TWI905300B - 熱電變換模組 - Google Patents
熱電變換模組Info
- Publication number
- TWI905300B TWI905300B TW110140095A TW110140095A TWI905300B TW I905300 B TWI905300 B TW I905300B TW 110140095 A TW110140095 A TW 110140095A TW 110140095 A TW110140095 A TW 110140095A TW I905300 B TWI905300 B TW I905300B
- Authority
- TW
- Taiwan
- Prior art keywords
- thermoelectric conversion
- aforementioned
- electrode
- conversion material
- conversion module
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N11/00—Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/856—Thermoelectric active materials comprising organic compositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/857—Thermoelectric active materials comprising compositions changing continuously or discontinuously inside the material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-182610 | 2020-10-30 | ||
| JP2020182614 | 2020-10-30 | ||
| JP2020182610 | 2020-10-30 | ||
| JP2020-182614 | 2020-10-30 | ||
| JP2021-062199 | 2021-03-31 | ||
| JP2021062199 | 2021-03-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202236702A TW202236702A (zh) | 2022-09-16 |
| TWI905300B true TWI905300B (zh) | 2025-11-21 |
Family
ID=81382576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110140095A TWI905300B (zh) | 2020-10-30 | 2021-10-28 | 熱電變換模組 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12408551B2 (https=) |
| JP (1) | JP7778715B2 (https=) |
| CN (1) | CN116368965A (https=) |
| TW (1) | TWI905300B (https=) |
| WO (1) | WO2022092177A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115219021A (zh) * | 2022-07-14 | 2022-10-21 | 上海交通大学 | 一种芯片级超薄光功率计探头 |
| JPWO2024048473A1 (https=) * | 2022-08-31 | 2024-03-07 | ||
| CN120432451B (zh) * | 2025-07-07 | 2025-09-05 | 上海新微技术研发中心有限公司 | 一种集成电路芯片的无源散热器件 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4459428A (en) * | 1982-04-28 | 1984-07-10 | Energy Conversion Devices, Inc. | Thermoelectric device and method of making same |
| TW200908251A (en) * | 2007-08-14 | 2009-02-16 | Mercury Microsystems Company Ltd | Multi-pillar micro thermoelectric cooler having large surface area and its manufacturing method |
| TW201025686A (en) * | 2008-12-31 | 2010-07-01 | Ind Tech Res Inst | Thermoelectric device and process thereof and stacked structure of chips and chip package structure |
| TW201515167A (zh) * | 2013-10-04 | 2015-04-16 | 隆達電子股份有限公司 | 半導體晶片結構 |
| US20180233648A1 (en) * | 2015-10-27 | 2018-08-16 | Korea Advanced Institute Of Science And Technology | Flexible thermoelectric elelment and production method therefor |
| TW202029536A (zh) * | 2018-08-28 | 2020-08-01 | 日商琳得科股份有限公司 | 熱電轉換材料的晶片的製造方法及使用由此製造方法得到的晶片的熱電轉換模組的製造方法 |
| TW202036940A (zh) * | 2018-08-28 | 2020-10-01 | 日商琳得科股份有限公司 | 熱電轉換材料的晶片的製造方法及使用由此製造方法得到的晶片的熱電轉換模組的製造方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001102643A (ja) | 1999-09-27 | 2001-04-13 | Seiko Instruments Inc | 熱電素子の製造方法 |
| JP2001352107A (ja) | 2000-06-07 | 2001-12-21 | Nissan Motor Co Ltd | 熱電変換モジュールの製造方法 |
| JP2003258323A (ja) * | 2002-03-07 | 2003-09-12 | Citizen Watch Co Ltd | 熱電素子 |
| EP3035397B1 (en) | 2013-09-25 | 2018-04-11 | Lintec Corporation | Heat-conductive adhesive sheet, manufacturing method for same, and electronic device using same |
| KR20160028697A (ko) * | 2014-09-04 | 2016-03-14 | 한국전기연구원 | 벌크형 소면적 열전모듈 및 그 제조방법 |
| TWI661026B (zh) | 2014-12-26 | 2019-06-01 | Lintec Corporation | 熱傳導性接著薄片、其製造方法及使用其之電子裝置 |
| JP6371990B2 (ja) | 2015-04-27 | 2018-08-15 | 株式会社Eサーモジェンテック | 熱電変換モジュールとその製造方法、ならびに熱電発電システムとその製造方法 |
| KR20170019109A (ko) * | 2015-08-11 | 2017-02-21 | 홍익대학교 산학협력단 | 열전모듈의 제조방법 및 이에 의해 제조된 열전모듈 |
| WO2017074003A1 (ko) | 2015-10-27 | 2017-05-04 | 한국과학기술원 | 유연 열전소자 및 이의 제조방법 |
| WO2018139475A1 (ja) | 2017-01-27 | 2018-08-02 | リンテック株式会社 | フレキシブル熱電変換素子及びその製造方法 |
| WO2018179544A1 (ja) * | 2017-03-30 | 2018-10-04 | リンテック株式会社 | 熱電変換モジュール及びその製造方法 |
| WO2019171915A1 (ja) * | 2018-03-08 | 2019-09-12 | 住友電気工業株式会社 | 熱電材料素子、発電装置、光センサおよび熱電材料の製造方法 |
-
2021
- 2021-10-28 US US18/034,442 patent/US12408551B2/en active Active
- 2021-10-28 CN CN202180073852.1A patent/CN116368965A/zh active Pending
- 2021-10-28 WO PCT/JP2021/039750 patent/WO2022092177A1/ja not_active Ceased
- 2021-10-28 JP JP2022559215A patent/JP7778715B2/ja active Active
- 2021-10-28 TW TW110140095A patent/TWI905300B/zh active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4459428A (en) * | 1982-04-28 | 1984-07-10 | Energy Conversion Devices, Inc. | Thermoelectric device and method of making same |
| TW200908251A (en) * | 2007-08-14 | 2009-02-16 | Mercury Microsystems Company Ltd | Multi-pillar micro thermoelectric cooler having large surface area and its manufacturing method |
| TW201025686A (en) * | 2008-12-31 | 2010-07-01 | Ind Tech Res Inst | Thermoelectric device and process thereof and stacked structure of chips and chip package structure |
| TW201515167A (zh) * | 2013-10-04 | 2015-04-16 | 隆達電子股份有限公司 | 半導體晶片結構 |
| US20180233648A1 (en) * | 2015-10-27 | 2018-08-16 | Korea Advanced Institute Of Science And Technology | Flexible thermoelectric elelment and production method therefor |
| TW202029536A (zh) * | 2018-08-28 | 2020-08-01 | 日商琳得科股份有限公司 | 熱電轉換材料的晶片的製造方法及使用由此製造方法得到的晶片的熱電轉換模組的製造方法 |
| TW202036940A (zh) * | 2018-08-28 | 2020-10-01 | 日商琳得科股份有限公司 | 熱電轉換材料的晶片的製造方法及使用由此製造方法得到的晶片的熱電轉換模組的製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202236702A (zh) | 2022-09-16 |
| JPWO2022092177A1 (https=) | 2022-05-05 |
| US20230380288A1 (en) | 2023-11-23 |
| JP7778715B2 (ja) | 2025-12-02 |
| US12408551B2 (en) | 2025-09-02 |
| CN116368965A (zh) | 2023-06-30 |
| WO2022092177A1 (ja) | 2022-05-05 |
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