CN118541798A - 半导体装置以及半导体装置的制造方法 - Google Patents

半导体装置以及半导体装置的制造方法 Download PDF

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Publication number
CN118541798A
CN118541798A CN202280081370.5A CN202280081370A CN118541798A CN 118541798 A CN118541798 A CN 118541798A CN 202280081370 A CN202280081370 A CN 202280081370A CN 118541798 A CN118541798 A CN 118541798A
Authority
CN
China
Prior art keywords
semiconductor device
resin
sealing resin
thickness direction
terminal portions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280081370.5A
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English (en)
Chinese (zh)
Inventor
青山宏明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of CN118541798A publication Critical patent/CN118541798A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/468—Circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/726—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN202280081370.5A 2021-12-13 2022-11-30 半导体装置以及半导体装置的制造方法 Pending CN118541798A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021201802 2021-12-13
JP2021-201802 2021-12-13
PCT/JP2022/044165 WO2023112677A1 (ja) 2021-12-13 2022-11-30 半導体装置および半導体装置の製造方法

Publications (1)

Publication Number Publication Date
CN118541798A true CN118541798A (zh) 2024-08-23

Family

ID=86774201

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280081370.5A Pending CN118541798A (zh) 2021-12-13 2022-11-30 半导体装置以及半导体装置的制造方法

Country Status (5)

Country Link
US (1) US20240312878A1 (https=)
JP (1) JPWO2023112677A1 (https=)
CN (1) CN118541798A (https=)
DE (1) DE112022005438T5 (https=)
WO (1) WO2023112677A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025047268A1 (ja) * 2023-08-25 2025-03-06 ローム株式会社 半導体装置
CN118380338A (zh) * 2024-04-26 2024-07-23 强茂电子(无锡)有限公司 一种无引脚半导体封装器件的制作方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10366948B2 (en) * 2016-03-17 2019-07-30 Rohm Co., Ltd. Semiconductor device and method for manufacturing the same
JP2018085487A (ja) * 2016-11-25 2018-05-31 マクセルホールディングス株式会社 半導体装置の製造方法および半導体装置
JP6909629B2 (ja) 2017-05-10 2021-07-28 ローム株式会社 半導体装置
JP2021027211A (ja) * 2019-08-07 2021-02-22 ローム株式会社 電子装置
JP2021158317A (ja) * 2020-03-30 2021-10-07 ローム株式会社 半導体装置

Also Published As

Publication number Publication date
WO2023112677A1 (ja) 2023-06-22
JPWO2023112677A1 (https=) 2023-06-22
US20240312878A1 (en) 2024-09-19
DE112022005438T5 (de) 2024-08-29

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