TW201901897A - 半導體裝置 - Google Patents
半導體裝置 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 60
- 239000011347 resin Substances 0.000 claims abstract description 166
- 229920005989 resin Polymers 0.000 claims abstract description 166
- 238000007789 sealing Methods 0.000 claims description 20
- 239000000758 substrate Substances 0.000 abstract description 36
- 238000005538 encapsulation Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 17
- 238000010586 diagram Methods 0.000 description 8
- 240000004050 Pentaglottis sempervirens Species 0.000 description 7
- 235000004522 Pentaglottis sempervirens Nutrition 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
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Abstract
本發明提供一種使用耐振性高的單列直插封裝體的半導體裝置。自內置磁感測器等的樹脂密封體3中抽出外部端子2a~外部端子2c,在外部端子與相鄰的外部端子之間設置樹脂突起部,並在樹脂突起部與外部端子之間設置間隙。當安裝於安裝基板上時,將樹脂突起部固定於安裝基板表面上,使外部端子固著於安裝基板上所設置的孔內。
Description
本發明是有關於一種使用單列直插封裝體(single in-line package)的半導體裝置。
於汽車的行駛中,必須對無刷馬達(brushless motor)或引擎的旋轉狀態進行感測,並反饋其感測結果來控制旋轉而提高旋轉精度。為了應對該些需求,而需要用以對無刷馬達或汽車引擎的旋轉進行感測的磁感測器等感測器元件。感測器元件與半導體積體電路組合並被收納於半導體封裝體中。作為搭載有感測器元件的半導體封裝體的一種,通常已知有引腳插入型封裝體,即所謂的單列直插封裝體。以後,有時稱為SIP。
SIP包含經樹脂密封的樹脂本體與自樹脂本體中抽出的至少3根以上的外部端子,外部端子的長度相對於樹脂本體至少為2倍以上,於安裝基板後,外部端子的大部分亦自基板露出。若於外部端子的大部分露出至基板上的狀態下搭載SIP,則由汽車引擎或無刷馬達的旋轉所引起的固有振動傳遞至外部端子中。樹脂本體經由外部端子,以相對於安裝基板浮動的狀態得到保持,因此安裝位置高,容易反覆受到來自無刷馬達或汽車引擎的振動。因反覆受到振動,而導致應力集中於SIP的外部端子部,容易產生外部端子自身的缺損或用以將基板與SIP固定連接的焊料的裂紋。若產生此種不良情況,則有可能引起如下的不良情況:安裝基板與SIP的電路斷裂、因由駕駛中的引擎停止或冷卻風扇的停止所引起的溫度上升而燒毀基板或零件。
為了解決該些課題,提出有一種耐振性高的SIP。(例如,參照專利文獻1) [現有技術文獻] [專利文獻]
[專利文獻1]日本專利特開平6-213741號公報
[發明所欲解決之課題] 雖然藉由利用專利文獻1中記載的技術而使受到振動的影響下降,但外部端子的支撐架部露出,此處,因接受振動負荷,故留有不少振動的影響,耐振性並不充分。
