JPWO2022092177A1 - - Google Patents
Info
- Publication number
- JPWO2022092177A1 JPWO2022092177A1 JP2022559215A JP2022559215A JPWO2022092177A1 JP WO2022092177 A1 JPWO2022092177 A1 JP WO2022092177A1 JP 2022559215 A JP2022559215 A JP 2022559215A JP 2022559215 A JP2022559215 A JP 2022559215A JP WO2022092177 A1 JPWO2022092177 A1 JP WO2022092177A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N11/00—Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/856—Thermoelectric active materials comprising organic compositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/857—Thermoelectric active materials comprising compositions changing continuously or discontinuously inside the material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020182614 | 2020-10-30 | ||
| JP2020182610 | 2020-10-30 | ||
| JP2020182610 | 2020-10-30 | ||
| JP2020182614 | 2020-10-30 | ||
| JP2021062199 | 2021-03-31 | ||
| JP2021062199 | 2021-03-31 | ||
| PCT/JP2021/039750 WO2022092177A1 (ja) | 2020-10-30 | 2021-10-28 | 熱電変換モジュール |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022092177A1 true JPWO2022092177A1 (https=) | 2022-05-05 |
| JPWO2022092177A5 JPWO2022092177A5 (https=) | 2023-07-10 |
| JP7778715B2 JP7778715B2 (ja) | 2025-12-02 |
Family
ID=81382576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022559215A Active JP7778715B2 (ja) | 2020-10-30 | 2021-10-28 | 熱電変換モジュール |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12408551B2 (https=) |
| JP (1) | JP7778715B2 (https=) |
| CN (1) | CN116368965A (https=) |
| TW (1) | TWI905300B (https=) |
| WO (1) | WO2022092177A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115219021A (zh) * | 2022-07-14 | 2022-10-21 | 上海交通大学 | 一种芯片级超薄光功率计探头 |
| JPWO2024048473A1 (https=) * | 2022-08-31 | 2024-03-07 | ||
| CN120432451B (zh) * | 2025-07-07 | 2025-09-05 | 上海新微技术研发中心有限公司 | 一种集成电路芯片的无源散热器件 |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001352107A (ja) * | 2000-06-07 | 2001-12-21 | Nissan Motor Co Ltd | 熱電変換モジュールの製造方法 |
| JP2003258323A (ja) * | 2002-03-07 | 2003-09-12 | Citizen Watch Co Ltd | 熱電素子 |
| WO2015046253A1 (ja) * | 2013-09-25 | 2015-04-02 | リンテック株式会社 | 熱伝導性接着シート、その製造方法及びそれを用いた電子デバイス |
| WO2016103784A1 (ja) * | 2014-12-26 | 2016-06-30 | リンテック株式会社 | 熱伝導性接着シート、その製造方法及びそれを用いた電子デバイス |
| JP2016207995A (ja) * | 2015-04-27 | 2016-12-08 | 株式会社Ｅサーモジェンテック | 熱電変換モジュールとその製造方法、ならびに熱電発電システムとその製造方法 |
| KR20170019109A (ko) * | 2015-08-11 | 2017-02-21 | 홍익대학교 산학협력단 | 열전모듈의 제조방법 및 이에 의해 제조된 열전모듈 |
| WO2018139475A1 (ja) * | 2017-01-27 | 2018-08-02 | リンテック株式会社 | フレキシブル熱電変換素子及びその製造方法 |
| WO2018181661A1 (ja) * | 2017-03-30 | 2018-10-04 | リンテック株式会社 | 熱電変換デバイス |
| JP2019500757A (ja) * | 2015-10-27 | 2019-01-10 | コリア アドバンスト インスティチュート オブ サイエンス アンド テクノロジー | 柔軟な熱電素子及びその製造方法 |
| WO2019171915A1 (ja) * | 2018-03-08 | 2019-09-12 | 住友電気工業株式会社 | 熱電材料素子、発電装置、光センサおよび熱電材料の製造方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4459428A (en) * | 1982-04-28 | 1984-07-10 | Energy Conversion Devices, Inc. | Thermoelectric device and method of making same |
