WO2023176267A1 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
WO2023176267A1
WO2023176267A1 PCT/JP2023/005252 JP2023005252W WO2023176267A1 WO 2023176267 A1 WO2023176267 A1 WO 2023176267A1 JP 2023005252 W JP2023005252 W JP 2023005252W WO 2023176267 A1 WO2023176267 A1 WO 2023176267A1
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WO
WIPO (PCT)
Prior art keywords
pad
lead
terminal portion
semiconductor device
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/005252
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English (en)
French (fr)
Japanese (ja)
Inventor
常久 大野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP2024507606A priority Critical patent/JPWO2023176267A1/ja
Publication of WO2023176267A1 publication Critical patent/WO2023176267A1/ja
Priority to US18/829,980 priority patent/US20240429133A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/755—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a laterally-adjacent insulating package substrate, interpose or RDL

Definitions

  • the present disclosure relates to a semiconductor device.
  • Patent Document 1 discloses an example of a semiconductor device whose package format is SOP (Small Outline Package).
  • the semiconductor device includes a semiconductor chip, a plurality of leads, a plurality of wires conductively joined to the semiconductor chip and the plurality of leads, and a sealing resin that covers the semiconductor chip.
  • Each of the plurality of leads includes a portion (outer lead) exposed from the sealing resin.
  • Each of the plurality of wires is electrically conductively bonded to a portion (inner lead) covered with a sealing resin of one of the plurality of leads.
  • An object of the present disclosure is to provide a semiconductor device that is improved over the conventional semiconductor device.
  • the present disclosure provides a semiconductor device that can freely set the interval between the parts of two adjacent leads exposed from the sealing resin while ensuring the bonding area of the leads to the wires. Our number one challenge is to provide this.
  • a semiconductor device provided by one aspect of the present disclosure includes a semiconductor element having a plurality of electrodes, a first pad portion, and a first terminal portion connected to one side of the first pad portion in a first direction. a second pad portion located next to the first pad portion in a second direction perpendicular to the first direction; and a second pad portion located next to the first terminal portion in the second direction. , and a second terminal portion connected to the second pad portion; a plurality of second leads having a second lead having a second terminal portion connected to the second pad portion; A sealing resin that covers a wire, a portion of each of the first lead and the second lead, and the semiconductor element is provided. A portion of each of the first terminal portion and the second terminal portion is exposed to the outside from the sealing resin.
  • a straight line length connecting the center of the first pad part and the center of the second pad part is a first section length
  • the straight line length connecting the center of the first terminal part and the center of the second terminal part is the second section length when viewed in the third direction, then the second section length is equal to the first section length. different from.
  • FIG. 1 is a plan view of a semiconductor device according to a first embodiment of the present disclosure.
  • FIG. 2 is a plan view corresponding to FIG. 1, through which the sealing resin is seen.
  • FIG. 3 is a bottom view of the semiconductor device shown in FIG. 1.
  • 4 is a right side view of the semiconductor device shown in FIG. 1.
  • FIG. 5 is a front view of the semiconductor device shown in FIG. 1.
  • FIG. 6 is a cross-sectional view taken along line VI-VI in FIG.
  • FIG. 7 is a cross-sectional view taken along line VII-VII in FIG.
  • FIG. 8 is a partially enlarged view of FIG. 2.
  • FIG. 9 is a partially enlarged view of FIG. 8.
  • FIG. 10 is a plan view of a semiconductor device according to a second embodiment of the present disclosure, through which the sealing resin is seen.
  • FIG. 11 is a front view of the semiconductor device shown in FIG. 10.
  • FIG. 12 is a partially enlarged view of FIG. 10.
  • a semiconductor device A10 according to a first embodiment of the present disclosure will be described based on FIGS. 1 to 9.
  • the semiconductor device A10 is surface mounted on wiring boards of various electronic devices.
  • the package format of the semiconductor device A10 is SOP.
  • the semiconductor device A10 includes a die pad 10, a semiconductor element 20, a bonding layer 29, a first lead 31, a second lead 32, a third lead 33, a fourth lead 34, a fifth lead 35, a plurality of sixth leads 36, and a plurality of sixth leads 36.
  • a wire 40 and a sealing resin 50 are provided.
  • first direction x An example of a direction perpendicular to the first direction x is referred to as a "second direction y.”
