JP2005019985A - 物理的に小型のデバイスパッケージ - Google Patents

物理的に小型のデバイスパッケージ Download PDF

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Publication number
JP2005019985A
JP2005019985A JP2004172286A JP2004172286A JP2005019985A JP 2005019985 A JP2005019985 A JP 2005019985A JP 2004172286 A JP2004172286 A JP 2004172286A JP 2004172286 A JP2004172286 A JP 2004172286A JP 2005019985 A JP2005019985 A JP 2005019985A
Authority
JP
Japan
Prior art keywords
conductive
device package
insulating substrate
substrate
conductive substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004172286A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005019985A5 (https=
Inventor
Kee Yean Ng
イーン ウン キー
Cheng Why Tan
フアィ タン チェン
Ji Kin Tham
キン サム ジー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of JP2005019985A publication Critical patent/JP2005019985A/ja
Publication of JP2005019985A5 publication Critical patent/JP2005019985A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/479—Leadframes on or in insulating or insulated package substrates, interposers, or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
JP2004172286A 2003-06-23 2004-06-10 物理的に小型のデバイスパッケージ Pending JP2005019985A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/602,418 US6809261B1 (en) 2003-06-23 2003-06-23 Physically compact device package

Publications (2)

Publication Number Publication Date
JP2005019985A true JP2005019985A (ja) 2005-01-20
JP2005019985A5 JP2005019985A5 (https=) 2007-03-01

Family

ID=33159939

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004172286A Pending JP2005019985A (ja) 2003-06-23 2004-06-10 物理的に小型のデバイスパッケージ

Country Status (2)

Country Link
US (1) US6809261B1 (https=)
JP (1) JP2005019985A (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007329219A (ja) * 2006-06-07 2007-12-20 Nichia Chem Ind Ltd 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
KR101251683B1 (ko) * 2005-04-14 2013-04-05 시티즌 덴시 가부시키가이샤 Ｌｅｄ 유닛 및 이 ｌｅｄ 유닛을 이용한 ｌｅｄ 조명 램프
KR101304748B1 (ko) * 2006-12-12 2013-09-05 교리츠 엘렉스 가부시키가이샤 발광 다이오드용 패키지, 발광 다이오드, 및 발광 다이오드용 패키지의 제조 방법
US8802459B2 (en) 2006-12-28 2014-08-12 Nichia Corporation Surface mount lateral light emitting apparatus and fabrication method thereof
JP2016184653A (ja) * 2015-03-26 2016-10-20 京セラ株式会社 発光素子収納用パッケージおよび発光装置
US9502624B2 (en) 2006-05-18 2016-11-22 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW578280B (en) * 2002-11-21 2004-03-01 United Epitaxy Co Ltd Light emitting diode and package scheme and method thereof
TW594950B (en) * 2003-03-18 2004-06-21 United Epitaxy Co Ltd Light emitting diode and package scheme and method thereof
CN101061590B (zh) * 2004-11-18 2010-05-12 皇家飞利浦电子股份有限公司 发光器及其制造方法
KR100646093B1 (ko) 2004-12-17 2006-11-15 엘지이노텍 주식회사 발광소자 패키지
EP1524705B1 (en) * 2005-01-12 2008-03-12 NeoBulb Technologies, Inc. Flip chip type LED lighting device and its manufacturing method
US7326062B2 (en) * 2005-02-07 2008-02-05 Avago Technologies Ecbu Ip Pte Ltd System and method for increasing the surface mounting stability of a lamp
TWM289865U (en) * 2005-11-08 2006-04-21 Lighthouse Technology Co Ltd Sectional light emitting diode backlight unit
US7786490B2 (en) * 2005-11-28 2010-08-31 Neobule Technologies, Inc. Multi-chip module single package structure for semiconductor
TWI341038B (en) * 2006-12-18 2011-04-21 Delta Electronics Inc Electroluminescence module
US8101955B2 (en) * 2009-04-17 2012-01-24 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. PLCC package with a reflector cup surrounded by an encapsulant
US8089075B2 (en) * 2009-04-17 2012-01-03 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. LFCC package with a reflector cup surrounded by a single encapsulant

