JPWO2024128011A1 - - Google Patents
Info
- Publication number
- JPWO2024128011A1 JPWO2024128011A1 JP2024564274A JP2024564274A JPWO2024128011A1 JP WO2024128011 A1 JPWO2024128011 A1 JP WO2024128011A1 JP 2024564274 A JP2024564274 A JP 2024564274A JP 2024564274 A JP2024564274 A JP 2024564274A JP WO2024128011 A1 JPWO2024128011 A1 JP WO2024128011A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
- H10W70/424—Cross-sectional shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022198667 | 2022-12-13 | ||
| PCT/JP2023/042902 WO2024128011A1 (ja) | 2022-12-13 | 2023-11-30 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024128011A1 true JPWO2024128011A1 (https=) | 2024-06-20 |
| JPWO2024128011A5 JPWO2024128011A5 (https=) | 2025-08-21 |
Family
ID=91484857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024564274A Pending JPWO2024128011A1 (https=) | 2022-12-13 | 2023-11-30 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20250300043A1 (https=) |
| JP (1) | JPWO2024128011A1 (https=) |
| WO (1) | WO2024128011A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN121753550A (zh) * | 2023-08-25 | 2026-03-27 | 罗姆股份有限公司 | 半导体装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4916745B2 (ja) * | 2006-03-28 | 2012-04-18 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
-
2023
- 2023-11-30 WO PCT/JP2023/042902 patent/WO2024128011A1/ja not_active Ceased
- 2023-11-30 JP JP2024564274A patent/JPWO2024128011A1/ja active Pending
-
2025
- 2025-06-06 US US19/230,844 patent/US20250300043A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024128011A1 (ja) | 2024-06-20 |
| US20250300043A1 (en) | 2025-09-25 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250605 |