JP2024037592A - 半導体パッケージ - Google Patents

半導体パッケージ Download PDF

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Publication number
JP2024037592A
JP2024037592A JP2022142527A JP2022142527A JP2024037592A JP 2024037592 A JP2024037592 A JP 2024037592A JP 2022142527 A JP2022142527 A JP 2022142527A JP 2022142527 A JP2022142527 A JP 2022142527A JP 2024037592 A JP2024037592 A JP 2024037592A
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Japan
Prior art keywords
semiconductor element
semiconductor
gap
mounting
semiconductor package
Prior art date
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Pending
Application number
JP2022142527A
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English (en)
Japanese (ja)
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JP2024037592A5 (https=
Inventor
貴博 中野
Takahiro Nakano
昇 長瀬
Noboru Nagase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2022142527A priority Critical patent/JP2024037592A/ja
Priority to PCT/JP2023/030589 priority patent/WO2024053420A1/ja
Publication of JP2024037592A publication Critical patent/JP2024037592A/ja
Publication of JP2024037592A5 publication Critical patent/JP2024037592A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2022142527A 2022-09-07 2022-09-07 半導体パッケージ Pending JP2024037592A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022142527A JP2024037592A (ja) 2022-09-07 2022-09-07 半導体パッケージ
PCT/JP2023/030589 WO2024053420A1 (ja) 2022-09-07 2023-08-24 半導体パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022142527A JP2024037592A (ja) 2022-09-07 2022-09-07 半導体パッケージ

Publications (2)

Publication Number Publication Date
JP2024037592A true JP2024037592A (ja) 2024-03-19
JP2024037592A5 JP2024037592A5 (https=) 2024-10-31

Family

ID=90191102

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022142527A Pending JP2024037592A (ja) 2022-09-07 2022-09-07 半導体パッケージ

Country Status (2)

Country Link
JP (1) JP2024037592A (https=)
WO (1) WO2024053420A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025150877A (ja) * 2024-03-27 2025-10-09 株式会社デンソー 電子装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4102012B2 (ja) * 2000-09-21 2008-06-18 株式会社東芝 半導体装置の製造方法および半導体装置
DE102019206811A1 (de) * 2019-05-10 2020-11-12 Robert Bosch Gmbh Leistungshalbleiterbauelement mit darin angeordneten Leistungstransistoren
JP7088132B2 (ja) * 2019-07-10 2022-06-21 株式会社デンソー 半導体装置及び電子装置
JP7331827B2 (ja) * 2020-12-23 2023-08-23 株式会社デンソー 半導体パッケージおよびこれを用いた電子装置

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Publication number Publication date
WO2024053420A1 (ja) 2024-03-14

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