本發明是鑒於所述課題而成者,其提供一種使用耐振性高的單列直插封裝體的半導體裝置。 [解決課題之手段]
為了解決所述課題,因此於本發明中使用以下的手段。 一種半導體裝置,其是使用自樹脂密封體的一面抽出的外部端子並排地排列成一列的單列直插封裝體的半導體裝置,其特徵在於:具備自所述樹脂密封體延伸設置的樹脂突起部、及設置於所述樹脂突起部與相鄰的樹脂突起部之間的樹脂缺口部,於所述樹脂缺口部中配置有所述外部端子,所述外部端子的前端比所述樹脂突起部的前端更突出。 [發明之效果]
藉由使用所述手段,可實現一種使用減輕來自外部的振動的影響、耐振性更高的單列直插封裝體的半導體裝置。
以下,根據圖式對本發明的半導體裝置進行說明。 圖1是本發明的第1實施形態的半導體裝置的鳥瞰圖。半導體裝置具備:樹脂密封體3,對磁感測器或角速度感測器等感測器元件、或者不包含磁感測器或角速度感測器等的非感測器元件(以下將該些總稱為半導體元件)進行密封;樹脂突起部3a、樹脂突起部3b、樹脂突起部3c、樹脂突起部3d,自作為樹脂密封體3的左側的一面的底面突出;以及外部端子2a、外部端子2b、外部端子2c;於鄰接的樹脂突起部3a、樹脂突起部3b、樹脂突起部3c、樹脂突起部3d之間設置有作為無樹脂的部分的樹脂缺口部4a、樹脂缺口部4b、樹脂缺口部4c,於樹脂缺口部4a、樹脂缺口部4b、樹脂缺口部4c中分別設置有外部端子2a、外部端子2b、外部端子2c。外部端子2a、外部端子2b、外部端子2c並排成一列,構成單列直插封裝體。雖然未圖示,但外部端子2a、外部端子2b、外部端子2c與被樹脂密封體3密封的半導體元件電性連接。
圖2(a)~圖2(c)是自各方向觀察圖1中的本發明的第1實施形態的半導體裝置的平面圖,(a)為自A方向觀察的圖,(b)為自B方向觀察的圖,(c)為自C方向觀察的圖。
於圖2(a)中,使外部端子2a、外部端子2b、外部端子2c變成下側來進行圖示,安裝於基板時的安裝面為本圖的下面。樹脂突起部3a、樹脂突起部3b、樹脂突起部3c、樹脂突起部3d於樹脂密封體3的下表面上突出,在樹脂突起部3a與樹脂突起部3b間設置有U字型的樹脂缺口部4a,在樹脂突起部3b與樹脂突起部3c之間設置有樹脂缺口部4b,在樹脂突起部3c與樹脂突起部3d之間設置有樹脂缺口部4c。於各個U字型的樹脂缺口部4a、樹脂缺口部4b、樹脂缺口部4c中分別設置有自樹脂密封體3中抽出的外部端子2a、外部端子2b、外部端子2c,與樹脂密封體3接觸的外部端子2a、外部端子2b、外部端子2c的基部處於樹脂缺口部4a、樹脂缺口部4b、樹脂缺口部4c中,外部端子2a、外部端子2b、外部端子2c的前端部比樹脂突起部前端3h更突出。樹脂缺口部4a、樹脂缺口部4b、樹脂缺口部4c的寬度比外部端子2a、外部端子2b、外部端子2c的寬度更寬,在樹脂缺口部的內側面與外部端子的側面之間存在間隙,該間隙確保於安裝基板時足夠收納形成在比樹脂突起部前端3h更上側的焊料圓角(solder fillet)的寬度及高度。當外部端子的寬度為0.4 mm時,樹脂缺口部的內側面(樹脂突起部的側面)與外部端子的側面之間的間隙只要至少有0.1 mm便足夠,通常理想的是0.1 mm~0.2 mm,即相對於外部端子的寬度存在1/4~1/2的間隙。
圖2(b)是自圖1的B方向觀察的圖。樹脂突起部前端3h是與基板接觸來進行安裝的面,外部端子2a、外部端子2b、外部端子2c比樹脂突起部前端3h更突出的部分進入或嵌合於基板上所設置的孔中來進行安裝。
於圖2(c)中圖示有自圖1的C方向觀察的圖。如於樹脂缺口部4a中配置有外部端子2a,於樹脂缺口部4b中配置有外部端子2b,於樹脂缺口部4c中配置有外部端子2c般,樹脂缺口部與外部端子成對地配置。而且,外部端子2a、外部端子2b、外部端子2c並排地排列於一條直線上。於本實施例中,以外部端子為3根的情況為例進行說明,但若外部端子數增加,則相對應地樹脂缺口部亦增加。
