DE112022005309T5 - Halbleiterbauteil - Google Patents

Halbleiterbauteil Download PDF

Info

Publication number
DE112022005309T5
DE112022005309T5 DE112022005309.7T DE112022005309T DE112022005309T5 DE 112022005309 T5 DE112022005309 T5 DE 112022005309T5 DE 112022005309 T DE112022005309 T DE 112022005309T DE 112022005309 T5 DE112022005309 T5 DE 112022005309T5
Authority
DE
Germany
Prior art keywords
terminal
side portion
semiconductor device
terminal portions
portions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112022005309.7T
Other languages
German (de)
English (en)
Inventor
Kota ISE
Koshun SAITO
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of DE112022005309T5 publication Critical patent/DE112022005309T5/de
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
DE112022005309.7T 2021-12-03 2022-11-25 Halbleiterbauteil Pending DE112022005309T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-196624 2021-12-03
JP2021196624 2021-12-03
PCT/JP2022/043496 WO2023100754A1 (ja) 2021-12-03 2022-11-25 半導体装置

Publications (1)

Publication Number Publication Date
DE112022005309T5 true DE112022005309T5 (de) 2024-08-29

Family

ID=86612155

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112022005309.7T Pending DE112022005309T5 (de) 2021-12-03 2022-11-25 Halbleiterbauteil

Country Status (5)

Country Link
US (1) US20240282690A1 (https=)
JP (1) JPWO2023100754A1 (https=)
CN (1) CN118355490A (https=)
DE (1) DE112022005309T5 (https=)
WO (1) WO2023100754A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017135241A (ja) 2016-01-27 2017-08-03 ローム株式会社 半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008106339A (ja) * 2006-10-27 2008-05-08 Renesas Technology Corp 半導体装置の製造方法
JP6121692B2 (ja) * 2012-11-05 2017-04-26 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP6518547B2 (ja) * 2015-08-07 2019-05-22 新光電気工業株式会社 リードフレーム、半導体装置及びリードフレームの製造方法
JP7001503B2 (ja) * 2018-01-15 2022-01-19 ローム株式会社 半導体装置、および半導体装置の製造方法
JP7626754B2 (ja) * 2020-03-30 2025-02-04 ローム株式会社 半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017135241A (ja) 2016-01-27 2017-08-03 ローム株式会社 半導体装置

Also Published As

Publication number Publication date
CN118355490A (zh) 2024-07-16
JPWO2023100754A1 (https=) 2023-06-08
US20240282690A1 (en) 2024-08-22
WO2023100754A1 (ja) 2023-06-08

Similar Documents

Publication Publication Date Title
DE69627788T2 (de) Halbleiteranordnung mit einem Leitergitter und einer Wärmesenke
DE112019005155B4 (de) Halbleitervorrichtung
DE3913221A1 (de) Halbleiteranordnung
DE102018206482B4 (de) Halbleiterbauelement mit einem Verbundwerkstoffclip aus Verbundmaterial
DE112019003664T5 (de) Halbleiterbauteil und verfahren zur herstellung eines halbleiterbauteils
DE112021002694T5 (de) Halbleiterbauteil und verfahren zur herstellung des halbleiterbauteils
DE102017207727A1 (de) Halbleiteranordnung
DE102005039165B4 (de) Draht- und streifengebondetes Halbleiterleistungsbauteil und Verfahren zu dessen Herstellung
DE112021004922T5 (de) Halbleiterbauelement
DE112022005438T5 (de) Halbleiterbauteil und Verfahren zur Herstellung des Halbleiterbauteils
DE102015223300B4 (de) Halbleitervorrichtung
DE112022005176T5 (de) Halbleiterbauteil
DE112022000871T5 (de) Halbleiterbauelement
DE112022001601T5 (de) Halbleiterbauteil und herstellungsverfahren für das halbleiterbauteil
DE112018005048T5 (de) Chip mit integrierter schaltung (ic), der zwischen einem offset-leiterrahmen-chip-befestigungspad und einem diskreten chip-befestigungspad befestigt ist
DE112022005309T5 (de) Halbleiterbauteil
DE112006000568T5 (de) Leistungshalbleiterbaugruppe
DE112022005210T5 (de) Halbleiterbauteil
DE102023102543A1 (de) Leiterrahmen einer Halbleitervorrichtung, integrierter Leiterrahmen einer Halbleitervorrichtung und Halbleitervorrichtung
DE212018000086U1 (de) Halbleitervorrichtung
DE112022002459T5 (de) Halbleiterbauteil
DE102021104793B4 (de) Leistungshalbleitermodul mit externem kontaktelement
DE112021002959T5 (de) Montagestruktur für halbleitermodule
DE102005011159B4 (de) Halbleiterbauteil mit oberflächenmontierbaren Außenkontaktflächen und Verfahren zur Herstellung desselben
DE10303933B4 (de) Halbleiterbauelement mit verringerter anschlussbedingter parasitärer Induktivität und/oder Kapazität

Legal Events

Date Code Title Description
R012 Request for examination validly filed
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0023495000

Ipc: H10W0070400000