JP2020136315A5 - - Google Patents
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- Publication number
- JP2020136315A5 JP2020136315A5 JP2019023694A JP2019023694A JP2020136315A5 JP 2020136315 A5 JP2020136315 A5 JP 2020136315A5 JP 2019023694 A JP2019023694 A JP 2019023694A JP 2019023694 A JP2019023694 A JP 2019023694A JP 2020136315 A5 JP2020136315 A5 JP 2020136315A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- semiconductor
- heat radiating
- active regions
- conductive member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 37
- 239000000758 substrate Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 4
- 229920005591 polysilicon Polymers 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 239000002344 surface layer Substances 0.000 claims 1
- 238000004381 surface treatment Methods 0.000 claims 1
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019023694A JP7103256B2 (ja) | 2019-02-13 | 2019-02-13 | 半導体装置 |
| PCT/JP2020/000817 WO2020166251A1 (ja) | 2019-02-13 | 2020-01-14 | 半導体装置 |
| CN202080013456.5A CN113491008B (zh) | 2019-02-13 | 2020-01-14 | 半导体装置 |
| US17/394,278 US11749731B2 (en) | 2019-02-13 | 2021-08-04 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019023694A JP7103256B2 (ja) | 2019-02-13 | 2019-02-13 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020136315A JP2020136315A (ja) | 2020-08-31 |
| JP2020136315A5 true JP2020136315A5 (https=) | 2020-12-24 |
| JP7103256B2 JP7103256B2 (ja) | 2022-07-20 |
Family
ID=72045541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019023694A Active JP7103256B2 (ja) | 2019-02-13 | 2019-02-13 | 半導体装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US11749731B2 (https=) |
| JP (1) | JP7103256B2 (https=) |
| CN (1) | CN113491008B (https=) |
| WO (1) | WO2020166251A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023088006A (ja) * | 2021-12-14 | 2023-06-26 | キオクシア株式会社 | 半導体装置及び半導体装置の製造方法 |
| JP2024152328A (ja) * | 2023-04-14 | 2024-10-25 | 株式会社豊田中央研究所 | 半導体装置 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002311454A (ja) * | 2001-04-16 | 2002-10-23 | Matsushita Electric Ind Co Ltd | 液晶画像表示装置と画像表示装置用半導体装置の製造方法 |
| JP3622705B2 (ja) * | 2001-06-21 | 2005-02-23 | 松下電器産業株式会社 | 表示装置用半導体装置の製造方法 |
| JP2004111885A (ja) | 2002-07-23 | 2004-04-08 | Toshiba Corp | 半導体装置 |
| JP2010212589A (ja) * | 2009-03-12 | 2010-09-24 | Renesas Electronics Corp | 半導体装置の製造方法 |
| JP2013045973A (ja) * | 2011-08-25 | 2013-03-04 | Panasonic Corp | 半導体装置 |
| JP5755533B2 (ja) | 2011-08-26 | 2015-07-29 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP5765324B2 (ja) * | 2012-12-10 | 2015-08-19 | トヨタ自動車株式会社 | 半導体装置 |
| JP2014160779A (ja) * | 2013-02-20 | 2014-09-04 | Toyota Motor Corp | 半導体装置 |
| JP2014175647A (ja) * | 2013-03-13 | 2014-09-22 | Renesas Electronics Corp | 半導体装置およびその製造方法 |
| CN105518865A (zh) | 2013-08-28 | 2016-04-20 | 三菱电机株式会社 | 半导体装置 |
| DE112014001487B4 (de) * | 2013-10-03 | 2021-03-04 | Fuji Electric Co., Ltd. | Halbleitermodul |
| JP6224454B2 (ja) * | 2013-12-27 | 2017-11-01 | 株式会社豊田中央研究所 | 縦型半導体装置 |
| JP6246617B2 (ja) * | 2014-02-27 | 2017-12-13 | 株式会社豊田中央研究所 | 表面電極を備えている半導体チップ |
| JP6617292B2 (ja) * | 2014-05-23 | 2019-12-11 | パナソニックＩｐマネジメント株式会社 | 炭化珪素半導体装置 |
| JP2016167527A (ja) | 2015-03-10 | 2016-09-15 | 株式会社日立製作所 | 半導体モジュール及びその製造方法 |
| US9620440B1 (en) * | 2016-02-25 | 2017-04-11 | Texas Instruments Incorporated | Power module packaging with dual side cooling |
| JP6860334B2 (ja) * | 2016-12-06 | 2021-04-14 | 株式会社東芝 | 半導体装置 |
-
2019
- 2019-02-13 JP JP2019023694A patent/JP7103256B2/ja active Active
-
2020
- 2020-01-14 WO PCT/JP2020/000817 patent/WO2020166251A1/ja not_active Ceased
- 2020-01-14 CN CN202080013456.5A patent/CN113491008B/zh active Active
-
2021
- 2021-08-04 US US17/394,278 patent/US11749731B2/en active Active
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