繼而,使用圖3(a)~圖3(c)及圖4(a)~圖4(b)對本發明的第1實施形態的半導體裝置的製造方法進行說明。 如圖3(a)所示,於導線架框1的一邊上連接有外部端子2a、外部端子2b、外部端子2c,於外部端子2b上連結有搭載半導體元件9的島(island)5,於島5的端部配置有經延伸的內部端子7a、內部端子7b。另外,自外部端子2a、外部端子2c延伸的內部端子6a、內部端子6c與島5分離而設置於島5的附近。再者,作為導線架材料,通常使用194合金材料或銅合金。
圖3(b)是黏晶(die bonding)步驟後的圖,表示使半導體元件9經由晶粒黏著(die attach)材料8而接著於島5的表面上的狀態。 圖3(c)是打線接合步驟後的圖,表示經由線10而將半導體元件9的表面的電極墊與內部端子6a、內部端子6c、內部端子7a電性連接的狀態。於圖中,利用線10將自島5延伸的內部端子7a與半導體元件9連接,但亦可鑒於半導體元件9上的電極墊的配置狀態而與自島5延伸的內部端子7b連接。
圖4(a)~圖4(b)是緊接著圖3的表示本發明的第1實施形態的半導體裝置的製造方法的鳥瞰圖。 圖4(a)是表示利用樹脂密封體3對載置於島5上的半導體元件9與內部端子6a、內部端子6c、內部端子7a及線10進行密封的狀態的圖。此時,導線架框1與外部端子2a、外部端子2b、外部端子2c自樹脂密封體3露出。以包圍外部端子2a與樹脂密封體3接觸的基部、外部端子2b與樹脂密封體3接觸的基部、外部端子2c與樹脂密封體3接觸的基部的方式形成有樹脂缺口部4a、樹脂缺口部4b、樹脂缺口部4c。
繼而,若使鍍焊料附著於導線架框1及外部端子2a、外部端子2b、外部端子2c的整個面上,並於外部端子2a、外部端子2b、外部端子2c的前端進行切斷而將導線架框1分開,則如圖4(b)所示的本發明的半導體裝置完成。
該半導體裝置顯示出於樹脂密封體3的一面上具有包含樹脂突起部3a、樹脂突起部3b、樹脂突起部3c、樹脂突起部3d與樹脂缺口部4a、樹脂缺口部4b、樹脂缺口部4c的凹凸,並於樹脂密封體3的樹脂缺口部4a、樹脂缺口部4b、樹脂缺口部4c中配置有外部端子2a、外部端子2b、外部端子2c的外觀。
圖5表示本發明的第1實施形態的半導體裝置的安裝基板搭載時的狀態的鳥瞰圖。準備安裝基板11,以安裝基板11的表面與樹脂密封體3的凹凸面相向接觸的方式進行安裝。
圖6是自D方向觀察圖5中的本發明的第1實施形態的半導體裝置的圖。另外,圖7是圖6中的E部(由虛線所形成的圓圈部)的放大圖。 自安裝於安裝基板11上的本發明的半導體裝置的樹脂密封體3中抽出的外部端子2a、外部端子2b、外部端子2c的超過一半的下半部分進入形成於安裝基板11上的配線用孔12中,且經由基板安裝用焊料13而固著於配線用孔12中。此時,與配線用孔12的深度相比,將經固著的外部端子2a、外部端子2b、外部端子2c的長度設定成相等或略短,而使該些外部端子不自安裝基板11的背面凸出。而且,構成作為樹脂密封體3的底面的凹凸面的樹脂突起部3a~樹脂突起部3d與安裝基板11接觸而得到固定。樹脂突起部3a~樹脂突起部3d的前端具有相同的高度,相對於安裝基板11均等地接觸。
另外,外部端子的不足一半的上半部分位於安裝基板11上,且周圍被樹脂突起部3a~樹脂突起部3d包圍。自基板安裝用焊料13逐漸上升的焊料圓角形成於外部端子側面,在外部端子2a、外部端子2b、外部端子2c與形成於樹脂密封體3上的樹脂缺口部4a、樹脂缺口部4b、樹脂缺口部4c之間的間隙中填充焊料圓角,因此外部端子2a、外部端子2b、外部端子2c的上部與樹脂突起部3a~樹脂突起部3d經由焊料圓角而接合。