  • second direction y An example of a direction perpendicular to the first direction x and the second direction y is referred to as a "third direction z.”
  • the third direction z is an example of the normal direction of the mounting surface 111 of the pad portion 11 of the die pad 10, which will be described later.
  • the sealing resin 50 covers a portion of the die pad 10, the semiconductor element 20, and the plurality of wires 40, as shown in FIGS. 6 and 7. Furthermore, the sealing resin 50 covers a portion of each of the first lead 31 , the second lead 32 , the third lead 33 , the fourth lead 34 , the fifth lead 35 , and the plurality of sixth leads 36 .
  • the sealing resin 50 has electrical insulation properties.
  • the sealing resin 50 includes, for example, black epoxy resin. As shown in FIGS. 4 and 5, the sealing resin 50 has a top surface 51, a bottom surface 52, a first side surface 53, a second side surface 54, and two third side surfaces 55.
  • the top surface 51 faces one side in the third direction z.
  • the direction in which the top surface 51 faces is the same as the direction in which the mounting surface 111 of the pad portion 11 of the die pad 10, which will be described later, faces.
  • the bottom surface 52 faces opposite to the top surface 51 in the third direction z.
  • the first side surface 53 faces one side in the first direction x.
  • the second side surface 54 faces opposite to the first side surface 53 in the first direction x.
  • the first side surface 53 and the second side surface 54 are connected to the top surface 51 and the bottom surface 52.
  • the two third side surfaces 55 face opposite to each other in the second direction y.
  • the two third side surfaces 55 are connected to the top surface 51 and the bottom surface 52. Both sides of each of the two third side surfaces 55 in the first direction x are connected to the first side surface 53 and the second side surface 54 .
  • the die pad 10 has a semiconductor element 20 mounted thereon, as shown in FIGS. 2, 6, and 7.
  • the die pad 10 is located between the first lead 31 and the plurality of sixth leads 36 in the first direction x. Furthermore, the die pad 10 is located on the opposite side from the first terminal portion 312 of the first lead 31 (described later) with respect to the first pad portion 311 of the first lead 31 (described later) in the first direction x.
  • Die pad 10 includes a metal element.
  • the metal element is, for example, copper (Cu).
  • the die pad 10, the first lead 31, the second lead 32, the third lead 33, the fourth lead 34, the fifth lead 35, and the plurality of sixth leads 36 are obtained from the same lead frame. As shown in FIG. 2, the die pad 10 has a pad part 11 and two hanging parts 12.
  • the pad section 11 has a semiconductor element 20 mounted thereon.
  • the pad portion 11 has a rectangular shape.
  • Pad portion 11 has a mounting surface 111 and a back surface 112.
  • the mounting surface 111 and the back surface 112 face oppositely to each other in the third direction z.
  • the mounting surface 111 faces the semiconductor element 20 .
  • the back surface 112 is exposed from the bottom surface 52 of the sealing resin 50.
  • the area of the back surface 112 is equal to the area of the mounting surface 111.
  • the two hanging parts 12 are located on opposite sides of the pad part 11 in the second direction y.
  • the two hanging parts 12 are connected to the pad part 11.
  • the two hanging parts 12 extend in the second direction y.
  • the two hanging parts 12 are bent toward the side where the semiconductor element 20 is located with the pad part 11 as a reference in the third direction z.
  • each of the two hanging portions 12 has an end surface 121.
  • the end surface 121 faces the second direction y.
  • the end surfaces 121 of each of the two hanging portions 12 are individually exposed from the two third side surfaces 55 of the sealing resin 50.
  • each of the two hanging portions 12 includes a portion exposed from the bottom surface 52 of the sealing resin 50.
  • the two hanging parts 12 are sandwiched between the sealing resin 50 in the third direction z.
  • each of the two hanging portions 12 is provided with a pad recess 13.
  • the pad recess 13 is recessed in the third direction z from the surface of either of the two hanging parts 12 facing the same side as the mounting surface 111 of the pad part 11 in the third direction z.
  • the pad recess 13 is connected to one of the end faces 121 of the two hanging parts 12 and is also recessed from the end face 121.
  • a portion of the sealing resin 50 is accommodated in the pad recess 13 .
  • the semiconductor element 20 is mounted on the pad portion 11 of the die pad 10, as shown in FIGS. 6 and 7.
