CN116368965A - 热电转换组件 - Google Patents

热电转换组件 Download PDF

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Publication number
CN116368965A
CN116368965A CN202180073852.1A CN202180073852A CN116368965A CN 116368965 A CN116368965 A CN 116368965A CN 202180073852 A CN202180073852 A CN 202180073852A CN 116368965 A CN116368965 A CN 116368965A
Authority
CN
China
Prior art keywords
thermoelectric conversion
chip
electrode
conversion material
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180073852.1A
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English (en)
Chinese (zh)
Inventor
关佑太
加藤邦久
森田亘
堀米克彦
升本睦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of CN116368965A publication Critical patent/CN116368965A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N11/00—Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/856—Thermoelectric active materials comprising organic compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/857—Thermoelectric active materials comprising compositions changing continuously or discontinuously inside the material

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
CN202180073852.1A 2020-10-30 2021-10-28 热电转换组件 Pending CN116368965A (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2020-182610 2020-10-30
JP2020182614 2020-10-30
JP2020182610 2020-10-30
JP2020-182614 2020-10-30
JP2021-062199 2021-03-31
JP2021062199 2021-03-31
PCT/JP2021/039750 WO2022092177A1 (ja) 2020-10-30 2021-10-28 熱電変換モジュール

Publications (1)

Publication Number Publication Date
CN116368965A true CN116368965A (zh) 2023-06-30

Family

ID=81382576

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180073852.1A Pending CN116368965A (zh) 2020-10-30 2021-10-28 热电转换组件

Country Status (5)

Country Link
US (1) US12408551B2 (https=)
JP (1) JP7778715B2 (https=)
CN (1) CN116368965A (https=)
TW (1) TWI905300B (https=)
WO (1) WO2022092177A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115219021A (zh) * 2022-07-14 2022-10-21 上海交通大学 一种芯片级超薄光功率计探头
JPWO2024048473A1 (https=) * 2022-08-31 2024-03-07
CN120432451B (zh) * 2025-07-07 2025-09-05 上海新微技术研发中心有限公司 一种集成电路芯片的无源散热器件

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4459428A (en) * 1982-04-28 1984-07-10 Energy Conversion Devices, Inc. Thermoelectric device and method of making same
JP2001102643A (ja) 1999-09-27 2001-04-13 Seiko Instruments Inc 熱電素子の製造方法
JP2001352107A (ja) 2000-06-07 2001-12-21 Nissan Motor Co Ltd 熱電変換モジュールの製造方法
JP2003258323A (ja) * 2002-03-07 2003-09-12 Citizen Watch Co Ltd 熱電素子
TW200908251A (en) * 2007-08-14 2009-02-16 Mercury Microsystems Company Ltd Multi-pillar micro thermoelectric cooler having large surface area and its manufacturing method
TWI405361B (zh) * 2008-12-31 2013-08-11 財團法人工業技術研究院 熱電元件及其製程、晶片堆疊結構及晶片封裝結構
EP3035397B1 (en) 2013-09-25 2018-04-11 Lintec Corporation Heat-conductive adhesive sheet, manufacturing method for same, and electronic device using same
TWI514528B (zh) * 2013-10-04 2015-12-21 隆達電子股份有限公司 半導體晶片結構
KR20160028697A (ko) * 2014-09-04 2016-03-14 한국전기연구원 벌크형 소면적 열전모듈 및 그 제조방법
TWI661026B (zh) 2014-12-26 2019-06-01 Lintec Corporation 熱傳導性接著薄片、其製造方法及使用其之電子裝置
JP6371990B2 (ja) 2015-04-27 2018-08-15 株式会社Ｅサーモジェンテック 熱電変換モジュールとその製造方法、ならびに熱電発電システムとその製造方法
KR20170019109A (ko) * 2015-08-11 2017-02-21 홍익대학교 산학협력단 열전모듈의 제조방법 및 이에 의해 제조된 열전모듈
KR101989908B1 (ko) * 2015-10-27 2019-06-17 주식회사 테그웨이 유연 열전소자 및 이의 제조방법
WO2017074003A1 (ko) 2015-10-27 2017-05-04 한국과학기술원 유연 열전소자 및 이의 제조방법
WO2018139475A1 (ja) 2017-01-27 2018-08-02 リンテック株式会社 フレキシブル熱電変換素子及びその製造方法
WO2018179544A1 (ja) * 2017-03-30 2018-10-04 リンテック株式会社 熱電変換モジュール及びその製造方法
WO2019171915A1 (ja) * 2018-03-08 2019-09-12 住友電気工業株式会社 熱電材料素子、発電装置、光センサおよび熱電材料の製造方法
US11581469B2 (en) * 2018-08-28 2023-02-14 Lintec Corporation Thermoelectric conversion material chip manufacturing method, and method for manufacturing thermoelectric conversion module using chip obtained by said manufacturing method
WO2020045379A1 (ja) * 2018-08-28 2020-03-05 リンテック株式会社 熱電変換材料のチップの製造方法及びその製造方法により得られたチップを用いた熱電変換モジュールの製造方法

Also Published As

Publication number Publication date
TW202236702A (zh) 2022-09-16
JPWO2022092177A1 (https=) 2022-05-05
US20230380288A1 (en) 2023-11-23
JP7778715B2 (ja) 2025-12-02
US12408551B2 (en) 2025-09-02
TWI905300B (zh) 2025-11-21
WO2022092177A1 (ja) 2022-05-05

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