JP2024002572A5 - - Google Patents
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- JP2024002572A5 JP2024002572A5 JP2022101843A JP2022101843A JP2024002572A5 JP 2024002572 A5 JP2024002572 A5 JP 2024002572A5 JP 2022101843 A JP2022101843 A JP 2022101843A JP 2022101843 A JP2022101843 A JP 2022101843A JP 2024002572 A5 JP2024002572 A5 JP 2024002572A5
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- semiconductor element
- planarization layer
- semiconductor device
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Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022101843A JP7790282B2 (ja) | 2022-06-24 | 2022-06-24 | 半導体装置及び半導体装置製造方法 |
| CN202310521890.XA CN117293246A (zh) | 2022-06-24 | 2023-05-10 | 半导体装置、半导体装置制造方法和led显示器 |
| US18/320,618 US20230420427A1 (en) | 2022-06-24 | 2023-05-19 | Semiconductor device, method of manufacturing the same, and led display device |
| TW112118920A TWI853584B (zh) | 2022-06-24 | 2023-05-22 | 半導體裝置及其製造方法和led顯示裝置 |
| EP23174426.9A EP4312268A1 (en) | 2022-06-24 | 2023-05-22 | Semiconductor device, method of manufacturing the same, and led display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022101843A JP7790282B2 (ja) | 2022-06-24 | 2022-06-24 | 半導体装置及び半導体装置製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2024002572A JP2024002572A (ja) | 2024-01-11 |
| JP2024002572A5 true JP2024002572A5 (https=) | 2024-12-18 |
| JP7790282B2 JP7790282B2 (ja) | 2025-12-23 |
Family
ID=86497428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022101843A Active JP7790282B2 (ja) | 2022-06-24 | 2022-06-24 | 半導体装置及び半導体装置製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20230420427A1 (https=) |
| EP (1) | EP4312268A1 (https=) |
| JP (1) | JP7790282B2 (https=) |
| CN (1) | CN117293246A (https=) |
| TW (1) | TWI853584B (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI883828B (zh) * | 2024-02-20 | 2025-05-11 | 晶呈科技股份有限公司 | 垂直型發光二極體封裝結構及其製備方法 |
| TWI906005B (zh) * | 2024-10-28 | 2025-11-21 | 聯華電子股份有限公司 | 半導體結構及其製作方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2959566B1 (ja) | 1998-09-08 | 1999-10-06 | 日本電気株式会社 | フラットパネルディスプレイ |
| JP4555880B2 (ja) | 2008-09-04 | 2010-10-06 | 株式会社沖データ | 積層半導体発光装置及び画像形成装置 |
| JP2013235924A (ja) | 2012-05-08 | 2013-11-21 | Sharp Corp | 半導体基板、半導体装置、および半導体基板の接合方法 |
| US9281242B2 (en) * | 2012-10-25 | 2016-03-08 | Nanya Technology Corp. | Through silicon via stacked structure and a method of manufacturing the same |
| KR102423813B1 (ko) * | 2015-11-27 | 2022-07-22 | 삼성전자주식회사 | 반도체 소자 |
| JP2017139316A (ja) | 2016-02-03 | 2017-08-10 | ソニー株式会社 | 半導体装置および製造方法、並びに電子機器 |
| US11367713B2 (en) | 2017-10-13 | 2022-06-21 | PlayNitride Display Co., Ltd. | Micro light emitting device display apparatus |
| TWI878020B (zh) * | 2017-12-25 | 2025-03-21 | 晶元光電股份有限公司 | 一種發光元件及其發光裝置 |
| FR3094568B1 (fr) * | 2019-03-29 | 2022-04-22 | Commissariat Energie Atomique | Procédé de fabrication d'un écran d'affichage émissif à LED tridimensionnelles |
| FR3109018A1 (fr) * | 2020-04-06 | 2021-10-08 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dispositif a matrice de diodes photo-emettrices et/ou photo-receptrices |
| JP2022023263A (ja) | 2020-07-27 | 2022-02-08 | 沖電気工業株式会社 | 発光装置、発光ディスプレイ、及び画像表示装置 |
-
2022
- 2022-06-24 JP JP2022101843A patent/JP7790282B2/ja active Active
-
2023
- 2023-05-10 CN CN202310521890.XA patent/CN117293246A/zh active Pending
- 2023-05-19 US US18/320,618 patent/US20230420427A1/en active Pending
- 2023-05-22 EP EP23174426.9A patent/EP4312268A1/en active Pending
- 2023-05-22 TW TW112118920A patent/TWI853584B/zh active
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