JP7778715B2 - 熱電変換モジュール - Google Patents

熱電変換モジュール

Info

Publication number
JP7778715B2
JP7778715B2 JP2022559215A JP2022559215A JP7778715B2 JP 7778715 B2 JP7778715 B2 JP 7778715B2 JP 2022559215 A JP2022559215 A JP 2022559215A JP 2022559215 A JP2022559215 A JP 2022559215A JP 7778715 B2 JP7778715 B2 JP 7778715B2
Authority
JP
Japan
Prior art keywords
thermoelectric conversion
electrode
type thermoelectric
chip
conversion module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022559215A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022092177A1 (https=
JPWO2022092177A5 (https=
Inventor
佑太 関
邦久 加藤
亘 森田
克彦 堀米
睦 升本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of JPWO2022092177A1 publication Critical patent/JPWO2022092177A1/ja
Publication of JPWO2022092177A5 publication Critical patent/JPWO2022092177A5/ja
Application granted granted Critical
Publication of JP7778715B2 publication Critical patent/JP7778715B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N11/00—Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/856—Thermoelectric active materials comprising organic compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/857—Thermoelectric active materials comprising compositions changing continuously or discontinuously inside the material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
JP2022559215A 2020-10-30 2021-10-28 熱電変換モジュール Active JP7778715B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2020182614 2020-10-30
JP2020182610 2020-10-30
JP2020182610 2020-10-30
JP2020182614 2020-10-30
JP2021062199 2021-03-31
JP2021062199 2021-03-31
PCT/JP2021/039750 WO2022092177A1 (ja) 2020-10-30 2021-10-28 熱電変換モジュール

Publications (3)

Publication Number Publication Date
JPWO2022092177A1 JPWO2022092177A1 (https=) 2022-05-05
JPWO2022092177A5 JPWO2022092177A5 (https=) 2023-07-10
JP7778715B2 true JP7778715B2 (ja) 2025-12-02

Family

ID=81382576

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022559215A Active JP7778715B2 (ja) 2020-10-30 2021-10-28 熱電変換モジュール

Country Status (5)

Country Link
US (1) US12408551B2 (https=)
JP (1) JP7778715B2 (https=)
CN (1) CN116368965A (https=)
TW (1) TWI905300B (https=)
WO (1) WO2022092177A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115219021A (zh) * 2022-07-14 2022-10-21 上海交通大学 一种芯片级超薄光功率计探头
JPWO2024048473A1 (https=) * 2022-08-31 2024-03-07
CN120432451B (zh) * 2025-07-07 2025-09-05 上海新微技术研发中心有限公司 一种集成电路芯片的无源散热器件

