JPWO2022224811A5 - - Google Patents

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Publication number
JPWO2022224811A5
JPWO2022224811A5 JP2023516422A JP2023516422A JPWO2022224811A5 JP WO2022224811 A5 JPWO2022224811 A5 JP WO2022224811A5 JP 2023516422 A JP2023516422 A JP 2023516422A JP 2023516422 A JP2023516422 A JP 2023516422A JP WO2022224811 A5 JPWO2022224811 A5 JP WO2022224811A5
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JP
Japan
Prior art keywords
lead
semiconductor device
sealing resin
exposed
thickness direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023516422A
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English (en)
Japanese (ja)
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JPWO2022224811A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/017044 external-priority patent/WO2022224811A1/ja
Publication of JPWO2022224811A1 publication Critical patent/JPWO2022224811A1/ja
Publication of JPWO2022224811A5 publication Critical patent/JPWO2022224811A5/ja
Pending legal-status Critical Current

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JP2023516422A 2021-04-19 2022-04-04 Pending JPWO2022224811A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021070259 2021-04-19
PCT/JP2022/017044 WO2022224811A1 (ja) 2021-04-19 2022-04-04 半導体装置、および半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPWO2022224811A1 JPWO2022224811A1 (https=) 2022-10-27
JPWO2022224811A5 true JPWO2022224811A5 (https=) 2025-03-21

Family

ID=83722212

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023516422A Pending JPWO2022224811A1 (https=) 2021-04-19 2022-04-04

Country Status (5)

Country Link
US (1) US20230395451A1 (https=)
JP (1) JPWO2022224811A1 (https=)
CN (1) CN117121191A (https=)
DE (1) DE112022001601T5 (https=)
WO (1) WO2022224811A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118380338A (zh) * 2024-04-26 2024-07-23 强茂电子(无锡)有限公司 一种无引脚半导体封装器件的制作方法
CN221885104U (zh) * 2024-04-26 2024-10-22 强茂电子(无锡)有限公司 一种无引脚半导体引线框架

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3920753B2 (ja) * 2002-10-18 2007-05-30 株式会社ルネサステクノロジ 半導体装置及びそれを組み込んだ電子装置
US6927483B1 (en) * 2003-03-07 2005-08-09 Amkor Technology, Inc. Semiconductor package exhibiting efficient lead placement
JP2010010581A (ja) * 2008-06-30 2010-01-14 Sanken Electric Co Ltd 半導体装置及びその製造方法
JP6636846B2 (ja) * 2016-04-14 2020-01-29 ローム株式会社 半導体装置および半導体装置の製造方法
EP3624180A4 (en) * 2017-05-09 2020-04-01 Mitsubishi Electric Corporation SEMICONDUCTOR COMPONENT AND METHOD FOR THE PRODUCTION THEREOF
JP7089388B2 (ja) * 2018-03-29 2022-06-22 ローム株式会社 半導体装置および半導体装置の製造方法
JP7179526B2 (ja) 2018-08-10 2022-11-29 ローム株式会社 半導体装置および半導体装置の製造方法
US11887916B2 (en) * 2020-09-09 2024-01-30 Amkor Technology Singapore Holding Pte. Ltd. Semiconductor devices and methods of manufacturing semiconductor devices
JP7621130B2 (ja) * 2021-02-09 2025-01-24 エイブリック株式会社 半導体装置

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