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02177351A (ja) * 1988-12-27 1990-07-10 Nec Corp 半導体装置の容器
JPH1022427A (ja) * 1996-07-01 1998-01-23 Shinko Electric Ind Co Ltd 半導体装置用パッケージ及びその製造方法
JPH11298048A (ja) * 1998-04-15 1999-10-29 Matsushita Electric Works Ltd Ｌｅｄ実装基板
JP2000114422A (ja) * 1998-09-30 2000-04-21 Ngk Spark Plug Co Ltd 電子部品用パッケージ及びその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6066843A (ja) * 1983-09-22 1985-04-17 Hitachi Ltd 集積回路パツケ−ジ
US5102829A (en) * 1991-07-22 1992-04-07 At&T Bell Laboratories Plastic pin grid array package
US5355283A (en) * 1993-04-14 1994-10-11 Amkor Electronics, Inc. Ball grid array with via interconnection
JPH0917919A (ja) * 1995-06-29 1997-01-17 Fujitsu Ltd 半導体装置
US5784260A (en) * 1996-05-29 1998-07-21 International Business Machines Corporation Structure for constraining the flow of encapsulant applied to an I/C chip on a substrate
US5834839A (en) * 1997-05-22 1998-11-10 Lsi Logic Corporation Preserving clearance between encapsulant and PCB for cavity-down single-tier package assembly
US5962810A (en) * 1997-09-09 1999-10-05 Amkor Technology, Inc. Integrated circuit package employing a transparent encapsulant

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02177351A (ja) * 1988-12-27 1990-07-10 Nec Corp 半導体装置の容器
JPH1022427A (ja) * 1996-07-01 1998-01-23 Shinko Electric Ind Co Ltd 半導体装置用パッケージ及びその製造方法
JPH11298048A (ja) * 1998-04-15 1999-10-29 Matsushita Electric Works Ltd Ｌｅｄ実装基板
JP2000114422A (ja) * 1998-09-30 2000-04-21 Ngk Spark Plug Co Ltd 電子部品用パッケージ及びその製造方法

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8596820B2 (en) 2005-04-14 2013-12-03 Citizen Electronics Co., Ltd. LED unit and LED lighting lamp using the LED unit
KR101251683B1 (ko) * 2005-04-14 2013-04-05 시티즌 덴시 가부시키가이샤 Ｌｅｄ 유닛 및 이 ｌｅｄ 유닛을 이용한 ｌｅｄ 조명 램프
US9929318B2 (en) 2006-05-18 2018-03-27 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
US9502624B2 (en) 2006-05-18 2016-11-22 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
US9634204B2 (en) 2006-05-18 2017-04-25 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
US10263161B2 (en) 2006-05-18 2019-04-16 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
US10686102B2 (en) 2006-05-18 2020-06-16 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
US10971656B2 (en) 2006-05-18 2021-04-06 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
US11631790B2 (en) 2006-05-18 2023-04-18 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
JP2007329219A (ja) * 2006-06-07 2007-12-20 Nichia Chem Ind Ltd 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
KR101304748B1 (ko) * 2006-12-12 2013-09-05 교리츠 엘렉스 가부시키가이샤 발광 다이오드용 패키지, 발광 다이오드, 및 발광 다이오드용 패키지의 제조 방법
US8802459B2 (en) 2006-12-28 2014-08-12 Nichia Corporation Surface mount lateral light emitting apparatus and fabrication method thereof
US9190588B2 (en) 2006-12-28 2015-11-17 Nichia Corporation Side-view type light emitting apparatus and package
JP2016184653A (ja) * 2015-03-26 2016-10-20 京セラ株式会社 発光素子収納用パッケージおよび発光装置

Also Published As

Publication number Publication date
US6809261B1 (en) 2004-10-26

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