JPWO2023176267A5 - - Google Patents
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- Publication number
- JPWO2023176267A5 JPWO2023176267A5 JP2024507606A JP2024507606A JPWO2023176267A5 JP WO2023176267 A5 JPWO2023176267 A5 JP WO2023176267A5 JP 2024507606 A JP2024507606 A JP 2024507606A JP 2024507606 A JP2024507606 A JP 2024507606A JP WO2023176267 A5 JPWO2023176267 A5 JP WO2023176267A5
- Authority
- JP
- Japan
- Prior art keywords
- lead
- pad portion
- semiconductor device
- terminal portion
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 23
- 239000011347 resin Substances 0.000 claims 9
- 229920005989 resin Polymers 0.000 claims 9
- 238000007789 sealing Methods 0.000 claims 9
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022043176 | 2022-03-17 | ||
| PCT/JP2023/005252 WO2023176267A1 (ja) | 2022-03-17 | 2023-02-15 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023176267A1 JPWO2023176267A1 (https=) | 2023-09-21 |
| JPWO2023176267A5 true JPWO2023176267A5 (https=) | 2024-11-21 |
Family
ID=88022911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024507606A Pending JPWO2023176267A1 (https=) | 2022-03-17 | 2023-02-15 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20240429133A1 (https=) |
| JP (1) | JPWO2023176267A1 (https=) |
| WO (1) | WO2023176267A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6010651A (ja) * | 1983-06-30 | 1985-01-19 | Toshiba Corp | 半導体装置 |
| JP2001326295A (ja) * | 2000-05-15 | 2001-11-22 | Rohm Co Ltd | 半導体装置および半導体装置製造用フレーム |
| JP4705881B2 (ja) * | 2006-05-09 | 2011-06-22 | パナソニック株式会社 | リードフレーム及びそれを用いた半導体装置 |
| JP2009032767A (ja) * | 2007-07-25 | 2009-02-12 | Toshiba Corp | 半導体装置及びその製造方法 |
-
2023
- 2023-02-15 WO PCT/JP2023/005252 patent/WO2023176267A1/ja not_active Ceased
- 2023-02-15 JP JP2024507606A patent/JPWO2023176267A1/ja active Pending
-
2024
- 2024-09-10 US US18/829,980 patent/US20240429133A1/en active Pending
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