  • the semiconductor element 20 is an integrated circuit (IC) including a switching element, a capacitive element, an inductor, and the like.
  • the integrated circuit constitutes, for example, a DC-DC converter.
  • the semiconductor element 20 has a plurality of electrodes 21.
  • the plurality of electrodes 21 are located on the side opposite to the side facing the pad portion 11 of the die pad 10 in the third direction z.
  • the plurality of electrodes 21 are electrically connected to a circuit configured inside the semiconductor element 20.
  • the composition of the plurality of electrodes 21 includes, for example, aluminum (Al).
  • Each of the plurality of electrodes 21 is electrically connected to one of the first lead 31 , the second lead 32 , the third lead 33 , the fourth lead 34 , the fifth lead 35 , and the plurality of sixth leads 36 .
  • the bonding layer 29 is located between the mounting surface 111 of the pad portion 11 of the die pad 10 and the semiconductor element 20, as shown in FIGS. 6 and 7.
  • the bonding layer 29 is made of, for example, a paste whose main ingredient is an epoxy resin containing silver (so-called Ag paste).
  • the semiconductor element 20 is bonded to the mounting surface 111 via a bonding layer 29.
  • the first lead 31 is located on the opposite side of the plurality of sixth leads 36 with respect to the die pad 10 in the first direction x.
  • the first lead 31 has a first pad portion 311 and a first terminal portion 312.
  • the first pad portion 311 has a rectangular shape.
  • the first pad portion 311 is covered with a sealing resin 50.
  • the first terminal portion 312 is connected to the first pad portion 311 on one side in the first direction x.
  • the first terminal portion 312 is located on the opposite side of the die pad 10 with respect to the first pad portion 311 in the first direction x.
  • the first terminal portion 312 has a rectangular shape extending in the first direction x.
  • a portion of the first terminal portion 312 is exposed to the outside from the first side surface 53 of the sealing resin 50.
  • the portion of the first terminal portion 312 that is exposed to the outside from the sealing resin 50 is larger than the portion of the sealing resin 50 with respect to the first pad portion 311 in the third direction z. It is bent toward the side where the bottom surface 52 of is located.
  • the portion of the first terminal portion 312 exposed to the outside from the sealing resin 50 extends in the first direction x.
  • the dimension b1 of the first terminal section 312 in the second direction y is smaller than the dimension B1 of the first pad section 311 in the second direction y.
  • the position of the center C12 of the first terminal portion 312 in the second direction y is equal to the position of the center C11 of the first pad portion 311 in the second direction y.
  • the center C11 corresponds to the centroid of the first pad portion 311 when viewed in the third direction z.
  • the center C12 corresponds to the centroid of the first terminal portion 312 when viewed in the third direction z.
  • the first terminal portion 312 is provided with a first recess 313.
  • the first recessed portion 313 is recessed in the third direction z from the surface of the first terminal portion 312 facing the same side as the mounting surface 111 of the pad portion 11 of the die pad 10 in the third direction z.
  • a part of the sealing resin 50 is accommodated in the first recess 313 .
  • the second lead 32 is located on the opposite side of the plurality of sixth leads 36 with respect to the die pad 10 in the first direction x.
  • the second lead 32 has a second pad portion 321 and a second terminal portion 322.
  • the second pad portion 321 is located next to the first pad portion 311 of the first lead 31 in the second direction y.
  • the second pad portion 321 has a rectangular shape.
  • the second pad portion 321 is covered with a sealing resin 50.
  • the second terminal portion 322 is located next to the first terminal portion 312 of the first lead 31 in the second direction y, and is connected to the second pad portion 321.
  • the second terminal portion 322 has a rectangular shape extending in the first direction x.
  • a portion of the second terminal portion 322 is exposed to the outside from the first side surface 53 of the sealing resin 50.
  • the portion of the second terminal portion 322 that is exposed to the outside from the sealing resin 50 is on the side where the bottom surface 52 of the sealing resin 50 is located with respect to the second pad portion 321 in the third direction z. It is bent to.
  • the portion of the second terminal portion 322 exposed to the outside from the sealing resin 50 extends in the first direction x.
  • the dimension b2 of the second terminal section 322 in the second direction y is smaller than the dimension B2 of the second pad section 321 in the second direction y.
  • the dimension B2 is equal to the dimension B1 of the first pad portion 311 of the first lead 31 in the second direction y.
