JP2024037592A5 - - Google Patents

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Publication number
JP2024037592A5
JP2024037592A5 JP2022142527A JP2022142527A JP2024037592A5 JP 2024037592 A5 JP2024037592 A5 JP 2024037592A5 JP 2022142527 A JP2022142527 A JP 2022142527A JP 2022142527 A JP2022142527 A JP 2022142527A JP 2024037592 A5 JP2024037592 A5 JP 2024037592A5
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JP
Japan
Prior art keywords
bridging
gap
semiconductor element
bridging members
semiconductor
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022142527A
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English (en)
Japanese (ja)
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JP2024037592A (ja
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Publication date
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Priority to JP2022142527A priority Critical patent/JP2024037592A/ja
Priority claimed from JP2022142527A external-priority patent/JP2024037592A/ja
Priority to PCT/JP2023/030589 priority patent/WO2024053420A1/ja
Publication of JP2024037592A publication Critical patent/JP2024037592A/ja
Publication of JP2024037592A5 publication Critical patent/JP2024037592A5/ja
Pending legal-status Critical Current

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JP2022142527A 2022-09-07 2022-09-07 半導体パッケージ Pending JP2024037592A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022142527A JP2024037592A (ja) 2022-09-07 2022-09-07 半導体パッケージ
PCT/JP2023/030589 WO2024053420A1 (ja) 2022-09-07 2023-08-24 半導体パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022142527A JP2024037592A (ja) 2022-09-07 2022-09-07 半導体パッケージ

Publications (2)

Publication Number Publication Date
JP2024037592A JP2024037592A (ja) 2024-03-19
JP2024037592A5 true JP2024037592A5 (https=) 2024-10-31

Family

ID=90191102

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022142527A Pending JP2024037592A (ja) 2022-09-07 2022-09-07 半導体パッケージ

Country Status (2)

Country Link
JP (1) JP2024037592A (https=)
WO (1) WO2024053420A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025150877A (ja) * 2024-03-27 2025-10-09 株式会社デンソー 電子装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4102012B2 (ja) * 2000-09-21 2008-06-18 株式会社東芝 半導体装置の製造方法および半導体装置
DE102019206811A1 (de) * 2019-05-10 2020-11-12 Robert Bosch Gmbh Leistungshalbleiterbauelement mit darin angeordneten Leistungstransistoren
JP7088132B2 (ja) * 2019-07-10 2022-06-21 株式会社デンソー 半導体装置及び電子装置
JP7331827B2 (ja) * 2020-12-23 2023-08-23 株式会社デンソー 半導体パッケージおよびこれを用いた電子装置

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