JPWO2023100754A1 - - Google Patents
Info
- Publication number
- JPWO2023100754A1 JPWO2023100754A1 JP2023564928A JP2023564928A JPWO2023100754A1 JP WO2023100754 A1 JPWO2023100754 A1 JP WO2023100754A1 JP 2023564928 A JP2023564928 A JP 2023564928A JP 2023564928 A JP2023564928 A JP 2023564928A JP WO2023100754 A1 JPWO2023100754 A1 JP WO2023100754A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/65—Shapes or dispositions of interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021196624 | 2021-12-03 | ||
| PCT/JP2022/043496 WO2023100754A1 (ja) | 2021-12-03 | 2022-11-25 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023100754A1 true JPWO2023100754A1 (https=) | 2023-06-08 |
| JPWO2023100754A5 JPWO2023100754A5 (https=) | 2024-08-15 |
Family
ID=86612155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023564928A Pending JPWO2023100754A1 (https=) | 2021-12-03 | 2022-11-25 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240282690A1 (https=) |
| JP (1) | JPWO2023100754A1 (https=) |
| CN (1) | CN118355490A (https=) |
| DE (1) | DE112022005309T5 (https=) |
| WO (1) | WO2023100754A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008106339A (ja) * | 2006-10-27 | 2008-05-08 | Renesas Technology Corp | 半導体装置の製造方法 |
| JP6121692B2 (ja) * | 2012-11-05 | 2017-04-26 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| JP6518547B2 (ja) * | 2015-08-07 | 2019-05-22 | 新光電気工業株式会社 | リードフレーム、半導体装置及びリードフレームの製造方法 |
| JP6721346B2 (ja) | 2016-01-27 | 2020-07-15 | ローム株式会社 | 半導体装置 |
| JP7001503B2 (ja) * | 2018-01-15 | 2022-01-19 | ローム株式会社 | 半導体装置、および半導体装置の製造方法 |
| JP7626754B2 (ja) * | 2020-03-30 | 2025-02-04 | ローム株式会社 | 半導体装置 |
-
2022
- 2022-11-25 DE DE112022005309.7T patent/DE112022005309T5/de active Pending
- 2022-11-25 JP JP2023564928A patent/JPWO2023100754A1/ja active Pending
- 2022-11-25 WO PCT/JP2022/043496 patent/WO2023100754A1/ja not_active Ceased
- 2022-11-25 CN CN202280079326.0A patent/CN118355490A/zh active Pending
-
2024
- 2024-05-01 US US18/652,315 patent/US20240282690A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN118355490A (zh) | 2024-07-16 |
| DE112022005309T5 (de) | 2024-08-29 |
| US20240282690A1 (en) | 2024-08-22 |
| WO2023100754A1 (ja) | 2023-06-08 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240417 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20251119 |