JPWO2023058487A1 - - Google Patents
Info
- Publication number
- JPWO2023058487A1 JPWO2023058487A1 JP2023552807A JP2023552807A JPWO2023058487A1 JP WO2023058487 A1 JPWO2023058487 A1 JP WO2023058487A1 JP 2023552807 A JP2023552807 A JP 2023552807A JP 2023552807 A JP2023552807 A JP 2023552807A JP WO2023058487 A1 JPWO2023058487 A1 JP WO2023058487A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/65—Shapes or dispositions of interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/0198—Manufacture or treatment batch processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021163439 | 2021-10-04 | ||
| PCT/JP2022/035702 WO2023058487A1 (ja) | 2021-10-04 | 2022-09-26 | 電子装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023058487A1 true JPWO2023058487A1 (https=) | 2023-04-13 |
| JPWO2023058487A5 JPWO2023058487A5 (https=) | 2024-06-25 |
Family
ID=85804238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023552807A Pending JPWO2023058487A1 (https=) | 2021-10-04 | 2022-09-26 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240234230A1 (https=) |
| JP (1) | JPWO2023058487A1 (https=) |
| CN (1) | CN118056276A (https=) |
| DE (1) | DE112022004808T5 (https=) |
| WO (1) | WO2023058487A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4549318B2 (ja) * | 2006-06-29 | 2010-09-22 | アオイ電子株式会社 | 半導体装置および半導体装置の製造方法 |
| JP5259978B2 (ja) | 2006-10-04 | 2013-08-07 | ローム株式会社 | 半導体装置の製造方法 |
| JP6535509B2 (ja) * | 2014-05-12 | 2019-06-26 | ローム株式会社 | 半導体装置 |
| JP7179526B2 (ja) * | 2018-08-10 | 2022-11-29 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
| WO2020262533A1 (ja) * | 2019-06-28 | 2020-12-30 | ローム株式会社 | 電子装置および電子装置の実装構造 |
-
2022
- 2022-09-26 JP JP2023552807A patent/JPWO2023058487A1/ja active Pending
- 2022-09-26 CN CN202280067219.6A patent/CN118056276A/zh active Pending
- 2022-09-26 DE DE112022004808.5T patent/DE112022004808T5/de active Pending
- 2022-09-26 WO PCT/JP2022/035702 patent/WO2023058487A1/ja not_active Ceased
-
2024
- 2024-03-26 US US18/617,040 patent/US20240234230A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023058487A1 (ja) | 2023-04-13 |
| US20240234230A1 (en) | 2024-07-11 |
| CN118056276A (zh) | 2024-05-17 |
| DE112022004808T5 (de) | 2024-07-18 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240308 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250919 |