JPWO2024262239A1 - - Google Patents
Info
- Publication number
- JPWO2024262239A1 JPWO2024262239A1 JP2025527610A JP2025527610A JPWO2024262239A1 JP WO2024262239 A1 JPWO2024262239 A1 JP WO2024262239A1 JP 2025527610 A JP2025527610 A JP 2025527610A JP 2025527610 A JP2025527610 A JP 2025527610A JP WO2024262239 A1 JPWO2024262239 A1 JP WO2024262239A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023101348 | 2023-06-21 | ||
| PCT/JP2024/019001 WO2024262239A1 (ja) | 2023-06-21 | 2024-05-23 | 電子装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024262239A1 true JPWO2024262239A1 (https=) | 2024-12-26 |
| JPWO2024262239A5 JPWO2024262239A5 (https=) | 2026-03-23 |
Family
ID=93935134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025527610A Pending JPWO2024262239A1 (https=) | 2023-06-21 | 2024-05-23 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20260107389A1 (https=) |
| JP (1) | JPWO2024262239A1 (https=) |
| WO (1) | WO2024262239A1 (https=) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0533568U (ja) * | 1991-10-03 | 1993-04-30 | 三菱電機株式会社 | リードレス部品実装構造 |
| JPH06163305A (ja) * | 1992-11-25 | 1994-06-10 | Sony Corp | チップ部品 |
| JP2000244105A (ja) * | 1999-02-23 | 2000-09-08 | Denso Corp | 電子部品の実装構造 |
| JP2005251904A (ja) * | 2004-03-03 | 2005-09-15 | Denso Corp | 基板表面実装部品、基板回路、基板、ハンダ接続方法、及び基板回路の製造方法 |
| JP2011009397A (ja) * | 2009-06-25 | 2011-01-13 | Fujikura Ltd | 電子部品実装配線基板 |
| WO2017115441A1 (ja) * | 2015-12-28 | 2017-07-06 | オリンパス株式会社 | 実装構造体、撮像装置および内視鏡 |
| JP2018014381A (ja) * | 2016-07-20 | 2018-01-25 | 富士通株式会社 | 基板及び電子機器 |
| JP7463191B2 (ja) * | 2019-10-30 | 2024-04-08 | 新光電気工業株式会社 | 半導体装置及び半導体装置の製造方法 |
-
2024
- 2024-05-23 WO PCT/JP2024/019001 patent/WO2024262239A1/ja not_active Ceased
- 2024-05-23 JP JP2025527610A patent/JPWO2024262239A1/ja active Pending
-
2025
- 2025-12-16 US US19/422,002 patent/US20260107389A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024262239A1 (ja) | 2024-12-26 |
| US20260107389A1 (en) | 2026-04-16 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20251215 |