| JP2001102643A (ja) | 1999-09-27 | 2001-04-13 | Seiko Instruments Inc | 熱電素子の製造方法 |
| TW200908251A (en) * | 2007-08-14 | 2009-02-16 | Mercury Microsystems Company Ltd | Multi-pillar micro thermoelectric cooler having large surface area and its manufacturing method |
| TWI405361B (zh) * | 2008-12-31 | 2013-08-11 | 財團法人工業技術研究院 | 熱電元件及其製程、晶片堆疊結構及晶片封裝結構 |
| TWI514528B (zh) * | 2013-10-04 | 2015-12-21 | 隆達電子股份有限公司 | 半導體晶片結構 |
| KR20160028697A (ko) * | 2014-09-04 | 2016-03-14 | 한국전기연구원 | 벌크형 소면적 열전모듈 및 그 제조방법 |
| WO2017074003A1 (ko) | 2015-10-27 | 2017-05-04 | 한국과학기술원 | 유연 열전소자 및 이의 제조방법 |
| US11581469B2 (en) * | 2018-08-28 | 2023-02-14 | Lintec Corporation | Thermoelectric conversion material chip manufacturing method, and method for manufacturing thermoelectric conversion module using chip obtained by said manufacturing method |
| WO2020045379A1 (ja) * | 2018-08-28 | 2020-03-05 | リンテック株式会社 | 熱電変換材料のチップの製造方法及びその製造方法により得られたチップを用いた熱電変換モジュールの製造方法 |
-
2021
- 2021-10-28 US US18/034,442 patent/US12408551B2/en active Active
- 2021-10-28 CN CN202180073852.1A patent/CN116368965A/zh active Pending
- 2021-10-28 WO PCT/JP2021/039750 patent/WO2022092177A1/ja not_active Ceased
- 2021-10-28 JP JP2022559215A patent/JP7778715B2/ja active Active
- 2021-10-28 TW TW110140095A patent/TWI905300B/zh active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001352107A (ja) * | 2000-06-07 | 2001-12-21 | Nissan Motor Co Ltd | 熱電変換モジュールの製造方法 |
| JP2003258323A (ja) * | 2002-03-07 | 2003-09-12 | Citizen Watch Co Ltd | 熱電素子 |
| WO2015046253A1 (ja) * | 2013-09-25 | 2015-04-02 | リンテック株式会社 | 熱伝導性接着シート、その製造方法及びそれを用いた電子デバイス |
| WO2016103784A1 (ja) * | 2014-12-26 | 2016-06-30 | リンテック株式会社 | 熱伝導性接着シート、その製造方法及びそれを用いた電子デバイス |
| JP2016207995A (ja) * | 2015-04-27 | 2016-12-08 | 株式会社Ｅサーモジェンテック | 熱電変換モジュールとその製造方法、ならびに熱電発電システムとその製造方法 |
| KR20170019109A (ko) * | 2015-08-11 | 2017-02-21 | 홍익대학교 산학협력단 | 열전모듈의 제조방법 및 이에 의해 제조된 열전모듈 |
| JP2019500757A (ja) * | 2015-10-27 | 2019-01-10 | コリア アドバンスト インスティチュート オブ サイエンス アンド テクノロジー | 柔軟な熱電素子及びその製造方法 |
| WO2018139475A1 (ja) * | 2017-01-27 | 2018-08-02 | リンテック株式会社 | フレキシブル熱電変換素子及びその製造方法 |
| WO2018181661A1 (ja) * | 2017-03-30 | 2018-10-04 | リンテック株式会社 | 熱電変換デバイス |
| WO2018181660A1 (ja) * | 2017-03-30 | 2018-10-04 | リンテック株式会社 | 熱電変換素子層及びその製造方法 |
| WO2018179544A1 (ja) * | 2017-03-30 | 2018-10-04 | リンテック株式会社 | 熱電変換モジュール及びその製造方法 |
| WO2019171915A1 (ja) * | 2018-03-08 | 2019-09-12 | 住友電気工業株式会社 | 熱電材料素子、発電装置、光センサおよび熱電材料の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202236702A (zh) | 2022-09-16 |
| US20230380288A1 (en) | 2023-11-23 |
| JP7778715B2 (ja) | 2025-12-02 |
| US12408551B2 (en) | 2025-09-02 |
| TWI905300B (zh) | 2025-11-21 |
| CN116368965A (zh) | 2023-06-30 |
| WO2022092177A1 (ja) | 2022-05-05 |
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