  • the position of the center C22 of the second terminal portion 322 in the second direction y is different from the position of the center C21 of the second pad portion 321 in the second direction y.
  • the center C21 corresponds to the centroid of the second pad portion 321 when viewed in the third direction z.
  • the center C22 corresponds to the centroid of the second terminal portion 322 when viewed in the third direction z.
  • the straight line length connecting the center C11 of the first pad portion 311 of the first lead 31 and the center C21 of the second pad portion 321 is defined as the first section length L1.
  • the straight line length connecting the center C12 of the first terminal portion 312 of the first lead 31 and the center C22 of the second terminal portion 322 is defined as a second section length L2.
  • the second section length L2 is different from the first section length L1.
  • the second section length L2 is shorter than the first section length L1.
  • the second terminal portion 322 is provided with a second recess 323 recessed in the third direction z.
  • the direction in which the second recess 323 is recessed is the same as the direction in which the first recess 313 of the first lead 31 is recessed.
  • a part of the sealing resin 50 is accommodated in the second recess 323 .
  • the third lead 33 is located on the opposite side of the plurality of sixth leads 36 with respect to the die pad 10 in the first direction x.
  • the third lead 33 is located on the opposite side of the first lead 31 with respect to the second lead 32 in the second direction y.
  • the third lead 33 has a third pad portion 331 and a third terminal portion 332.
  • the third pad portion 331 is located next to the second pad portion 321 of the second lead 32 in the second direction y.
  • the third pad portion 331 has a rectangular shape.
  • the third pad portion 331 is covered with a sealing resin 50.
  • the third terminal portion 332 is located next to the second terminal portion 322 of the second lead 32 in the second direction y, and is connected to the third pad portion 331.
  • the third terminal portion 332 has a rectangular shape extending in the first direction x.
  • a portion of the third terminal portion 332 is exposed to the outside from the first side surface 53 of the sealing resin 50.
  • the portion of the third terminal portion 332 that is exposed to the outside from the sealing resin 50 is the side where the bottom surface 52 of the sealing resin 50 is located with respect to the third pad portion 331 in the third direction z. It is bent to.
  • a portion of the third terminal portion 332 exposed to the outside from the sealing resin 50 extends in the first direction x.
  • the dimension b3 of the third terminal section 332 in the second direction y is smaller than the dimension B3 of the third pad section 331 in the second direction y.
  • the dimension B3 is equal to the dimension B1 of the first pad portion 311 of the first lead 31 in the second direction y.
  • the position of the center C32 of the third terminal portion 332 in the second direction y is different from the position of the center C31 of the third pad portion 331 in the second direction y.
  • the center C31 corresponds to the centroid of the third pad portion 331 when viewed in the third direction z.
  • the center C32 corresponds to the centroid of the second terminal portion 322 when viewed in the third direction z.
  • the straight line length connecting the center C21 of the second pad portion 321 of the second lead 32 and the center C31 of the third pad portion 331 is defined as the third section length L3.
  • the straight line length connecting the center C22 of the second terminal portion 322 of the second lead 32 and the center C32 of the third terminal portion 332 is defined as a fourth section length L4.
  • the fourth section length L4 is shorter than the third section length L3.
  • the third section length L3 is equal to the first section length L1 shown in FIG.
  • the fourth section length L4 is equal to the second section length L2 shown in FIG.
  • the second pad portion 321 of the second lead 32 has a first edge 321A facing the third pad portion 331 when viewed in the third direction z.
  • the first edge 321A extends in the first direction x.
  • the third pad portion 331 has a second edge 331A located on the opposite side to the side facing the first edge 321A in the second direction y.
  • the second edge 331A extends in the first direction x.
  • the dimensions of the second edge 331A are equal to the dimensions of the first edge 321A.
  • the distance L5 in the second direction y between the first edge 321A and the second terminal portion 322 of the second lead 32 is greater than the distance L6 in the second direction y between the second edge 331A and the third terminal portion 332. It's also short.
  • the third pad portion 331 has a third edge 331B that faces the first edge 321A of the second pad portion 321 of the second lead 32.
  • the third edge 331B extends in the first direction x.
  • the dimensions of the third edge 331B are equal to the dimensions of the first edge 321A.
  • the third terminal portion 332 has a fourth edge 332A facing the second terminal portion 322 of the second lead 32 when viewed in the third direction z.
