JPWO2022092177A5 - - Google Patents
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- Publication number
- JPWO2022092177A5 JPWO2022092177A5 JP2022559215A JP2022559215A JPWO2022092177A5 JP WO2022092177 A5 JPWO2022092177 A5 JP WO2022092177A5 JP 2022559215 A JP2022559215 A JP 2022559215A JP 2022559215 A JP2022559215 A JP 2022559215A JP WO2022092177 A5 JPWO2022092177 A5 JP WO2022092177A5
- Authority
- JP
- Japan
- Prior art keywords
- thermoelectric conversion
- conversion module
- electrode
- chip
- conversion material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020182614 | 2020-10-30 | ||
| JP2020182610 | 2020-10-30 | ||
| JP2020182610 | 2020-10-30 | ||
| JP2020182614 | 2020-10-30 | ||
| JP2021062199 | 2021-03-31 | ||
| JP2021062199 | 2021-03-31 | ||
| PCT/JP2021/039750 WO2022092177A1 (ja) | 2020-10-30 | 2021-10-28 | 熱電変換モジュール |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022092177A1 JPWO2022092177A1 (https=) | 2022-05-05 |
| JPWO2022092177A5 true JPWO2022092177A5 (https=) | 2023-07-10 |
| JP7778715B2 JP7778715B2 (ja) | 2025-12-02 |
Family
ID=81382576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022559215A Active JP7778715B2 (ja) | 2020-10-30 | 2021-10-28 | 熱電変換モジュール |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12408551B2 (https=) |
| JP (1) | JP7778715B2 (https=) |
| CN (1) | CN116368965A (https=) |
| TW (1) | TWI905300B (https=) |
| WO (1) | WO2022092177A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115219021A (zh) * | 2022-07-14 | 2022-10-21 | 上海交通大学 | 一种芯片级超薄光功率计探头 |
| JPWO2024048473A1 (https=) * | 2022-08-31 | 2024-03-07 | ||
| CN120432451B (zh) * | 2025-07-07 | 2025-09-05 | 上海新微技术研发中心有限公司 | 一种集成电路芯片的无源散热器件 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4459428A (en) * | 1982-04-28 | 1984-07-10 | Energy Conversion Devices, Inc. | Thermoelectric device and method of making same |
| JP2001102643A (ja) | 1999-09-27 | 2001-04-13 | Seiko Instruments Inc | 熱電素子の製造方法 |
| JP2001352107A (ja) | 2000-06-07 | 2001-12-21 | Nissan Motor Co Ltd | 熱電変換モジュールの製造方法 |
| JP2003258323A (ja) * | 2002-03-07 | 2003-09-12 | Citizen Watch Co Ltd | 熱電素子 |
| TW200908251A (en) * | 2007-08-14 | 2009-02-16 | Mercury Microsystems Company Ltd | Multi-pillar micro thermoelectric cooler having large surface area and its manufacturing method |
| TWI405361B (zh) * | 2008-12-31 | 2013-08-11 | 財團法人工業技術研究院 | 熱電元件及其製程、晶片堆疊結構及晶片封裝結構 |
| EP3035397B1 (en) | 2013-09-25 | 2018-04-11 | Lintec Corporation | Heat-conductive adhesive sheet, manufacturing method for same, and electronic device using same |
| TWI514528B (zh) * | 2013-10-04 | 2015-12-21 | 隆達電子股份有限公司 | 半導體晶片結構 |
| KR20160028697A (ko) * | 2014-09-04 | 2016-03-14 | 한국전기연구원 | 벌크형 소면적 열전모듈 및 그 제조방법 |
| TWI661026B (zh) | 2014-12-26 | 2019-06-01 | Lintec Corporation | 熱傳導性接著薄片、其製造方法及使用其之電子裝置 |
| JP6371990B2 (ja) | 2015-04-27 | 2018-08-15 | 株式会社Ｅサーモジェンテック | 熱電変換モジュールとその製造方法、ならびに熱電発電システムとその製造方法 |
| KR20170019109A (ko) * | 2015-08-11 | 2017-02-21 | 홍익대학교 산학협력단 | 열전모듈의 제조방법 및 이에 의해 제조된 열전모듈 |
| KR101989908B1 (ko) * | 2015-10-27 | 2019-06-17 | 주식회사 테그웨이 | 유연 열전소자 및 이의 제조방법 |
| WO2017074003A1 (ko) | 2015-10-27 | 2017-05-04 | 한국과학기술원 | 유연 열전소자 및 이의 제조방법 |
| WO2018139475A1 (ja) | 2017-01-27 | 2018-08-02 | リンテック株式会社 | フレキシブル熱電変換素子及びその製造方法 |
| WO2018179544A1 (ja) * | 2017-03-30 | 2018-10-04 | リンテック株式会社 | 熱電変換モジュール及びその製造方法 |
| WO2019171915A1 (ja) * | 2018-03-08 | 2019-09-12 | 住友電気工業株式会社 | 熱電材料素子、発電装置、光センサおよび熱電材料の製造方法 |
| US11581469B2 (en) * | 2018-08-28 | 2023-02-14 | Lintec Corporation | Thermoelectric conversion material chip manufacturing method, and method for manufacturing thermoelectric conversion module using chip obtained by said manufacturing method |
| WO2020045379A1 (ja) * | 2018-08-28 | 2020-03-05 | リンテック株式会社 | 熱電変換材料のチップの製造方法及びその製造方法により得られたチップを用いた熱電変換モジュールの製造方法 |
-
2021
- 2021-10-28 US US18/034,442 patent/US12408551B2/en active Active
- 2021-10-28 CN CN202180073852.1A patent/CN116368965A/zh active Pending
- 2021-10-28 WO PCT/JP2021/039750 patent/WO2022092177A1/ja not_active Ceased
- 2021-10-28 JP JP2022559215A patent/JP7778715B2/ja active Active
- 2021-10-28 TW TW110140095A patent/TWI905300B/zh active
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