JPWO2024075514A5 - - Google Patents

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Publication number
JPWO2024075514A5
JPWO2024075514A5 JP2024555701A JP2024555701A JPWO2024075514A5 JP WO2024075514 A5 JPWO2024075514 A5 JP WO2024075514A5 JP 2024555701 A JP2024555701 A JP 2024555701A JP 2024555701 A JP2024555701 A JP 2024555701A JP WO2024075514 A5 JPWO2024075514 A5 JP WO2024075514A5
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JP
Japan
Prior art keywords
layer
structure according
bonded
surface layer
bonded structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024555701A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024075514A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/033925 external-priority patent/WO2024075514A1/ja
Publication of JPWO2024075514A1 publication Critical patent/JPWO2024075514A1/ja
Publication of JPWO2024075514A5 publication Critical patent/JPWO2024075514A5/ja
Pending legal-status Critical Current

Links

JP2024555701A 2022-10-04 2023-09-19 Pending JPWO2024075514A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022159985 2022-10-04
PCT/JP2023/033925 WO2024075514A1 (ja) 2022-10-04 2023-09-19 接合構造体および半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024075514A1 JPWO2024075514A1 (https=) 2024-04-11
JPWO2024075514A5 true JPWO2024075514A5 (https=) 2025-06-19

Family

ID=90607989

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024555701A Pending JPWO2024075514A1 (https=) 2022-10-04 2023-09-19

Country Status (4)

Country Link
US (1) US20250233057A1 (https=)
JP (1) JPWO2024075514A1 (https=)
CN (1) CN119998947A (https=)
WO (1) WO2024075514A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6432466B2 (ja) * 2014-08-26 2018-12-05 三菱マテリアル株式会社 接合体、ヒートシンク付パワーモジュール用基板、ヒートシンク、接合体の製造方法、ヒートシンク付パワーモジュール用基板の製造方法、及び、ヒートシンクの製造方法
JP2022063488A (ja) * 2020-10-12 2022-04-22 ローム株式会社 半導体装置
CN116018677A (zh) * 2020-10-14 2023-04-25 罗姆股份有限公司 半导体模块

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