JPWO2023106151A5 - - Google Patents
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- Publication number
- JPWO2023106151A5 JPWO2023106151A5 JP2023566247A JP2023566247A JPWO2023106151A5 JP WO2023106151 A5 JPWO2023106151 A5 JP WO2023106151A5 JP 2023566247 A JP2023566247 A JP 2023566247A JP 2023566247 A JP2023566247 A JP 2023566247A JP WO2023106151 A5 JPWO2023106151 A5 JP WO2023106151A5
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- bonding
- semiconductor device
- back surface
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims 31
- 229910052751 metal Inorganic materials 0.000 claims 31
- 239000004065 semiconductor Substances 0.000 claims 24
- 239000000758 substrate Substances 0.000 claims 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 6
- 239000010953 base metal Substances 0.000 claims 6
- 239000011347 resin Substances 0.000 claims 6
- 229920005989 resin Polymers 0.000 claims 6
- 239000010949 copper Substances 0.000 claims 4
- 238000009792 diffusion process Methods 0.000 claims 4
- 239000007790 solid phase Substances 0.000 claims 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 3
- 229910052709 silver Inorganic materials 0.000 claims 3
- 239000004332 silver Substances 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 2
- 239000000919 ceramic Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021200693 | 2021-12-10 | ||
| PCT/JP2022/043738 WO2023106151A1 (ja) | 2021-12-10 | 2022-11-28 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023106151A1 JPWO2023106151A1 (https=) | 2023-06-15 |
| JPWO2023106151A5 true JPWO2023106151A5 (https=) | 2024-08-22 |
Family
ID=86730318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023566247A Pending JPWO2023106151A1 (https=) | 2021-12-10 | 2022-11-28 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20240312896A1 (https=) |
| JP (1) | JPWO2023106151A1 (https=) |
| WO (1) | WO2023106151A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018111111A (ja) * | 2017-01-12 | 2018-07-19 | 三菱電機株式会社 | 金属接合体及び半導体装置の製造方法 |
| WO2020071185A1 (ja) * | 2018-10-02 | 2020-04-09 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
| JP7443359B2 (ja) * | 2019-05-24 | 2024-03-05 | ローム株式会社 | 半導体装置 |
| CN115380378A (zh) * | 2020-04-17 | 2022-11-22 | 罗姆股份有限公司 | 半导体装置 |
| DE112021002959T5 (de) * | 2020-05-26 | 2023-03-09 | Rohm Co., Ltd. | Montagestruktur für halbleitermodule |
-
2022
- 2022-11-28 JP JP2023566247A patent/JPWO2023106151A1/ja active Pending
- 2022-11-28 WO PCT/JP2022/043738 patent/WO2023106151A1/ja not_active Ceased
-
2024
- 2024-05-28 US US18/675,646 patent/US20240312896A1/en active Pending
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