  • the fourth edge 332A extends in the first direction x. In the second direction y, the position of the fourth edge 332A is equal to the position of the third edge 331B.
  • the third terminal portion 332 is provided with a third recess 333 recessed in the third direction z.
  • the direction in which the third recess 333 is recessed is the same as the direction in which the first recess 313 of the first lead 31 is recessed.
  • a portion of the sealing resin 50 is accommodated in the third recess 333 .
  • the fourth lead 34 is located on the opposite side of the plurality of sixth leads 36 with respect to the die pad 10 in the first direction x.
  • the fourth lead 34 is located on the opposite side of the second lead 32 with respect to the first lead 31 in the second direction y.
  • the fourth lead 34 is located next to the first lead 31 in the second direction y.
  • the fourth lead 34 has a fourth pad portion 341 and a fourth terminal portion 342.
  • the fourth pad portion 341 is located next to the first pad portion 311 of the first lead 31 in the second direction y.
  • the fourth pad portion 341 has a rectangular shape.
  • the fourth pad portion 341 is covered with a sealing resin 50.
  • the fourth terminal portion 342 is located next to the first terminal portion 312 of the first lead 31 in the second direction y, and is connected to the fourth pad portion 341.
  • the fourth terminal portion 342 has a rectangular shape extending in the first direction x.
  • a portion of the fourth terminal portion 342 is exposed to the outside from the first side surface 53 of the sealing resin 50.
  • the portion of the fourth terminal portion 342 that is exposed to the outside from the sealing resin 50 is on the side where the bottom surface 52 of the sealing resin 50 is located with respect to the fourth pad portion 341 in the third direction z. It is bent to.
  • the portion of the fourth terminal portion 342 exposed to the outside from the sealing resin 50 extends in the first direction x.
  • the second lead 32 and the fourth lead 34 are symmetrical about the axis N1 when viewed in the third direction z.
  • Axis N1 extends in the first direction x.
  • the axis N1 passes through the center C11 of the first pad portion 311 of the first lead 31.
  • the fourth terminal portion 342 is provided with a fourth recess 343 recessed in the third direction z.
  • the direction in which the fourth recess 343 is recessed is the same as the direction in which the first recess 313 of the first lead 31 is recessed.
  • a portion of the sealing resin 50 is accommodated in the fourth recess 343 .
  • the fifth lead 35 is located on the opposite side of the plurality of sixth leads 36 with respect to the die pad 10 in the first direction x.
  • the fifth lead 35 is located on the opposite side of the first lead 31 with respect to the fourth lead 34 in the second direction y.
  • the fifth lead 35 is located next to the fourth lead 34 in the second direction y.
  • the fifth lead 35 has a fifth pad portion 351 and a fifth terminal portion 352.
  • the fifth pad portion 351 is located next to the fourth pad portion 341 of the fourth lead 34 in the second direction y.
  • the fifth pad portion 351 has a rectangular shape.
  • the fifth pad portion 351 is covered with a sealing resin 50.
  • the fifth terminal portion 352 is located next to the fourth terminal portion 342 of the fourth lead 34 in the second direction y, and is connected to the fifth pad portion 351.
  • the fifth terminal portion 352 has a rectangular shape extending in the first direction x.
  • a portion of the fifth terminal portion 352 is exposed to the outside from the first side surface 53 of the sealing resin 50.
  • the portion of the fifth terminal portion 352 that is exposed to the outside from the sealing resin 50 is on the side where the bottom surface 52 of the sealing resin 50 is located with respect to the fifth pad portion 351 in the third direction z. It is bent to.
  • the portion of the fifth terminal portion 352 exposed to the outside from the sealing resin 50 extends in the first direction x.
  • the third lead 33 and the fifth lead 35 are symmetrical about the axis N1 when viewed in the third direction z.
  • the fifth terminal portion 352 is provided with a fifth recess 353 recessed in the third direction z.
  • the direction in which the fifth recess 353 is recessed is the same as the direction in which the first recess 313 of the first lead 31 is recessed.
  • a portion of the sealing resin 50 is accommodated in the fifth recess 353 .
  • the plurality of sixth leads 36 are located on the opposite side of the first lead 31 with respect to the die pad 10 in the first direction x.
  • the plurality of sixth leads 36 are arranged along the second direction y.
