JPWO2024154790A5 - - Google Patents

Info

Publication number
JPWO2024154790A5
JPWO2024154790A5 JP2024571803A JP2024571803A JPWO2024154790A5 JP WO2024154790 A5 JPWO2024154790 A5 JP WO2024154790A5 JP 2024571803 A JP2024571803 A JP 2024571803A JP 2024571803 A JP2024571803 A JP 2024571803A JP WO2024154790 A5 JPWO2024154790 A5 JP WO2024154790A5
Authority
JP
Japan
Prior art keywords
organic resin
wiring layer
region
substrate
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024571803A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024154790A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/001321 external-priority patent/WO2024154790A1/ja
Publication of JPWO2024154790A1 publication Critical patent/JPWO2024154790A1/ja
Publication of JPWO2024154790A5 publication Critical patent/JPWO2024154790A5/ja
Pending legal-status Critical Current

Links

JP2024571803A 2023-01-19 2024-01-18 Pending JPWO2024154790A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023006887 2023-01-19
PCT/JP2024/001321 WO2024154790A1 (ja) 2023-01-19 2024-01-18 配線基板、電気装置および電気装置構造体

Publications (2)

Publication Number Publication Date
JPWO2024154790A1 JPWO2024154790A1 (https=) 2024-07-25
JPWO2024154790A5 true JPWO2024154790A5 (https=) 2025-09-18

Family

ID=91956231

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024571803A Pending JPWO2024154790A1 (https=) 2023-01-19 2024-01-18

Country Status (2)

Country Link
JP (1) JPWO2024154790A1 (https=)
WO (1) WO2024154790A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2587593B2 (ja) * 1993-09-22 1997-03-05 松下電器産業株式会社 プリント配線板及びその製造方法
JP4403820B2 (ja) * 2004-02-17 2010-01-27 株式会社村田製作所 積層型電子部品およびその製造方法
JP5367523B2 (ja) * 2009-09-25 2013-12-11 新光電気工業株式会社 配線基板及び配線基板の製造方法

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