JPWO2023112677A1 - - Google Patents
Info
- Publication number
- JPWO2023112677A1 JPWO2023112677A1 JP2023567670A JP2023567670A JPWO2023112677A1 JP WO2023112677 A1 JPWO2023112677 A1 JP WO2023112677A1 JP 2023567670 A JP2023567670 A JP 2023567670A JP 2023567670 A JP2023567670 A JP 2023567670A JP WO2023112677 A1 JPWO2023112677 A1 JP WO2023112677A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P54/00—Cutting or separating of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/464—Additional interconnections in combination with leadframes
- H10W70/468—Circuit boards
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/04—Manufacture or treatment of leadframes
- H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
- H10W74/016—Manufacture or treatment using moulds
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/726—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021201802 | 2021-12-13 | ||
| PCT/JP2022/044165 WO2023112677A1 (ja) | 2021-12-13 | 2022-11-30 | 半導体装置および半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023112677A1 true JPWO2023112677A1 (https=) | 2023-06-22 |
| JPWO2023112677A5 JPWO2023112677A5 (https=) | 2024-08-26 |
Family
ID=86774201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023567670A Pending JPWO2023112677A1 (https=) | 2021-12-13 | 2022-11-30 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240312878A1 (https=) |
| JP (1) | JPWO2023112677A1 (https=) |
| CN (1) | CN118541798A (https=) |
| DE (1) | DE112022005438T5 (https=) |
| WO (1) | WO2023112677A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025047268A1 (ja) * | 2023-08-25 | 2025-03-06 | ローム株式会社 | 半導体装置 |
| CN118380338A (zh) * | 2024-04-26 | 2024-07-23 | 强茂电子(无锡)有限公司 | 一种无引脚半导体封装器件的制作方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10366948B2 (en) * | 2016-03-17 | 2019-07-30 | Rohm Co., Ltd. | Semiconductor device and method for manufacturing the same |
| JP2018085487A (ja) * | 2016-11-25 | 2018-05-31 | マクセルホールディングス株式会社 | 半導体装置の製造方法および半導体装置 |
| JP6909629B2 (ja) | 2017-05-10 | 2021-07-28 | ローム株式会社 | 半導体装置 |
| JP2021027211A (ja) * | 2019-08-07 | 2021-02-22 | ローム株式会社 | 電子装置 |
| JP2021158317A (ja) * | 2020-03-30 | 2021-10-07 | ローム株式会社 | 半導体装置 |
-
2022
- 2022-11-30 WO PCT/JP2022/044165 patent/WO2023112677A1/ja not_active Ceased
- 2022-11-30 DE DE112022005438.7T patent/DE112022005438T5/de active Pending
- 2022-11-30 CN CN202280081370.5A patent/CN118541798A/zh active Pending
- 2022-11-30 JP JP2023567670A patent/JPWO2023112677A1/ja active Pending
-
2024
- 2024-05-29 US US18/677,332 patent/US20240312878A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023112677A1 (ja) | 2023-06-22 |
| CN118541798A (zh) | 2024-08-23 |
| US20240312878A1 (en) | 2024-09-19 |
| DE112022005438T5 (de) | 2024-08-29 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240515 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20251125 |