JP2005019985A5 - - Google Patents

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Publication number
JP2005019985A5
JP2005019985A5 JP2004172286A JP2004172286A JP2005019985A5 JP 2005019985 A5 JP2005019985 A5 JP 2005019985A5 JP 2004172286 A JP2004172286 A JP 2004172286A JP 2004172286 A JP2004172286 A JP 2004172286A JP 2005019985 A5 JP2005019985 A5 JP 2005019985A5
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JP
Japan
Prior art keywords
device package
conductive
substrate
insulating substrate
package according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004172286A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005019985A (ja
Filing date
Publication date
Priority claimed from US10/602,418 external-priority patent/US6809261B1/en
Application filed filed Critical
Publication of JP2005019985A publication Critical patent/JP2005019985A/ja
Publication of JP2005019985A5 publication Critical patent/JP2005019985A5/ja
Pending legal-status Critical Current

Links

JP2004172286A 2003-06-23 2004-06-10 物理的に小型のデバイスパッケージ Pending JP2005019985A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/602,418 US6809261B1 (en) 2003-06-23 2003-06-23 Physically compact device package

Publications (2)

Publication Number Publication Date
JP2005019985A JP2005019985A (ja) 2005-01-20
JP2005019985A5 true JP2005019985A5 (https=) 2007-03-01

Family

ID=33159939

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004172286A Pending JP2005019985A (ja) 2003-06-23 2004-06-10 物理的に小型のデバイスパッケージ

Country Status (2)

Country Link
US (1) US6809261B1 (https=)
JP (1) JP2005019985A (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW578280B (en) * 2002-11-21 2004-03-01 United Epitaxy Co Ltd Light emitting diode and package scheme and method thereof
TW594950B (en) * 2003-03-18 2004-06-21 United Epitaxy Co Ltd Light emitting diode and package scheme and method thereof
CN101061590B (zh) * 2004-11-18 2010-05-12 皇家飞利浦电子股份有限公司 发光器及其制造方法
KR100646093B1 (ko) 2004-12-17 2006-11-15 엘지이노텍 주식회사 발광소자 패키지
EP1524705B1 (en) * 2005-01-12 2008-03-12 NeoBulb Technologies, Inc. Flip chip type LED lighting device and its manufacturing method
US7326062B2 (en) * 2005-02-07 2008-02-05 Avago Technologies Ecbu Ip Pte Ltd System and method for increasing the surface mounting stability of a lamp
JP4241658B2 (ja) * 2005-04-14 2009-03-18 シチズン電子株式会社 発光ダイオード光源ユニット及びそれを用いて形成した発光ダイオード光源
TWM289865U (en) * 2005-11-08 2006-04-21 Lighthouse Technology Co Ltd Sectional light emitting diode backlight unit
US7786490B2 (en) * 2005-11-28 2010-08-31 Neobule Technologies, Inc. Multi-chip module single package structure for semiconductor
WO2007135707A1 (ja) 2006-05-18 2007-11-29 Nichia Corporation 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
JP2007329219A (ja) * 2006-06-07 2007-12-20 Nichia Chem Ind Ltd 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
KR20080054327A (ko) * 2006-12-12 2008-06-17 교리츠 엘렉스 가부시키가이샤 발광 다이오드용 패키지 및 그 제조 방법, 및 발광다이오드
TWI341038B (en) * 2006-12-18 2011-04-21 Delta Electronics Inc Electroluminescence module
JP5380774B2 (ja) 2006-12-28 2014-01-08 日亜化学工業株式会社 表面実装型側面発光装置及びその製造方法
US8101955B2 (en) * 2009-04-17 2012-01-24 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. PLCC package with a reflector cup surrounded by an encapsulant
US8089075B2 (en) * 2009-04-17 2012-01-03 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. LFCC package with a reflector cup surrounded by a single encapsulant
JP2016184653A (ja) * 2015-03-26 2016-10-20 京セラ株式会社 発光素子収納用パッケージおよび発光装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6066843A (ja) * 1983-09-22 1985-04-17 Hitachi Ltd 集積回路パツケ−ジ
JP2712461B2 (ja) * 1988-12-27 1998-02-10 日本電気株式会社 半導体装置の容器
US5102829A (en) * 1991-07-22 1992-04-07 At&T Bell Laboratories Plastic pin grid array package
US5355283A (en) * 1993-04-14 1994-10-11 Amkor Electronics, Inc. Ball grid array with via interconnection
JPH0917919A (ja) * 1995-06-29 1997-01-17 Fujitsu Ltd 半導体装置
US5784260A (en) * 1996-05-29 1998-07-21 International Business Machines Corporation Structure for constraining the flow of encapsulant applied to an I/C chip on a substrate
JP3527589B2 (ja) * 1996-07-01 2004-05-17 新光電気工業株式会社 半導体装置用パッケージ及びその製造方法
US5834839A (en) * 1997-05-22 1998-11-10 Lsi Logic Corporation Preserving clearance between encapsulant and PCB for cavity-down single-tier package assembly
US5962810A (en) * 1997-09-09 1999-10-05 Amkor Technology, Inc. Integrated circuit package employing a transparent encapsulant
JPH11298048A (ja) * 1998-04-15 1999-10-29 Matsushita Electric Works Ltd Ｌｅｄ実装基板
JP3512653B2 (ja) * 1998-09-30 2004-03-31 日本特殊陶業株式会社 電子部品用パッケージの製造方法

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