JPWO2024089948A1 - - Google Patents

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Publication number
JPWO2024089948A1
JPWO2024089948A1 JP2024552828A JP2024552828A JPWO2024089948A1 JP WO2024089948 A1 JPWO2024089948 A1 JP WO2024089948A1 JP 2024552828 A JP2024552828 A JP 2024552828A JP 2024552828 A JP2024552828 A JP 2024552828A JP WO2024089948 A1 JPWO2024089948 A1 JP WO2024089948A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024552828A
Other languages
Japanese (ja)
Other versions
JP7852736B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024089948A1 publication Critical patent/JPWO2024089948A1/ja
Application granted granted Critical
Publication of JP7852736B2 publication Critical patent/JP7852736B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP2024552828A 2022-10-28 2023-07-12 電子部品および電子部品の実装構造 Active JP7852736B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022173005 2022-10-28
JP2022173005 2022-10-28
PCT/JP2023/025663 WO2024089948A1 (ja) 2022-10-28 2023-07-12 電子部品および電子部品の実装構造

Publications (2)

Publication Number Publication Date
JPWO2024089948A1 true JPWO2024089948A1 (https=) 2024-05-02
JP7852736B2 JP7852736B2 (ja) 2026-04-28

Family

ID=90830548

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024552828A Active JP7852736B2 (ja) 2022-10-28 2023-07-12 電子部品および電子部品の実装構造

Country Status (5)

Country Link
US (1) US20240387105A1 (https=)
JP (1) JP7852736B2 (https=)
KR (1) KR20250038729A (https=)
CN (1) CN119923701A (https=)
WO (1) WO2024089948A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49129048U (https=) * 1973-03-06 1974-11-06
JPS5966189A (ja) * 1982-10-08 1984-04-14 株式会社日立製作所 部品実装方式
JPH0533568U (ja) * 1991-10-03 1993-04-30 三菱電機株式会社 リードレス部品実装構造
JPH1097942A (ja) * 1996-09-24 1998-04-14 Mitsubishi Materials Corp 積層磁器コンデンサ
JP2010153445A (ja) * 2008-12-24 2010-07-08 Murata Mfg Co Ltd 電子部品およびその製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS639122U (https=) * 1986-07-03 1988-01-21
JPH0917607A (ja) * 1995-06-26 1997-01-17 Taiyo Yuden Co Ltd チップ状回路部品とその製造方法
JP2000252606A (ja) * 1999-03-02 2000-09-14 Murata Mfg Co Ltd 電子部品および電子部品の実装構造
US6787884B2 (en) * 2002-05-30 2004-09-07 Matsushita Electric Industrial Co., Ltd. Circuit component, circuit component package, circuit component built-in module, circuit component package production and circuit component built-in module production
JP2014086606A (ja) 2012-10-25 2014-05-12 Taiyo Yuden Co Ltd 積層セラミックコンデンサの実装構造
JP2014096474A (ja) * 2012-11-09 2014-05-22 Murata Mfg Co Ltd 積層セラミックコンデンサ
JP6136605B2 (ja) * 2013-06-10 2017-05-31 株式会社デンソー 表面実装型半導体パッケージの実装構造
JP5958479B2 (ja) * 2014-01-31 2016-08-02 株式会社村田製作所 電子部品の実装構造体
KR20160108905A (ko) * 2015-03-09 2016-09-21 삼성전기주식회사 적층 세라믹 전자 부품 및 그 제조 방법
JP2017220523A (ja) * 2016-06-06 2017-12-14 株式会社村田製作所 積層セラミック電子部品
KR102624876B1 (ko) * 2019-08-28 2024-01-15 삼성전기주식회사 적층형 전자 부품
US11219121B2 (en) * 2020-01-08 2022-01-04 Honeywell International Inc. Circuit board assembly with electronic surface mount device and mount arrangement for thermal protection
JP7419406B2 (ja) * 2020-02-06 2024-01-22 田辺三菱製薬株式会社 Ｂｒｄ４蛋白質分解誘導作用を有するスルホンアミドあるいはスルフィンアミド化合物及びその医薬としての用途
JP2023098648A (ja) * 2021-12-28 2023-07-10 サムソン エレクトロ－メカニックス カンパニーリミテッド． 積層型電子部品

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49129048U (https=) * 1973-03-06 1974-11-06
JPS5966189A (ja) * 1982-10-08 1984-04-14 株式会社日立製作所 部品実装方式
JPH0533568U (ja) * 1991-10-03 1993-04-30 三菱電機株式会社 リードレス部品実装構造
JPH1097942A (ja) * 1996-09-24 1998-04-14 Mitsubishi Materials Corp 積層磁器コンデンサ
JP2010153445A (ja) * 2008-12-24 2010-07-08 Murata Mfg Co Ltd 電子部品およびその製造方法

Also Published As

Publication number Publication date
US20240387105A1 (en) 2024-11-21
WO2024089948A1 (ja) 2024-05-02
KR20250038729A (ko) 2025-03-19
CN119923701A (zh) 2025-05-02
JP7852736B2 (ja) 2026-04-28

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