JPWO2024262239A5 - - Google Patents

Info

Publication number
JPWO2024262239A5
JPWO2024262239A5 JP2025527610A JP2025527610A JPWO2024262239A5 JP WO2024262239 A5 JPWO2024262239 A5 JP WO2024262239A5 JP 2025527610 A JP2025527610 A JP 2025527610A JP 2025527610 A JP2025527610 A JP 2025527610A JP WO2024262239 A5 JPWO2024262239 A5 JP WO2024262239A5
Authority
JP
Japan
Prior art keywords
electronic device
thickness direction
bonding material
conductive bonding
support member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025527610A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024262239A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/019001 external-priority patent/WO2024262239A1/ja
Publication of JPWO2024262239A1 publication Critical patent/JPWO2024262239A1/ja
Publication of JPWO2024262239A5 publication Critical patent/JPWO2024262239A5/ja
Pending legal-status Critical Current

Links

JP2025527610A 2023-06-21 2024-05-23 Pending JPWO2024262239A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023101348 2023-06-21
PCT/JP2024/019001 WO2024262239A1 (ja) 2023-06-21 2024-05-23 電子装置

Publications (2)

Publication Number Publication Date
JPWO2024262239A1 JPWO2024262239A1 (https=) 2024-12-26
JPWO2024262239A5 true JPWO2024262239A5 (https=) 2026-03-23

Family

ID=93935134

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025527610A Pending JPWO2024262239A1 (https=) 2023-06-21 2024-05-23

Country Status (3)

Country Link
US (1) US20260107389A1 (https=)
JP (1) JPWO2024262239A1 (https=)
WO (1) WO2024262239A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0533568U (ja) * 1991-10-03 1993-04-30 三菱電機株式会社 リードレス部品実装構造
JPH06163305A (ja) * 1992-11-25 1994-06-10 Sony Corp チップ部品
JP2000244105A (ja) * 1999-02-23 2000-09-08 Denso Corp 電子部品の実装構造
JP2005251904A (ja) * 2004-03-03 2005-09-15 Denso Corp 基板表面実装部品、基板回路、基板、ハンダ接続方法、及び基板回路の製造方法
JP2011009397A (ja) * 2009-06-25 2011-01-13 Fujikura Ltd 電子部品実装配線基板
WO2017115441A1 (ja) * 2015-12-28 2017-07-06 オリンパス株式会社 実装構造体、撮像装置および内視鏡
JP2018014381A (ja) * 2016-07-20 2018-01-25 富士通株式会社 基板及び電子機器
JP7463191B2 (ja) * 2019-10-30 2024-04-08 新光電気工業株式会社 半導体装置及び半導体装置の製造方法

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