  • Each of the plurality of sixth leads 36 has a sixth pad portion 361 and a sixth terminal portion 362.
  • the sixth pad portion 361 is located between the die pad 10 and the sixth terminal portion 362 in the first direction x.
  • the sixth pad portion 361 has a rectangular shape.
  • the sixth pad portion 361 is covered with a sealing resin 50.
  • the sixth terminal section 362 is connected to the sixth pad section 361.
  • the sixth terminal portion 362 has a rectangular shape extending in the first direction x.
  • a portion of the sixth terminal portion 362 is exposed to the outside from the second side surface 54 of the sealing resin 50.
  • the portion of the sixth terminal portion 362 that is exposed to the outside from the sealing resin 50 when viewed in the second direction y is the portion of the sixth terminal portion 362 that is exposed to the outside from the sealing resin 50 in the third direction z with respect to the sixth pad portion 361. It is bent toward the side where the bottom surface 52 of is located.
  • the portion of the sixth terminal portion 362 exposed to the outside from the sealing resin 50 extends in the first direction x.
  • the plurality of sixth leads 36, the first lead 31, the second lead 32, the third lead 33, the fourth lead 34, and the fifth lead 35 are as follows: It is symmetrical about axis N2.
  • Axis N2 extends in the second direction y.
  • the axis N2 passes through the center C0 of the pad portion 11 of the die pad 10.
  • the center C0 corresponds to the centroid of the pad portion 11 when viewed in the third direction z.
  • the sixth terminal portion 362 of each of the plurality of sixth leads 36 is provided with a sixth recess 363 recessed in the third direction z.
  • the direction in which the sixth recess 363 is recessed is the same as the direction in which the first recess 313 of the first lead 31 is recessed.
  • a portion of the sealing resin 50 is accommodated in the sixth recess 363 .
  • each of the plurality of wires 40 is connected to the plurality of electrodes 21 of the semiconductor element 20, the first pad part 311 of the first lead 31, the second pad part 321 of the second lead 32, and the third lead. 33, the fourth pad portion 341 of the fourth lead 34, the fifth pad portion 351 of the fifth lead 35, and the sixth pad portion 361 of each of the plurality of sixth leads 36. It is joined. Thereby, the semiconductor element 20 is electrically connected to the first lead 31 , the second lead 32 , the third lead 33 , the fourth lead 34 , the fifth lead 35 , and the plurality of sixth leads 36 .
  • the composition of the plurality of wires 40 includes, for example, gold (Au).
  • each of the plurality of wires 40 may include a core material containing copper in the composition and a coating material containing palladium (Pd) in the composition and covering the core material.
  • the semiconductor device A10 has a first lead 31 having a first pad portion 311 and a first terminal portion 312, a second pad portion 321 and a second terminal portion 322, and is adjacent to the first lead 31 in the second direction y. and a second lead 32 located at. A portion of each of the first terminal portion 312 and the second terminal portion 322 is exposed to the outside from the sealing resin 50.
  • the straight line length connecting the center C11 of the first pad section 311 and the center C21 of the second pad section 321 when viewed in the third direction z is defined as the first section length L1.
  • the straight line length connecting the center C12 of the first terminal section 312 and the center C22 of the second terminal section 322 when viewed in the third direction is defined as a second section length L2.
  • the second section length L2 is different from the first section length L1 (see FIG. 8).
  • the second section length L2 is shorter than the first section length L1.
  • the semiconductor device A10 has a third pad part 331 and a third terminal part 332, and further includes a third lead 33 located next to the second lead 32 in the second direction y. A portion of the third terminal portion 332 is exposed to the outside from the sealing resin 50.
  • the second pad portion 321 has a first edge 321A.
  • the third pad portion 331 has a second edge 331A. The distance L5 in the second direction y between the first edge 321A and the second terminal part 322 is shorter than the distance L6 in the second direction y between the second edge 331A and the third terminal part 332 (Fig. 9 reference).
  • the distance between the second pad part 321 and the third pad part 331 is The distance between the first pad section 311 and the second pad section 321. Therefore, it is possible to suppress a decrease in the dielectric strength voltage of the semiconductor device A10 due to the mutual spacing between the first pad section 311, the second pad section 321, and the third pad section 331.
