CN119923701A - 电子部件以及电子部件的安装构造 - Google Patents

电子部件以及电子部件的安装构造 Download PDF

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Publication number
CN119923701A
CN119923701A CN202380067565.9A CN202380067565A CN119923701A CN 119923701 A CN119923701 A CN 119923701A CN 202380067565 A CN202380067565 A CN 202380067565A CN 119923701 A CN119923701 A CN 119923701A
Authority
CN
China
Prior art keywords
electronic component
pair
substrate
external electrode
land
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380067565.9A
Other languages
English (en)
Chinese (zh)
Inventor
武田基德
阿部庆之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of CN119923701A publication Critical patent/CN119923701A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
CN202380067565.9A 2022-10-28 2023-07-12 电子部件以及电子部件的安装构造 Pending CN119923701A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022173005 2022-10-28
JP2022-173005 2022-10-28
PCT/JP2023/025663 WO2024089948A1 (ja) 2022-10-28 2023-07-12 電子部品および電子部品の実装構造

Publications (1)

Publication Number Publication Date
CN119923701A true CN119923701A (zh) 2025-05-02

Family

ID=90830548

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380067565.9A Pending CN119923701A (zh) 2022-10-28 2023-07-12 电子部件以及电子部件的安装构造

Country Status (5)

Country Link
US (1) US20240387105A1 (https=)
JP (1) JP7852736B2 (https=)
KR (1) KR20250038729A (https=)
CN (1) CN119923701A (https=)
WO (1) WO2024089948A1 (https=)

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49129048U (https=) * 1973-03-06 1974-11-06
JPS5966189A (ja) * 1982-10-08 1984-04-14 株式会社日立製作所 部品実装方式
JPS639122U (https=) * 1986-07-03 1988-01-21
JPH0533568U (ja) * 1991-10-03 1993-04-30 三菱電機株式会社 リードレス部品実装構造
JPH0917607A (ja) * 1995-06-26 1997-01-17 Taiyo Yuden Co Ltd チップ状回路部品とその製造方法
JPH1097942A (ja) * 1996-09-24 1998-04-14 Mitsubishi Materials Corp 積層磁器コンデンサ
JP2000252606A (ja) * 1999-03-02 2000-09-14 Murata Mfg Co Ltd 電子部品および電子部品の実装構造
US6787884B2 (en) * 2002-05-30 2004-09-07 Matsushita Electric Industrial Co., Ltd. Circuit component, circuit component package, circuit component built-in module, circuit component package production and circuit component built-in module production
JP5228890B2 (ja) * 2008-12-24 2013-07-03 株式会社村田製作所 電子部品およびその製造方法
JP2014086606A (ja) 2012-10-25 2014-05-12 Taiyo Yuden Co Ltd 積層セラミックコンデンサの実装構造
JP2014096474A (ja) * 2012-11-09 2014-05-22 Murata Mfg Co Ltd 積層セラミックコンデンサ
JP6136605B2 (ja) * 2013-06-10 2017-05-31 株式会社デンソー 表面実装型半導体パッケージの実装構造
JP5958479B2 (ja) * 2014-01-31 2016-08-02 株式会社村田製作所 電子部品の実装構造体
KR20160108905A (ko) * 2015-03-09 2016-09-21 삼성전기주식회사 적층 세라믹 전자 부품 및 그 제조 방법
JP2017220523A (ja) * 2016-06-06 2017-12-14 株式会社村田製作所 積層セラミック電子部品
KR102624876B1 (ko) * 2019-08-28 2024-01-15 삼성전기주식회사 적층형 전자 부품
US11219121B2 (en) * 2020-01-08 2022-01-04 Honeywell International Inc. Circuit board assembly with electronic surface mount device and mount arrangement for thermal protection
JP7419406B2 (ja) * 2020-02-06 2024-01-22 田辺三菱製薬株式会社 Ｂｒｄ４蛋白質分解誘導作用を有するスルホンアミドあるいはスルフィンアミド化合物及びその医薬としての用途
JP2023098648A (ja) * 2021-12-28 2023-07-10 サムソン エレクトロ－メカニックス カンパニーリミテッド． 積層型電子部品

Also Published As

Publication number Publication date
US20240387105A1 (en) 2024-11-21
WO2024089948A1 (ja) 2024-05-02
KR20250038729A (ko) 2025-03-19
JPWO2024089948A1 (https=) 2024-05-02
JP7852736B2 (ja) 2026-04-28

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