KR20250038729A - 전자부품 및 전자부품의 실장 구조 - Google Patents

전자부품 및 전자부품의 실장 구조 Download PDF

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Publication number
KR20250038729A
KR20250038729A KR1020257004939A KR20257004939A KR20250038729A KR 20250038729 A KR20250038729 A KR 20250038729A KR 1020257004939 A KR1020257004939 A KR 1020257004939A KR 20257004939 A KR20257004939 A KR 20257004939A KR 20250038729 A KR20250038729 A KR 20250038729A
Authority
KR
South Korea
Prior art keywords
substrate
pair
external electrode
protrusion
land
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257004939A
Other languages
English (en)
Korean (ko)
Inventor
모토노리 타케다
요시유키 아베
Original Assignee
가부시키가이샤 무라타 세이사쿠쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 무라타 세이사쿠쇼 filed Critical 가부시키가이샤 무라타 세이사쿠쇼
Publication of KR20250038729A publication Critical patent/KR20250038729A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
KR1020257004939A 2022-10-28 2023-07-12 전자부품 및 전자부품의 실장 구조 Pending KR20250038729A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022173005 2022-10-28
JPJP-P-2022-173005 2022-10-28
PCT/JP2023/025663 WO2024089948A1 (ja) 2022-10-28 2023-07-12 電子部品および電子部品の実装構造

Publications (1)

Publication Number Publication Date
KR20250038729A true KR20250038729A (ko) 2025-03-19

Family

ID=90830548

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257004939A Pending KR20250038729A (ko) 2022-10-28 2023-07-12 전자부품 및 전자부품의 실장 구조

Country Status (5)

Country Link
US (1) US20240387105A1 (https=)
JP (1) JP7852736B2 (https=)
KR (1) KR20250038729A (https=)
CN (1) CN119923701A (https=)
WO (1) WO2024089948A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014086606A (ja) 2012-10-25 2014-05-12 Taiyo Yuden Co Ltd 積層セラミックコンデンサの実装構造

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49129048U (https=) * 1973-03-06 1974-11-06
JPS5966189A (ja) * 1982-10-08 1984-04-14 株式会社日立製作所 部品実装方式
JPS639122U (https=) * 1986-07-03 1988-01-21
JPH0533568U (ja) * 1991-10-03 1993-04-30 三菱電機株式会社 リードレス部品実装構造
JPH0917607A (ja) * 1995-06-26 1997-01-17 Taiyo Yuden Co Ltd チップ状回路部品とその製造方法
JPH1097942A (ja) * 1996-09-24 1998-04-14 Mitsubishi Materials Corp 積層磁器コンデンサ
JP2000252606A (ja) * 1999-03-02 2000-09-14 Murata Mfg Co Ltd 電子部品および電子部品の実装構造
US6787884B2 (en) * 2002-05-30 2004-09-07 Matsushita Electric Industrial Co., Ltd. Circuit component, circuit component package, circuit component built-in module, circuit component package production and circuit component built-in module production
JP5228890B2 (ja) * 2008-12-24 2013-07-03 株式会社村田製作所 電子部品およびその製造方法
JP2014096474A (ja) * 2012-11-09 2014-05-22 Murata Mfg Co Ltd 積層セラミックコンデンサ
JP6136605B2 (ja) * 2013-06-10 2017-05-31 株式会社デンソー 表面実装型半導体パッケージの実装構造
JP5958479B2 (ja) * 2014-01-31 2016-08-02 株式会社村田製作所 電子部品の実装構造体
KR20160108905A (ko) * 2015-03-09 2016-09-21 삼성전기주식회사 적층 세라믹 전자 부품 및 그 제조 방법
JP2017220523A (ja) * 2016-06-06 2017-12-14 株式会社村田製作所 積層セラミック電子部品
KR102624876B1 (ko) * 2019-08-28 2024-01-15 삼성전기주식회사 적층형 전자 부품
US11219121B2 (en) * 2020-01-08 2022-01-04 Honeywell International Inc. Circuit board assembly with electronic surface mount device and mount arrangement for thermal protection
JP7419406B2 (ja) * 2020-02-06 2024-01-22 田辺三菱製薬株式会社 Ｂｒｄ４蛋白質分解誘導作用を有するスルホンアミドあるいはスルフィンアミド化合物及びその医薬としての用途
JP2023098648A (ja) * 2021-12-28 2023-07-10 サムソン エレクトロ－メカニックス カンパニーリミテッド． 積層型電子部品

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014086606A (ja) 2012-10-25 2014-05-12 Taiyo Yuden Co Ltd 積層セラミックコンデンサの実装構造

Also Published As

Publication number Publication date
US20240387105A1 (en) 2024-11-21
WO2024089948A1 (ja) 2024-05-02
JPWO2024089948A1 (https=) 2024-05-02
CN119923701A (zh) 2025-05-02
JP7852736B2 (ja) 2026-04-28

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