JPWO2023176351A5 - - Google Patents
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- Publication number
- JPWO2023176351A5 JPWO2023176351A5 JP2024507654A JP2024507654A JPWO2023176351A5 JP WO2023176351 A5 JPWO2023176351 A5 JP WO2023176351A5 JP 2024507654 A JP2024507654 A JP 2024507654A JP 2024507654 A JP2024507654 A JP 2024507654A JP WO2023176351 A5 JPWO2023176351 A5 JP WO2023176351A5
- Authority
- JP
- Japan
- Prior art keywords
- mounting portion
- semiconductor light
- emitting device
- light emitting
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 22
- 239000000758 substrate Substances 0.000 claims 6
- 239000000463 material Substances 0.000 claims 4
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 238000007789 sealing Methods 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 2
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022043108 | 2022-03-17 | ||
| PCT/JP2023/006514 WO2023176351A1 (ja) | 2022-03-17 | 2023-02-22 | 半導体発光装置および半導体発光装置の実装構造体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023176351A1 JPWO2023176351A1 (https=) | 2023-09-21 |
| JPWO2023176351A5 true JPWO2023176351A5 (https=) | 2024-11-21 |
Family
ID=88023346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024507654A Pending JPWO2023176351A1 (https=) | 2022-03-17 | 2023-02-22 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2023176351A1 (https=) |
| WO (1) | WO2023176351A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008052944A (ja) * | 2006-08-22 | 2008-03-06 | Sumitomo Metal Electronics Devices Inc | 導電性ペーストおよびそれを用いた窒化アルミ焼結体およびそれを用いた半導体発光素子搭載基板 |
| JP6476703B2 (ja) * | 2014-09-30 | 2019-03-06 | 日亜化学工業株式会社 | セラミックスパッケージ、発光装置及びそれらの製造方法 |
| JP7283938B2 (ja) * | 2019-03-27 | 2023-05-30 | ローム株式会社 | 半導体発光装置 |
-
2023
- 2023-02-22 JP JP2024507654A patent/JPWO2023176351A1/ja active Pending
- 2023-02-22 WO PCT/JP2023/006514 patent/WO2023176351A1/ja not_active Ceased
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