JP5845634B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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Description
この特許文献1に開示された半導体装置においては、素子搭載部材の下面に絶縁シートが接合されている。絶縁シートは、封止体を形成する合成樹脂材料よりも熱伝動性の大きい樹脂材料を基材として形成されており、半導体素子の下方における絶縁性を維持しながら熱抵抗を低減させている。
特許文献1に開示された絶縁シートは、半導体装置の製造工程の初期段階において、その硬度が十分ではなく作業性が悪いという問題がある。また、樹脂封止後の外力によって、絶縁シートに割れやかけが発生し、絶縁が不十分となることも考えられた。
上述した金属シートは、これらの問題を解決するための構成である。すなわち、絶縁シートの下面に金属シートを接合させ、製造時の作業性を向上させるとともに、絶縁シートに発生する割れやかけを低減している。さらに、金属シートによって、半導体素子の下方における熱抵抗の低減をある程度行っている。
また、素子搭載部材、絶縁シートおよび金属シートを含んだ3層構造により、半導体装置の厚み方向の寸法が増大するという課題もあった。
本発明は上記事情に鑑みてなされたものであり、その目的は、冷却性に優れコンパクトな半導体装置を提供することにある。
また、半導体素子の裏面側を、導電性金属板およびセラミックス板による2層構造にしたことにより、半導体装置を厚み方向に小型化することができる。
図1に基づき、本発明の関連発明による半導体装置1について説明する。本関連発明による半導体装置1の用途は特定のものに限られず、あらゆる電子回路に適用することが可能である。尚、説明中において、図1における上方を半導体装置1の上方とし、下方を半導体装置1の下方とする。また、半導体チップ2の上方の面を半導体チップ2の表面とし、下方の面を半導体チップ2の裏面として説明する。
本関連発明においては、ダイパッド7が半導体素子2に接合される以前に、ダイパッド7と絶縁板8とが予め接合されて一体とされ、導体回路付絶縁基板CSが形成されている。
半導体装置1の下面には、サーマルグリス10を介してヒートシンク(熱交換器)11が接合されている。ヒートシンク11は、半導体装置1をその下端面において冷却している。
最初に、ダイパッド7と絶縁板8とが予め接合されて形成された導体回路付絶縁基板CSの上面(ダイパッド7側)に、はんだボンディングにより半導体チップ2の裏面電極3cを接合する(ダイボンディング工程)。
次に、半導体チップ2の電極パッド3a、3bを、それぞれリード端子5aおよび制御リード端子5bに対し金属ワイヤ4によって接続する(ワイヤボンディング工程)。
最後に、半導体チップ2、リード端子5a、制御リード端子5bおよび導体回路付絶縁基板CSを覆うとともに、導体回路付絶縁基板CSの底面(絶縁板8)が露出するように、合成樹脂材料を充填して樹脂筐体9を形成し、半導体装置1を完成させる(封止工程)。
また、半導体チップ2の裏面側を、ダイパッド7および絶縁板8による2層構造にしたことにより、半導体装置1を厚み方向に小型化することができる。
また、ダイパッド7は、半導体チップ2に接合される前に、予め絶縁板8に対して接合されていることにより、絶縁板8を半導体チップ2へ接続するダイボンディング工程および封止工程を容易に行うことができ、低コストの半導体装置1にすることができる。
また、絶縁板8が窒化アルミニウムにより形成され、ダイパッド7がアルミニウム板により形成された場合、軽量で放熱性のよい半導体装置1にすることができる。
また、絶縁板8が窒化ケイ素により形成され、ダイパッド7が銅板により形成された場合、耐熱性が高く放熱性のよい半導体装置1にすることができる。
次に、図2に基づき、本発明の実施形態による半導体装置1Aについて説明する。関連発明の場合と同様に、説明中において、図2における上方を半導体装置1Aの上方とし、下方を半導体装置1Aの下方とする。また、半導体チップ2の上方の面を半導体チップ2の表面とし、下方の面を半導体チップ2の裏面として説明する。
本実施形態による半導体装置1Aにおいて、半導体チップ2よりも下方に配置された部材の構成は関連発明による半導体装置1の場合と同様であるため、これらについての説明は省略する。
図2に示したように、各々のインナリード12a、12bは、熱圧着によってリード端子5aおよび制御リード端子5bに接合されている(本実施形態において、インナリード12a、12b、リード端子5aおよび制御リード端子5bを包含した構成が導電部材に該当する)。リード端子5aおよび制御リード端子5bは、関連発明の半導体装置1に含まれるものと同様の部材である。
また、半導体チップ2の上方に配置された導体回路付絶縁基板CS1についても、ダイパッド13がインナリード12aに接合される以前に、ダイパッド13と絶縁板14とが予め接合されて一体に形成されている。
図2に示したように、半導体装置1Aの上面および下面には、サーマルグリス10を介してヒートシンク11がそれぞれ接合されている。ヒートシンク11は、半導体装置1Aをその上下端面において冷却している。
本発明は、上述した実施形態に限定されるものではなく、次のように変形または拡張することができる。
ダイパッド7、13が半導体素子2またはインナリード12aに接合される以前に、ダイパッド7、13と絶縁板8、14とが予め接合されていなければならないわけではなく、ダイパッド7、13が半導体素子2またはインナリード12aに接合された後に、ダイパッド7、13と絶縁板8、14とを接合するようにしてもよい。
Claims (5)
- 半導体素子と、
前記半導体素子の表面に形成された表面電極に対して接続された導電部材と、
前記半導体素子の裏面電極に対して接合された導電性金属板と、
前記導電性金属板に対し、前記半導体素子が接合された側の反対側に接合されたセラミックス板と、
前記導電部材に対し、前記表面電極が接続された側の反対側に接合された表側金属板と、
前記表側金属板に対し、前記導電部材が接合された側の反対側に接合された表側セラミックス板と、
前記セラミックス板の前記導電性金属板に接合された側の反対側の面および前記表側セラミックス板の前記表側金属板に接合された側の反対側の面が露出した状態で、前記半導体素子、前記導電性金属板、前記セラミックス板、前記導電部材、前記表側金属板および前記表側セラミックス板を覆う封止体と、
を備えた半導体装置。 - 前記導電性金属板あるいは前記表側金属板は、
前記半導体素子または前記導電部材に接合される前に、予め前記セラミックス板または前記表側セラミックス板に対して接合されている請求項1記載の半導体装置。 - 前記セラミックス板または前記表側セラミックス板は、
アルミナにより形成され、
前記導電性金属板あるいは前記表側金属板は、
アルミニウム板により形成されている請求項1または2に記載の半導体装置。 - 前記セラミックス板または前記表側セラミックス板は、
窒化アルミニウムにより形成され、
前記導電性金属板あるいは前記表側金属板は、
アルミニウム板により形成されている請求項1または2に記載の半導体装置。 - 前記セラミックス板または前記表側セラミックス板は、
窒化ケイ素により形成され、
前記導電性金属板あるいは前記表側金属板は、
銅板により形成されている請求項1または2に記載の半導体装置。
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