JPWO2024161996A1 - - Google Patents
Info
- Publication number
- JPWO2024161996A1 JPWO2024161996A1 JP2024574409A JP2024574409A JPWO2024161996A1 JP WO2024161996 A1 JPWO2024161996 A1 JP WO2024161996A1 JP 2024574409 A JP2024574409 A JP 2024574409A JP 2024574409 A JP2024574409 A JP 2024574409A JP WO2024161996 A1 JPWO2024161996 A1 JP WO2024161996A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023013713 | 2023-02-01 | ||
| PCT/JP2024/001083 WO2024161996A1 (ja) | 2023-02-01 | 2024-01-17 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024161996A1 true JPWO2024161996A1 (https=) | 2024-08-08 |
| JPWO2024161996A5 JPWO2024161996A5 (https=) | 2025-10-09 |
Family
ID=92146571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024574409A Pending JPWO2024161996A1 (https=) | 2023-02-01 | 2024-01-17 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024161996A1 (https=) |
| WO (1) | WO2024161996A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011204862A (ja) * | 2010-03-25 | 2011-10-13 | Sanyo Electric Co Ltd | 半導体装置およびその製造方法 |
| WO2016203764A1 (ja) * | 2015-06-17 | 2016-12-22 | パナソニックＩｐマネジメント株式会社 | 半導体装置及びモジュール部品 |
| CN113748509B (zh) * | 2019-04-24 | 2024-04-30 | 罗姆股份有限公司 | 半导体装置 |
-
2024
- 2024-01-17 WO PCT/JP2024/001083 patent/WO2024161996A1/ja not_active Ceased
- 2024-01-17 JP JP2024574409A patent/JPWO2024161996A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024161996A1 (ja) | 2024-08-08 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250724 |