JPWO2024154790A1 - - Google Patents
Info
- Publication number
- JPWO2024154790A1 JPWO2024154790A1 JP2024571803A JP2024571803A JPWO2024154790A1 JP WO2024154790 A1 JPWO2024154790 A1 JP WO2024154790A1 JP 2024571803 A JP2024571803 A JP 2024571803A JP 2024571803 A JP2024571803 A JP 2024571803A JP WO2024154790 A1 JPWO2024154790 A1 JP WO2024154790A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023006887 | 2023-01-19 | ||
| PCT/JP2024/001321 WO2024154790A1 (ja) | 2023-01-19 | 2024-01-18 | 配線基板、電気装置および電気装置構造体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024154790A1 true JPWO2024154790A1 (https=) | 2024-07-25 |
| JPWO2024154790A5 JPWO2024154790A5 (https=) | 2025-09-18 |
Family
ID=91956231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024571803A Pending JPWO2024154790A1 (https=) | 2023-01-19 | 2024-01-18 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024154790A1 (https=) |
| WO (1) | WO2024154790A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2587593B2 (ja) * | 1993-09-22 | 1997-03-05 | 松下電器産業株式会社 | プリント配線板及びその製造方法 |
| JP4403820B2 (ja) * | 2004-02-17 | 2010-01-27 | 株式会社村田製作所 | 積層型電子部品およびその製造方法 |
| JP5367523B2 (ja) * | 2009-09-25 | 2013-12-11 | 新光電気工業株式会社 | 配線基板及び配線基板の製造方法 |
-
2024
- 2024-01-18 JP JP2024571803A patent/JPWO2024154790A1/ja active Pending
- 2024-01-18 WO PCT/JP2024/001321 patent/WO2024154790A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024154790A1 (ja) | 2024-07-25 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250709 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250709 |