  • the third pad portion 331 When viewed in the third direction z, the third pad portion 331 has a third edge 331B. When viewed in the third direction z, the third terminal portion 332 has a fourth edge 332A. In the second direction y, the position of the fourth edge 332A is equal to the position of the third edge 331B.
  • the first terminal portion 312 is provided with a first recess 313 recessed in the third direction z.
  • a portion of the sealing resin 50 is accommodated in the first recess 313.
  • the semiconductor device A10 further includes a die pad 10 on which a semiconductor element 20 is mounted.
  • the die pad 10 has a back surface 112 facing the side opposite to the side facing the semiconductor element 20 in the third direction z.
  • the back surface 112 is exposed from the sealing resin 50.
  • the die pad 10 has a pad section 11 on which a semiconductor element 20 is mounted, and two hanging sections 12 that are located on opposite sides of the pad section 11 in the second direction y and connected to the pad section 11.
  • the two hanging parts 12 When viewed in the first direction x, the two hanging parts 12 are bent toward the side where the semiconductor element 20 is located with the pad part 11 as a reference in the third direction z.
  • the two hanging parts 12 are sandwiched between the sealing resin 50 in the third direction z. Therefore, even if the back surface 112 of the die pad 10 is exposed from the sealing resin 50, the die pad 10 can be prevented from falling off from the sealing resin 50.
  • FIGS. 10 and 12 A semiconductor device A20 according to a second embodiment of the present disclosure will be described based on FIGS. 10 to 12.
  • elements that are the same or similar to those of the semiconductor device A10 described above are given the same reference numerals, and redundant explanation will be omitted.
  • the sealing resin 50 is shown for convenience of understanding.
  • the outline of the sealing resin 50 that has passed through is shown with imaginary lines.
  • Semiconductor device A20 differs from semiconductor device A10 in the configuration of first lead 31, second lead 32, and third lead 33, and in not having fourth lead 34 and fifth lead 35.
  • the semiconductor device A20 does not include the fourth lead 34 and the fifth lead 35. Thereby, the number of each of the plurality of electrodes 21 and the plurality of wires 40 of the semiconductor element 20 is smaller than that of the semiconductor device A10.
  • the second section length L2 is longer than the first section length L1.
  • the third section length L3 is shorter than the first section length L1.
  • the fourth section length L4 is shorter than the second section length L2.
  • the fourth section length L4 is equal to the third section length L3.
  • the semiconductor device A20 has a first lead 31 having a first pad part 311 and a first terminal part 312, a second pad part 321 and a second terminal part 322, and is adjacent to the first lead 31 in the second direction y. and a second lead 32 located at. A portion of each of the first terminal portion 312 and the second terminal portion 322 is exposed to the outside from the sealing resin 50.
  • the straight line length connecting the center C11 of the first pad section 311 and the center C21 of the second pad section 321 when viewed in the third direction z is defined as the first section length L1.
  • the straight line length connecting the center C12 of the first terminal section 312 and the center C22 of the second terminal section 322 when viewed in the third direction is defined as a second section length L2.
  • the second section length L2 is different from the first section length L1 (see FIG. 12). Therefore, according to this configuration, also in the semiconductor device A20, the first terminal exposed from the sealing resin 50 is secured while securing the bonding area of each of the first pad part 311 and the second pad part 321 with respect to the plurality of wires 40. It becomes possible to freely set the distance between the portion 312 and the second terminal portion 322.
  • the second section length L2 is longer than the first section length L1.
  • the semiconductor device A20 has the same configuration as the semiconductor device A10, the semiconductor device A20 also has the effects of the configuration.
  • a semiconductor element having multiple electrodes; a first lead having a first pad portion and a first terminal portion connected to one side of the first pad portion in a first direction; a second pad section located next to the first pad section in a second direction orthogonal to the first direction; and a second pad section located next to the first terminal section in the second direction and the second pad section.
  • a second lead having a second terminal portion connected to the portion; a plurality of wires individually conductively bonded to the plurality of electrodes, the first pad section and the second pad section; a sealing resin that covers a portion of each of the first lead and the second lead and the semiconductor element; A portion of each of the first terminal portion and the second terminal portion is exposed to the outside from the sealing resin, When viewed in a third direction perpendicular to the first direction and the second direction, a straight line length connecting the center of the first pad part and the center of the second pad part is a first section length, When viewed in the third direction, a straight line length connecting the center of the first terminal portion and the center of the second terminal portion is defined as the second section length, The semiconductor device, wherein the second section length is different from the first section length.
