TWI905300B - 熱電變換模組 - Google Patents

熱電變換模組

Info

Publication number
TWI905300B
TWI905300B TW110140095A TW110140095A TWI905300B TW I905300 B TWI905300 B TW I905300B TW 110140095 A TW110140095 A TW 110140095A TW 110140095 A TW110140095 A TW 110140095A TW I905300 B TWI905300 B TW I905300B
Authority
TW
Taiwan
Prior art keywords
thermoelectric conversion
aforementioned
electrode
conversion material
conversion module
Prior art date
Application number
TW110140095A
Other languages
English (en)
Chinese (zh)
Other versions
TW202236702A (zh
Inventor
関佑太
加藤邦久
森田亘
堀米克彦
升本睦
Original Assignee
日商琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW202236702A publication Critical patent/TW202236702A/zh
Application granted granted Critical
Publication of TWI905300B publication Critical patent/TWI905300B/zh

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02NELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N11/00Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80Constructional details
    • H10N10/85Thermoelectric active materials
    • H10N10/856Thermoelectric active materials comprising organic compositions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80Constructional details
    • H10N10/85Thermoelectric active materials
    • H10N10/857Thermoelectric active materials comprising compositions changing continuously or discontinuously inside the material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
TW110140095A 2020-10-30 2021-10-28 熱電變換模組 TWI905300B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2020-182610 2020-10-30
JP2020182614 2020-10-30
JP2020182610 2020-10-30
JP2020-182614 2020-10-30
JP2021-062199 2021-03-31
JP2021062199 2021-03-31

Publications (2)

Publication Number Publication Date
TW202236702A TW202236702A (zh) 2022-09-16
TWI905300B true TWI905300B (zh) 2025-11-21

Family

ID=81382576

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110140095A TWI905300B (zh) 2020-10-30 2021-10-28 熱電變換模組

Country Status (5)

Country Link
US (1) US12408551B2 (https=)
JP (1) JP7778715B2 (https=)
CN (1) CN116368965A (https=)
TW (1) TWI905300B (https=)
WO (1) WO2022092177A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115219021A (zh) * 2022-07-14 2022-10-21 上海交通大学 一种芯片级超薄光功率计探头
JPWO2024048473A1 (https=) * 2022-08-31 2024-03-07
CN120432451B (zh) * 2025-07-07 2025-09-05 上海新微技术研发中心有限公司 一种集成电路芯片的无源散热器件

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4459428A (en) * 1982-04-28 1984-07-10 Energy Conversion Devices, Inc. Thermoelectric device and method of making same
TW200908251A (en) * 2007-08-14 2009-02-16 Mercury Microsystems Company Ltd Multi-pillar micro thermoelectric cooler having large surface area and its manufacturing method
TW201025686A (en) * 2008-12-31 2010-07-01 Ind Tech Res Inst Thermoelectric device and process thereof and stacked structure of chips and chip package structure
TW201515167A (zh) * 2013-10-04 2015-04-16 隆達電子股份有限公司 半導體晶片結構
US20180233648A1 (en) * 2015-10-27 2018-08-16 Korea Advanced Institute Of Science And Technology Flexible thermoelectric elelment and production method therefor
TW202029536A (zh) * 2018-08-28 2020-08-01 日商琳得科股份有限公司 熱電轉換材料的晶片的製造方法及使用由此製造方法得到的晶片的熱電轉換模組的製造方法
TW202036940A (zh) * 2018-08-28 2020-10-01 日商琳得科股份有限公司 熱電轉換材料的晶片的製造方法及使用由此製造方法得到的晶片的熱電轉換模組的製造方法

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Publication number Priority date Publication date Assignee Title
JP2001102643A (ja) 1999-09-27 2001-04-13 Seiko Instruments Inc 熱電素子の製造方法
JP2001352107A (ja) 2000-06-07 2001-12-21 Nissan Motor Co Ltd 熱電変換モジュールの製造方法
JP2003258323A (ja) * 2002-03-07 2003-09-12 Citizen Watch Co Ltd 熱電素子
EP3035397B1 (en) 2013-09-25 2018-04-11 Lintec Corporation Heat-conductive adhesive sheet, manufacturing method for same, and electronic device using same
KR20160028697A (ko) * 2014-09-04 2016-03-14 한국전기연구원 벌크형 소면적 열전모듈 및 그 제조방법
TWI661026B (zh) 2014-12-26 2019-06-01 Lintec Corporation 熱傳導性接著薄片、其製造方法及使用其之電子裝置
JP6371990B2 (ja) 2015-04-27 2018-08-15 株式会社Eサーモジェンテック 熱電変換モジュールとその製造方法、ならびに熱電発電システムとその製造方法
KR20170019109A (ko) * 2015-08-11 2017-02-21 홍익대학교 산학협력단 열전모듈의 제조방법 및 이에 의해 제조된 열전모듈
WO2017074003A1 (ko) 2015-10-27 2017-05-04 한국과학기술원 유연 열전소자 및 이의 제조방법
WO2018139475A1 (ja) 2017-01-27 2018-08-02 リンテック株式会社 フレキシブル熱電変換素子及びその製造方法
WO2018179544A1 (ja) * 2017-03-30 2018-10-04 リンテック株式会社 熱電変換モジュール及びその製造方法
WO2019171915A1 (ja) * 2018-03-08 2019-09-12 住友電気工業株式会社 熱電材料素子、発電装置、光センサおよび熱電材料の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4459428A (en) * 1982-04-28 1984-07-10 Energy Conversion Devices, Inc. Thermoelectric device and method of making same
TW200908251A (en) * 2007-08-14 2009-02-16 Mercury Microsystems Company Ltd Multi-pillar micro thermoelectric cooler having large surface area and its manufacturing method
TW201025686A (en) * 2008-12-31 2010-07-01 Ind Tech Res Inst Thermoelectric device and process thereof and stacked structure of chips and chip package structure
TW201515167A (zh) * 2013-10-04 2015-04-16 隆達電子股份有限公司 半導體晶片結構
US20180233648A1 (en) * 2015-10-27 2018-08-16 Korea Advanced Institute Of Science And Technology Flexible thermoelectric elelment and production method therefor
TW202029536A (zh) * 2018-08-28 2020-08-01 日商琳得科股份有限公司 熱電轉換材料的晶片的製造方法及使用由此製造方法得到的晶片的熱電轉換模組的製造方法
TW202036940A (zh) * 2018-08-28 2020-10-01 日商琳得科股份有限公司 熱電轉換材料的晶片的製造方法及使用由此製造方法得到的晶片的熱電轉換模組的製造方法

Also Published As

Publication number Publication date
TW202236702A (zh) 2022-09-16
JPWO2022092177A1 (https=) 2022-05-05
US20230380288A1 (en) 2023-11-23
JP7778715B2 (ja) 2025-12-02
US12408551B2 (en) 2025-09-02
CN116368965A (zh) 2023-06-30
WO2022092177A1 (ja) 2022-05-05

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