若如以上般將本發明的實施形態的半導體裝置安裝於安裝基板上,則不僅安裝基板與外部端子得到固著,而且安裝基板與樹脂突起部接觸而得到固定,進而,樹脂突起部與外部端子經由焊料圓角而連接,因此即便自外部反覆受到振動,亦難以產生外部端子的缺損或焊料裂紋。
將本發明的第2實施形態的半導體裝置的平面圖示於圖8(a)中。 於圖2(a)中,將外部端子2a、外部端子2b、外部端子2c的側面和與其相向的樹脂缺口部4a、樹脂缺口部4b、樹脂缺口部4c的側面平行地配置,但於圖8(a)中,於樹脂缺口部4a、樹脂缺口部4b、樹脂缺口部4c的側面設置錐形,樹脂缺口部與外部端子所形成的間隙變成自外部端子的基部逐漸地擴幅的梯形形狀。藉此,可避免填充至間隙中的用於外部端子2a、外部端子2b、外部端子2c與配線用孔12的接合的基板接合用焊料13的殘部自配線用孔12中溢出,並侵入樹脂突起部3a~樹脂突起部3d與安裝基板之間這一不良情況。圖8(b)及圖8(c)是圖8(a)的變形例,分別為以中間的間隙自外部端子的基部呈階梯狀地擴幅的方式形成樹脂缺口部的側面者、以中間的間隙自外部端子的基部呈圓弧狀擴幅的方式形成樹脂缺口部的側面者,與圖8(a)的實施例同樣地,是抑制焊料侵入樹脂突起部3a~樹脂突起部3d與安裝基板之間的結構。
將本發明的第3實施形態的半導體裝置的平面圖示於圖9(a)中。 圖9(a)與圖2(a)的不同點是於樹脂突起部3a~樹脂突起部3d的各者的前端中央部設置有槽部15。槽部15的缺口高度設定得比所述樹脂缺口部4a~樹脂缺口部4c低,且自圖的跟前貫穿至最裏側為止來設置。圖9(b)及圖9(c)分別是與圖2(c)相對應的圖,且為自帶有外部端子的半導體裝置底面觀察的平面圖。於圖9(b)中,槽部15自樹脂突起部3a~樹脂突起部3d各自的上邊貫穿至相反側的底邊為止,相對於排列有外部端子2a、外部端子2b、外部端子2c的方向垂直地設置,形成將樹脂突起部3a~樹脂突起部3d完全地分割的形狀。於圖9(c)中,槽部15部分地設置於樹脂突起部3a~樹脂突起部3d的各者中,槽部15為周圍被樹脂突起部3a~樹脂突起部3d包圍的形狀。槽部15的長度(圖的上下方向)比外部端子2a、外部端子2b、外部端子2c的厚度(圖的上下方向)的長度長,且設置於外部端子2a、外部端子2b、外部端子2c的兩側。於本實施例中,外部端子2a、外部端子2b、外部端子2c的厚度為0.4 mm,將槽部15的長度設為0.6 mm。於圖9(b)、圖9(c)中圖示有相對於一個樹脂突起部設置一個槽部的形態,但如其後於圖11(a)~圖11(b)中所說明般,亦可設置多個槽部15。藉此,可於附近藉由各個槽部15來堵住自安裝基板配線用孔中溢出的焊料。 藉由如以上般設置所述槽部,即便焊料侵入樹脂突起部與安裝基板之間,亦可避免端子間的短路。
將本發明的第4實施形態的半導體裝置的平面圖示於圖10(a)中。 圖10(a)與圖2(a)的不同點是於樹脂突起部3a~樹脂突起部3d的前端中央部設置有第2樹脂突起部16。該第2樹脂突起部16理想的是高度為不比外部端子2a、外部端子2b、外部端子2c更突出的程度。於對向的安裝基板上,在對應於第2樹脂突起部16的位置上設置孔,藉由該孔與第2樹脂突起部16嵌合,本發明的實施形態的半導體裝置與安裝基板的接合變得更牢固。再者,該孔與第2樹脂突起部16的接合可僅為嵌合,亦可經由絕緣性接著劑而接合。圖10(b)是與圖2(c)相對應的圖,且為自帶有外部端子的半導體裝置底面觀察的平面圖。於樹脂突起部3a~樹脂突起部3d上,與樹脂突起部3a~樹脂突起部3d相比減小獨佔面積來配置第2樹脂突起部16,但儘可能於外部端子2a、外部端子2b、外部端子2c的附近,以外部端子2a、外部端子2b、外部端子2c與第2樹脂突起部16並排於一條直線上的方式配置,藉此可減輕振動對於外部端子2a、外部端子2b、外部端子2c的影響。進而,理想的是外部端子2a、外部端子2b、外部端子2c與兩側的第2樹脂突起部16等距離地(對稱地)配置。另外,於圖10(a)~圖10(b)中表示相對於一個樹脂突起部設置一個第2樹脂突起部16的形態,但藉由配置多個第2樹脂突起部16,可實現更牢固的接合。另外,當對與第2樹脂突起部16相對應的孔的配置有限制時,亦可不於樹脂突起部3a及樹脂突起部3d中設置第2樹脂突起部16,而僅於樹脂突起部3b及樹脂突起部3c中設置第2樹脂突起部16。
