JP2022104789A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2022104789A5 JP2022104789A5 JP2021169272A JP2021169272A JP2022104789A5 JP 2022104789 A5 JP2022104789 A5 JP 2022104789A5 JP 2021169272 A JP2021169272 A JP 2021169272A JP 2021169272 A JP2021169272 A JP 2021169272A JP 2022104789 A5 JP2022104789 A5 JP 2022104789A5
- Authority
- JP
- Japan
- Prior art keywords
- circuit module
- heat dissipation
- dissipation structure
- conductor
- interposer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/136,408 US11581241B2 (en) | 2020-12-29 | 2020-12-29 | Circuit modules with front-side interposer terminals and through-module thermal dissipation structures |
| US17/136,408 | 2020-12-29 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022104789A JP2022104789A (ja) | 2022-07-11 |
| JP2022104789A5 true JP2022104789A5 (https=) | 2024-10-23 |
| JP7727477B2 JP7727477B2 (ja) | 2025-08-21 |
Family
ID=78770372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021169272A Active JP7727477B2 (ja) | 2020-12-29 | 2021-10-15 | 前面インターポーザ端子とモジュールを通じる熱散逸構造とを有する回路モジュール |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US11581241B2 (https=) |
| EP (1) | EP4024448B1 (https=) |
| JP (1) | JP7727477B2 (https=) |
| CN (1) | CN114698228A (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11955417B2 (en) * | 2021-12-14 | 2024-04-09 | Industrial Technology Research Institute | Electronic device having substrate with electrically floating vias |
| US12477654B2 (en) * | 2022-04-01 | 2025-11-18 | Macom Technology Solutions Holdings, Inc. | RF power pallet with management daughter board |
| CN117769108A (zh) * | 2022-09-23 | 2024-03-26 | 鹏鼎控股(深圳)股份有限公司 | 电路板及其制造方法 |
| US12347740B2 (en) * | 2022-12-06 | 2025-07-01 | Nxp Usa, Inc. | Power amplifier module with transistor dies for multiple amplifier stages on a same heat dissipation structure |
| US20240203912A1 (en) * | 2022-12-19 | 2024-06-20 | Nxp Usa, Inc. | Amplifier modules and systems with ground terminals adjacent to power amplifier die |
| US12588509B2 (en) * | 2023-02-28 | 2026-03-24 | Nxp Usa, Inc. | Terminal interposers with mold flow channels, circuit modules including such terminal interposers, and associated methods |
| US12557221B2 (en) | 2023-11-22 | 2026-02-17 | Nxp Usa, Inc. | Molded packages with through-mold interconnects |
| US20250259937A1 (en) * | 2024-02-10 | 2025-08-14 | Qualcomm Incorporated | Square thermal via |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002222897A (ja) | 2001-01-29 | 2002-08-09 | Hitachi Metals Ltd | 半導体用パッケージ |
| US6580611B1 (en) * | 2001-12-21 | 2003-06-17 | Intel Corporation | Dual-sided heat removal system |
| JP2004047866A (ja) * | 2002-07-15 | 2004-02-12 | Renesas Technology Corp | 半導体装置 |
| JP4213529B2 (ja) * | 2003-06-30 | 2009-01-21 | Ｔｄｋ株式会社 | 積層モジュール基板及びその製造方法並びに半導体ｉｃ搭載モジュール |
| JP4033157B2 (ja) | 2004-03-29 | 2008-01-16 | 松下電器産業株式会社 | 導電路形成方法 |
| US7755186B2 (en) | 2007-12-31 | 2010-07-13 | Intel Corporation | Cooling solutions for die-down integrated circuit packages |
| JP5382029B2 (ja) | 2011-02-22 | 2014-01-08 | オムロン株式会社 | マイクロフォンの製造方法 |
| US20130277855A1 (en) * | 2012-04-24 | 2013-10-24 | Terry (Teckgyu) Kang | High density 3d package |
| US9986646B2 (en) | 2014-11-21 | 2018-05-29 | Nxp Usa, Inc. | Packaged electronic devices with top terminations, and methods of manufacture thereof |
| WO2016080333A1 (ja) | 2014-11-21 | 2016-05-26 | 株式会社村田製作所 | モジュール |
| US10483250B2 (en) | 2015-11-04 | 2019-11-19 | Intel Corporation | Three-dimensional small form factor system in package architecture |
| US9899292B2 (en) | 2016-02-05 | 2018-02-20 | Qorvo Us, Inc. | Top-side cooling of RF products in air cavity composite packages |
| US9774301B1 (en) | 2016-05-17 | 2017-09-26 | Nxp Usa, Inc. | Multiple-path RF amplifiers with angularly offset signal path directions, and methods of manufacture thereof |
| US10284147B2 (en) | 2016-12-15 | 2019-05-07 | Nxp Usa, Inc. | Doherty amplifiers and amplifier modules with shunt inductance circuits that affect transmission line length between carrier and peaking amplifier outputs |
| DE102017120753B4 (de) | 2017-09-08 | 2021-04-29 | Infineon Technologies Austria Ag | SMD-Package mit Oberseitenkühlung |
| JP6678196B2 (ja) | 2018-03-29 | 2020-04-08 | 長瀬産業株式会社 | 半導体装置及び配線構造体の製造方法 |
-
2020
- 2020-12-29 US US17/136,408 patent/US11581241B2/en active Active
-
2021
- 2021-10-15 JP JP2021169272A patent/JP7727477B2/ja active Active
- 2021-11-22 EP EP21209628.3A patent/EP4024448B1/en active Active
- 2021-11-25 CN CN202111408782.9A patent/CN114698228A/zh active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2022104789A5 (https=) | ||
| CN101159254B (zh) | 半导体装置 | |
| TWI654734B (zh) | 堆疊型半導體封裝 | |
| US7656015B2 (en) | Packaging substrate having heat-dissipating structure | |
| US20180342489A1 (en) | Semiconductor structure and a method of making thereof | |
| US9271388B2 (en) | Interposer and package on package structure | |
| CN103811472A (zh) | 半导体封装件和制造半导体封装件的方法 | |
| US6900527B1 (en) | Lead-frame method and assembly for interconnecting circuits within a circuit module | |
| KR20050064144A (ko) | 수직 실장된 반도체 칩 패키지를 갖는 반도체 모듈 | |
| JP2010050259A (ja) | ３次元積層半導体装置 | |
| JP2022104788A5 (https=) | ||
| KR20050002659A (ko) | 혼성집적회로 | |
| US20070069352A1 (en) | Bumpless chip package and fabricating process thereof | |
| US6032355A (en) | Method of forming thermal conductive structure on printed circuit board | |
| CN1319138C (zh) | 封装的半导体器件的形成方法 | |
| KR100855790B1 (ko) | 마이크로전자 장치 및 이를 제조하는 방법 | |
| TWI237291B (en) | Semiconductor device | |
| CN101882606A (zh) | 散热型半导体封装构造及其制造方法 | |
| CN101322450A (zh) | 具有内部散热结构的ic封装 | |
| KR100675030B1 (ko) | 집적 회로 패키지 | |
| US20050258533A1 (en) | Semiconductor device mounting structure | |
| CN115621234A (zh) | 封装结构及封装系统 | |
| CN220914207U (zh) | 一种内埋芯片基板结构 | |
| CN100397632C (zh) | 组合式散热去耦电容器阵列和印刷电路板组件 | |
| CN101685808A (zh) | 散热封装结构以及封装方法 |