  • Appendix 2 The dimension of the first terminal portion in the second direction is smaller than the dimension of the first pad portion in the second direction,
  • the semiconductor device according to appendix 1 wherein a dimension of the second terminal portion in the second direction is smaller than a dimension of the second pad portion in the second direction.
  • Appendix 3 The semiconductor device according to appendix 2, wherein a dimension of the second pad portion in the second direction is equal to a dimension of the first pad portion in the second direction.
  • Appendix 4. The semiconductor device according to appendix 2 or 3, wherein the second section length is shorter than the first section length. Appendix 5.
  • the third lead located on the opposite side of the first lead with respect to the second lead in the second direction and partially covered with the sealing resin,
  • the third lead includes a third pad portion located next to the second pad portion in the second direction, and a third pad portion located next to the second terminal portion in the second direction and attached to the third pad portion.
  • a straight line length connecting the center of the second pad section and the center of the third pad section when viewed in the third direction is defined as a third section length, and when viewed in the third direction, the second terminal section If the straight line length connecting the center of and the center of the third terminal section is the fourth section length,
  • the semiconductor device according to appendix 4 wherein the fourth section length is shorter than the third section length.
  • Appendix 6 The semiconductor device according to appendix 5, wherein a dimension of the third terminal portion in the second direction is smaller than a dimension of the third pad portion in the second direction. Appendix 7.
  • the third section length is equal to the first section length
  • Appendix 8 When viewed in the third direction, the second pad portion has a first edge facing the third pad portion, When viewed in the third direction, the third pad portion has a second edge located on a side opposite to the first edge in the second direction, Supplementary Note 6 or 7, wherein the distance in the second direction between the first edge and the second terminal portion is shorter than the distance in the second direction between the second edge and the third terminal portion.
  • the third pad portion When viewed in the third direction, the third pad portion has a third edge opposite to the first edge, When viewed in the third direction, the third terminal portion has a fourth edge facing the second terminal portion, The semiconductor device according to appendix 8, wherein the position of the fourth edge is equal to the position of the third edge in the second direction.
  • Appendix 10. further comprising a fourth lead located on the opposite side of the second lead in the second direction with respect to the first lead and partially covered with the sealing resin, The fourth lead is located next to the first lead in the second direction, According to appendix 8 or 9, when viewed in the third direction, the second lead and the fourth lead extend in the first direction and are line symmetrical with respect to an axis passing through the center of the first pad portion.
  • the die pad has a back surface facing the side opposite to the side facing the semiconductor element in the third direction,
  • Appendix 15. The die pad has a pad portion on which the semiconductor element is mounted, and two hanging portions located on opposite sides of the pad portion in the second direction and connected to the pad portion, 15. The semiconductor device according to appendix 14, wherein, when viewed in the first direction, the two hanging portions are bent toward the side where the semiconductor element is located with respect to the pad portion in the third direction.
  • the first terminal portion is provided with a recessed portion recessed in the third direction, 16.

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
PCT/JP2023/005252 2022-03-17 2023-02-15 半導体装置 Ceased WO2023176267A1 (ja)

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US18/829,980 US20240429133A1 (en) 2022-03-17 2024-09-10 Semiconductor device

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6010651A (ja) * 1983-06-30 1985-01-19 Toshiba Corp 半導体装置
JP2001326295A (ja) * 2000-05-15 2001-11-22 Rohm Co Ltd 半導体装置および半導体装置製造用フレーム
JP2007305671A (ja) * 2006-05-09 2007-11-22 Matsushita Electric Ind Co Ltd リードフレーム及びそれを用いた半導体装置
JP2009032767A (ja) * 2007-07-25 2009-02-12 Toshiba Corp 半導体装置及びその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6010651A (ja) * 1983-06-30 1985-01-19 Toshiba Corp 半導体装置
JP2001326295A (ja) * 2000-05-15 2001-11-22 Rohm Co Ltd 半導体装置および半導体装置製造用フレーム
JP2007305671A (ja) * 2006-05-09 2007-11-22 Matsushita Electric Ind Co Ltd リードフレーム及びそれを用いた半導体装置
JP2009032767A (ja) * 2007-07-25 2009-02-12 Toshiba Corp 半導体装置及びその製造方法

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