將本發明的第5實施形態的半導體裝置的平面圖示於圖11(a)中。 圖11(a)是與圖10(a)相對應的圖,圖11(b)是與圖10(b)相對應的圖。與圖10(a)~圖10(b)的不同點是於第2樹脂突起部16的兩側設置有槽部15。藉由設為此種構成,可預計利用第2樹脂突起部16的接合的提昇與利用槽部15避免端子間短路兩者。
如以上所說明般,本發明的半導體裝置於外部端子的兩側具有樹脂突起部,藉此不僅安裝基板與外部端子得到固著,而且安裝基板與樹脂突起部接觸而得到固定,進而,樹脂突起部與外部端子經由焊料圓角而連接,因此即便自外部反覆受到振動,亦難以產生外部端子的缺損或焊料裂紋。進而,外部端子為直線形狀,導線架加工用沖壓機模具的脫模衝頭亦為簡單形狀且衝頭數亦少,可使模具變得便宜。另外,藉由外部端子短,若為同一尺寸的導線架,則可將多個本發明的半導體裝置佈置於導線架面內,可增加每一塊導線架的半導體裝置數,並可降低總的封裝體製造成本。
1‧‧‧導線架框
2、2a、2b、2c‧‧‧外部端子
3‧‧‧樹脂密封體
3a、3b、3c、3d‧‧‧樹脂突起部
3h‧‧‧樹脂突起部前端
4a、4b、4c‧‧‧樹脂缺口部
5‧‧‧島
6a、6c、7a、7b‧‧‧內部端子
8‧‧‧晶粒黏著劑
9‧‧‧半導體元件
10‧‧‧線
11‧‧‧安裝基板
12‧‧‧配線用孔
13‧‧‧基板接合用焊料
14‧‧‧樹脂缺口與外部端子的間隙
15‧‧‧槽部
16‧‧‧第2樹脂突起部
A、B、C、D‧‧‧方向
E‧‧‧由虛線所形成的圓圈部
圖1是本發明的第1實施形態的半導體裝置的鳥瞰圖。 圖2(a)~圖2(c)是自各方向觀察圖1中的本發明的第1實施形態的半導體裝置的平面圖。 圖3(a)~圖3(c)是表示本發明的第1實施形態的半導體裝置的製造方法的鳥瞰圖。 圖4(a)~圖4(b)是緊接著圖3的表示本發明的第1實施形態的半導體裝置的製造方法的鳥瞰圖。 圖5表示本發明的第1實施形態的半導體裝置的安裝基板搭載時的狀態的鳥瞰圖。 圖6是自D方向觀察圖5中的本發明的第1實施形態的半導體裝置的圖。 圖7是圖6中的E部的放大圖。 圖8(a)~圖8(c)是本發明的第2實施形態的半導體裝置的平面圖。 圖9(a)~圖9(c)是本發明的第3實施形態的半導體裝置的平面圖。 圖10(a)~圖10(b)是本發明的第4實施形態的半導體裝置的平面圖。 圖11(a)~圖11(b)是本發明的第5實施形態的半導體裝置的平面圖。
Claims (7)
- 一種半導體裝置,其是使用自樹脂密封體的一面抽出的外部端子並排地排列成一列的單列直插封裝體的半導體裝置,其特徵在於: 包括自所述樹脂密封體延伸設置的樹脂突起部、及設置於所述樹脂突起部與相鄰的樹脂突起部之間的樹脂缺口部, 於所述樹脂缺口部中配置有所述外部端子,所述外部端子的前端比所述樹脂突起部的前端更突出。
- 如申請專利範圍第1項所述的半導體裝置,其中所述外部端子的側面和與所述側面對向的所述樹脂缺口部的內側面分離。
- 如申請專利範圍第1項或第2項所述的半導體裝置,其中於所述樹脂突起部中設置槽部,所述槽部配置在所述外部端子和與所述外部端子相鄰的外部端子之間。
- 如申請專利範圍第1項至第3項中任一項所述的半導體裝置,其中於所述樹脂突起部中設置第2樹脂突起部,所述第2樹脂突起部配置在所述外部端子和與所述外部端子相鄰的外部端子之間。
