JPWO2023100754A5 - - Google Patents
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- Publication number
- JPWO2023100754A5 JPWO2023100754A5 JP2023564928A JP2023564928A JPWO2023100754A5 JP WO2023100754 A5 JPWO2023100754 A5 JP WO2023100754A5 JP 2023564928 A JP2023564928 A JP 2023564928A JP 2023564928 A JP2023564928 A JP 2023564928A JP WO2023100754 A5 JPWO2023100754 A5 JP WO2023100754A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- surface portion
- terminal portions
- side portion
- facing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 22
- 239000002184 metal Substances 0.000 claims 4
- 239000011347 resin Substances 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
- 238000007789 sealing Methods 0.000 claims 4
- 239000000463 material Substances 0.000 claims 3
- 238000007747 plating Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021196624 | 2021-12-03 | ||
| PCT/JP2022/043496 WO2023100754A1 (ja) | 2021-12-03 | 2022-11-25 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023100754A1 JPWO2023100754A1 (https=) | 2023-06-08 |
| JPWO2023100754A5 true JPWO2023100754A5 (https=) | 2024-08-15 |
Family
ID=86612155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023564928A Pending JPWO2023100754A1 (https=) | 2021-12-03 | 2022-11-25 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240282690A1 (https=) |
| JP (1) | JPWO2023100754A1 (https=) |
| CN (1) | CN118355490A (https=) |
| DE (1) | DE112022005309T5 (https=) |
| WO (1) | WO2023100754A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008106339A (ja) * | 2006-10-27 | 2008-05-08 | Renesas Technology Corp | 半導体装置の製造方法 |
| JP6121692B2 (ja) * | 2012-11-05 | 2017-04-26 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| JP6518547B2 (ja) * | 2015-08-07 | 2019-05-22 | 新光電気工業株式会社 | リードフレーム、半導体装置及びリードフレームの製造方法 |
| JP6721346B2 (ja) | 2016-01-27 | 2020-07-15 | ローム株式会社 | 半導体装置 |
| JP7001503B2 (ja) * | 2018-01-15 | 2022-01-19 | ローム株式会社 | 半導体装置、および半導体装置の製造方法 |
| JP7626754B2 (ja) * | 2020-03-30 | 2025-02-04 | ローム株式会社 | 半導体装置 |
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2022
- 2022-11-25 DE DE112022005309.7T patent/DE112022005309T5/de active Pending
- 2022-11-25 JP JP2023564928A patent/JPWO2023100754A1/ja active Pending
- 2022-11-25 WO PCT/JP2022/043496 patent/WO2023100754A1/ja not_active Ceased
- 2022-11-25 CN CN202280079326.0A patent/CN118355490A/zh active Pending
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2024
- 2024-05-01 US US18/652,315 patent/US20240282690A1/en active Pending