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003258323A (ja) 2002-03-07 2003-09-12 Citizen Watch Co Ltd 熱電素子
WO2015046253A1 (ja) 2013-09-25 2015-04-02 リンテック株式会社 熱伝導性接着シート、その製造方法及びそれを用いた電子デバイス
WO2016103784A1 (ja) 2014-12-26 2016-06-30 リンテック株式会社 熱伝導性接着シート、その製造方法及びそれを用いた電子デバイス
JP2016207995A (ja) 2015-04-27 2016-12-08 株式会社Ｅサーモジェンテック 熱電変換モジュールとその製造方法、ならびに熱電発電システムとその製造方法
WO2018139475A1 (ja) 2017-01-27 2018-08-02 リンテック株式会社 フレキシブル熱電変換素子及びその製造方法
WO2019171915A1 (ja) 2018-03-08 2019-09-12 住友電気工業株式会社 熱電材料素子、発電装置、光センサおよび熱電材料の製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4459428A (en) * 1982-04-28 1984-07-10 Energy Conversion Devices, Inc. Thermoelectric device and method of making same
JP2001102643A (ja) 1999-09-27 2001-04-13 Seiko Instruments Inc 熱電素子の製造方法
JP2001352107A (ja) 2000-06-07 2001-12-21 Nissan Motor Co Ltd 熱電変換モジュールの製造方法
TW200908251A (en) * 2007-08-14 2009-02-16 Mercury Microsystems Company Ltd Multi-pillar micro thermoelectric cooler having large surface area and its manufacturing method
TWI405361B (zh) * 2008-12-31 2013-08-11 財團法人工業技術研究院 熱電元件及其製程、晶片堆疊結構及晶片封裝結構
TWI514528B (zh) * 2013-10-04 2015-12-21 隆達電子股份有限公司 半導體晶片結構
KR20160028697A (ko) * 2014-09-04 2016-03-14 한국전기연구원 벌크형 소면적 열전모듈 및 그 제조방법
KR20170019109A (ko) * 2015-08-11 2017-02-21 홍익대학교 산학협력단 열전모듈의 제조방법 및 이에 의해 제조된 열전모듈
KR101989908B1 (ko) * 2015-10-27 2019-06-17 주식회사 테그웨이 유연 열전소자 및 이의 제조방법
WO2017074003A1 (ko) 2015-10-27 2017-05-04 한국과학기술원 유연 열전소자 및 이의 제조방법
WO2018179544A1 (ja) * 2017-03-30 2018-10-04 リンテック株式会社 熱電変換モジュール及びその製造方法
US11581469B2 (en) * 2018-08-28 2023-02-14 Lintec Corporation Thermoelectric conversion material chip manufacturing method, and method for manufacturing thermoelectric conversion module using chip obtained by said manufacturing method
WO2020045379A1 (ja) * 2018-08-28 2020-03-05 リンテック株式会社 熱電変換材料のチップの製造方法及びその製造方法により得られたチップを用いた熱電変換モジュールの製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003258323A (ja) 2002-03-07 2003-09-12 Citizen Watch Co Ltd 熱電素子
WO2015046253A1 (ja) 2013-09-25 2015-04-02 リンテック株式会社 熱伝導性接着シート、その製造方法及びそれを用いた電子デバイス
WO2016103784A1 (ja) 2014-12-26 2016-06-30 リンテック株式会社 熱伝導性接着シート、その製造方法及びそれを用いた電子デバイス
JP2016207995A (ja) 2015-04-27 2016-12-08 株式会社Ｅサーモジェンテック 熱電変換モジュールとその製造方法、ならびに熱電発電システムとその製造方法
WO2018139475A1 (ja) 2017-01-27 2018-08-02 リンテック株式会社 フレキシブル熱電変換素子及びその製造方法
WO2019171915A1 (ja) 2018-03-08 2019-09-12 住友電気工業株式会社 熱電材料素子、発電装置、光センサおよび熱電材料の製造方法

Also Published As

Publication number Publication date
TW202236702A (zh) 2022-09-16
JPWO2022092177A1 (https=) 2022-05-05
US20230380288A1 (en) 2023-11-23
US12408551B2 (en) 2025-09-02
TWI905300B (zh) 2025-11-21
CN116368965A (zh) 2023-06-30
WO2022092177A1 (ja) 2022-05-05

Similar Documents

Publication Publication Date Title
JP7778715B2 (ja) 熱電変換モジュール
JP7406756B2 (ja) 熱電変換モジュール及びその製造方法
JP7346427B2 (ja) 熱電変換材料のチップの製造方法及びその製造方法により得られたチップを用いた熱電変換モジュールの製造方法
CN110431676A (zh) 热电转换模块用电极材料及使用其的热电转换模块
JP7348192B2 (ja) 半導体素子
CN106787948B (zh) 一种耐高温半导体温差发电器件及制作方法
JP7591510B2 (ja) 熱電変換モジュール
JP7458375B2 (ja) 熱電変換材料のチップの製造方法
JP7401361B2 (ja) 熱電変換モジュール
JP7207858B2 (ja) 熱電変換モジュール
JP7770335B2 (ja) 熱電変換モジュールの製造方法
JP7854327B2 (ja) 熱電変換モジュールの製造方法
JP2025154927A (ja) 熱電変換モジュール
JP2024146619A (ja) 熱電変換モジュール
WO2021193358A1 (ja) 熱電変換モジュール
JP2025154929A (ja) 熱電変換モジュール
JP7781548B2 (ja) 半導体装置、及び、半導体装置の製造方法
WO2024204850A1 (ja) 熱電変換モジュール
KR20240147546A (ko) 펠티에 냉각 열전 변환 모듈
JP2024146617A (ja) 熱電変換モジュール
WO2023190633A1 (ja) 熱電変換モジュール
US20230139556A1 (en) Thermoelectric conversion module
WO2023136155A1 (ja) 温度制御モジュール
JP2024146616A (ja) 熱電変換モジュール
WO2023181194A1 (ja) 熱電変換モジュール及びその製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230623

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230623

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20230623

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20231010

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20231211

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240312

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20240513

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240711

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20241022

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250122

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20251119

R150 Certificate of patent or registration of utility model

Ref document number: 7778715

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150