JP5822294B2 - 発光ダイオード - Google Patents
発光ダイオード Download PDFInfo
- Publication number
- JP5822294B2 JP5822294B2 JP2011175959A JP2011175959A JP5822294B2 JP 5822294 B2 JP5822294 B2 JP 5822294B2 JP 2011175959 A JP2011175959 A JP 2011175959A JP 2011175959 A JP2011175959 A JP 2011175959A JP 5822294 B2 JP5822294 B2 JP 5822294B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- pair
- emitting diode
- substrate
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Led Device Packages (AREA)
Description
12 基板
13a,14a 表面電極
13b,14b 裏面電極
15 発光素子
15a 上面
15b 下面
16 樹脂体
17a,17b 導電部
20 絶縁領域
21,22 素子電極
23a,23b ボンディングワイヤ
24 接着剤
25 反射部材
31 発光ダイオード
Claims (5)
- 基板と、この基板の表面に形成される一対の電極パターンと、この一対の電極パターン上に実装される発光素子とを備える発光ダイオードにおいて、
前記一対の電極パターンが、前記基板の表面の略中央部に設けられる絶縁領域を除いて基板の表面の略全面に形成され、
前記発光素子は、上面に一対の素子電極を有し、この一対の素子電極が前記絶縁領域の上方に位置するように載置され、それぞれの素子電極から対応する前記一対の電極パターンにボンディングワイヤを介して電気的に接続されていることを特徴とする発光ダイオード。 - 前記発光素子は、前記一対の電極パターンの一方に載置される面積と、他方に載置される面積とが略同一である請求項1に記載の発光ダイオード。
- 前記発光素子は、一対の素子電極が前記絶縁領域の上方に一列に並ぶようにして位置決め載置され、前記一対の素子電極を結ぶ中心線を基準とした左右の下面がそれぞれの表面電極上に接している請求項1に記載の発光ダイオード。
- 前記絶縁領域は、白色系の反射部材によって、前記基板の露出した樹脂面が被覆されている請求項1又は3に記載の発光ダイオード。
- 前記発光素子は、一対の電極パターン上に接着剤を介して実装されている請求項1に記載の発光ダイオード。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011175959A JP5822294B2 (ja) | 2011-08-11 | 2011-08-11 | 発光ダイオード |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011175959A JP5822294B2 (ja) | 2011-08-11 | 2011-08-11 | 発光ダイオード |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013041867A JP2013041867A (ja) | 2013-02-28 |
JP5822294B2 true JP5822294B2 (ja) | 2015-11-24 |
Family
ID=47890036
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011175959A Active JP5822294B2 (ja) | 2011-08-11 | 2011-08-11 | 発光ダイオード |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5822294B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6487626B2 (ja) * | 2014-03-24 | 2019-03-20 | スタンレー電気株式会社 | 半導体装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003309292A (ja) * | 2002-04-15 | 2003-10-31 | Citizen Electronics Co Ltd | 表面実装型発光ダイオードのメタルコア基板及びその製造方法 |
JP4817845B2 (ja) * | 2003-09-30 | 2011-11-16 | 株式会社東芝 | 発光装置の製造方法 |
JP2006286895A (ja) * | 2005-03-31 | 2006-10-19 | Mitsubishi Electric Corp | Led電極の接合体 |
-
2011
- 2011-08-11 JP JP2011175959A patent/JP5822294B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2013041867A (ja) | 2013-02-28 |
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