- 如申請專利範圍第2項至第4項中任一項所述的半導體裝置,其中將所述樹脂缺口部的內側面設為錐形形狀,所述內側面與所述外部端子之間的間隙伴隨自所述外部端子的基部朝向前端而逐漸地擴幅。
- 如申請專利範圍第2項至第4項中任一項所述的半導體裝置,其中將所述樹脂缺口部的內側面設為階梯狀,所述內側面與所述外部端子之間的間隙伴隨自所述外部端子的基部朝向前端而逐漸地擴幅。
- 如申請專利範圍第2項至第4項中任一項所述的半導體裝置,其中將所述樹脂缺口部的內側面設為圓弧狀,所述內側面與所述外部端子之間的間隙伴隨自所述外部端子的基部朝向前端而逐漸地擴幅。
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JP3163814B2 (ja) | 1993-01-14 | 2001-05-08 | 富士電機株式会社 | 半導体装置 |
DE60209278T2 (de) * | 2001-06-25 | 2006-10-12 | The Furukawa Electric Co., Ltd. | Chip-Antenne und Herstellungsverfahren einer solchen Antenne |
JP2005158778A (ja) * | 2003-11-20 | 2005-06-16 | New Japan Radio Co Ltd | リードフレームの製造方法及び半導体装置の製造方法 |
JP2007207924A (ja) * | 2006-01-31 | 2007-08-16 | Murata Mfg Co Ltd | 表面実装型電子部品 |
JP2008283019A (ja) * | 2007-05-11 | 2008-11-20 | Toyota Motor Corp | 電子部品 |
JP2010258200A (ja) * | 2009-04-24 | 2010-11-11 | Panasonic Corp | 半導体装置およびその製造方法 |
-
2017
- 2017-03-17 JP JP2017052824A patent/JP6827347B2/ja active Active
-
2018
- 2018-02-09 TW TW107104763A patent/TW201901897A/zh unknown
- 2018-02-27 KR KR1020180023679A patent/KR20180106874A/ko unknown
- 2018-02-27 US US15/906,427 patent/US10586773B2/en not_active Expired - Fee Related
- 2018-02-28 CN CN201810166671.3A patent/CN108630648B/zh active Active
Also Published As
Publication number | Publication date |
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US10586773B2 (en) | 2020-03-10 |
KR20180106874A (ko) | 2018-10-01 |
US20180269165A1 (en) | 2018-09-20 |
JP6827347B2 (ja) | 2021-02-10 |
CN108630648B (zh) | 2023-03-21 |
CN108630648A (zh) | 2018-10-09 |
JP2018157070A (ja) | 2018-10-04 |
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