面の開示によって請求の範囲に記載された発明が限定されることはない。また、出願当初の請求項の記載はあくまでも一例であり、明細書、図面等の記載に基づき、請求項の記載を適宜変更することもできる。
１１　　　　第一基板
１２　　　　第一導体層
１３　　　　第一電子素子
２３　　　　第二電子素子
６０　　　　第一接続体
６１　　　　第一ヘッド部
６５　　　　支持部
７０　　　　第二接続体
７１　　　　第二ヘッド部
７５　　　　延在部
７９　　　　延在基端部
１６５　　　高さ方向支持部
１６６　　　面方向支持部
１７５　　　高さ方向延在部
１７６　　　面方向延在部

Claims (8)

  1. 　第一基板と、
    　前記第一基板の一方側に設けられた第一導体層と、
    　前記第一導体層の一方側に設けられた第一電子素子と、       
    　前記第一電子素子の一方側に設けられた第二電子素子と、
    　前記第二電子素子の一方側に設けられた第二ヘッド部と、前記第二ヘッド部から他方側に延び、前記第一基板又は前記第一導体層と当接する延在部とを有する第二接続体と、
    　を備えることを特徴とする電子モジュール。
  2. 　前記第二接続体は複数の延在部を有することを特徴とする請求項１に記載の電子モジュール。
  3. 　前記延在部は、前記第二ヘッド部から面方向に延びた面方向延在部と、前記面方向延在部から他方側に延びた高さ方向延在部とを有することを特徴とする請求項１又は２のいずれかに記載の電子モジュール。
  4. 　前記延在部は、面方向で延びた延在基端部を有することを特徴とする請求項１乃至３のいずれか１項に記載の電子モジュール。
  5. 　前記第一電子素子の一方側であって前記第二電子素子の他方側に設けられた第一接続体をさらに備え、
    　前記第一接続体は、前記第二電子素子が一方側に設けられる第一ヘッド部と、前記第一ヘッド部から他方側に延び、前記第一基板又は前記第一導体層と当接する支持部とを有することを特徴とする請求項１乃至４のいずれか１項に記載の電子モジュール。
  6. 　前記第二接続体は複数の延在部を有し、
    　前記第一接続体は複数の支持部を有することを特徴とする請求項５に記載の電子モジュール。
  7. 　各延在部は面方向延在部を有し、
    　各支持部は面方向支持部を有し、
    　平面視において、前記面方向延在部は前記面方向支持部と重複しないことを特徴とする請求項５又は６のいずれかに記載の電子モジュール。
  8. 　第一基板と、
    　前記第一基板の一方側に設けられた第一電子素子と、         
    　前記第一電子素子の一方側に設けられた第二電子素子と、
    　前記第二電子素子の一方側に設けられた第二ヘッド部と、前記第二ヘッド部から他方側に延び、前記第一基板と当接する延在部とを有する第二接続体と、
    　を備え、
    　前記第一基板は金属基板であることを特徴とする電子モジュール。
PCT/JP2017/018829 2017-05-19 2017-05-19 電子モジュール WO2018211685A1 (ja)

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