JPWO2023176351A1 - - Google Patents
Info
- Publication number
- JPWO2023176351A1 JPWO2023176351A1 JP2024507654A JP2024507654A JPWO2023176351A1 JP WO2023176351 A1 JPWO2023176351 A1 JP WO2023176351A1 JP 2024507654 A JP2024507654 A JP 2024507654A JP 2024507654 A JP2024507654 A JP 2024507654A JP WO2023176351 A1 JPWO2023176351 A1 JP WO2023176351A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022043108 | 2022-03-17 | ||
| PCT/JP2023/006514 WO2023176351A1 (ja) | 2022-03-17 | 2023-02-22 | 半導体発光装置および半導体発光装置の実装構造体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023176351A1 true JPWO2023176351A1 (https=) | 2023-09-21 |
| JPWO2023176351A5 JPWO2023176351A5 (https=) | 2024-11-21 |
Family
ID=88023346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024507654A Pending JPWO2023176351A1 (https=) | 2022-03-17 | 2023-02-22 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2023176351A1 (https=) |
| WO (1) | WO2023176351A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008052944A (ja) * | 2006-08-22 | 2008-03-06 | Sumitomo Metal Electronics Devices Inc | 導電性ペーストおよびそれを用いた窒化アルミ焼結体およびそれを用いた半導体発光素子搭載基板 |
| JP6476703B2 (ja) * | 2014-09-30 | 2019-03-06 | 日亜化学工業株式会社 | セラミックスパッケージ、発光装置及びそれらの製造方法 |
| JP7283938B2 (ja) * | 2019-03-27 | 2023-05-30 | ローム株式会社 | 半導体発光装置 |
-
2023
- 2023-02-22 JP JP2024507654A patent/JPWO2023176351A1/ja active Pending
- 2023-02-22 WO PCT/JP2023/006514 patent/WO2023176351A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023176351A1 (ja) | 2023-09-21 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240904 |