DE112022003485T5 - Halbleiterbauteil - Google Patents

Halbleiterbauteil Download PDF

Info

Publication number
DE112022003485T5
DE112022003485T5 DE112022003485.8T DE112022003485T DE112022003485T5 DE 112022003485 T5 DE112022003485 T5 DE 112022003485T5 DE 112022003485 T DE112022003485 T DE 112022003485T DE 112022003485 T5 DE112022003485 T5 DE 112022003485T5
Authority
DE
Germany
Prior art keywords
wiring part
conductive
wiring
semiconductor elements
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112022003485.8T
Other languages
German (de)
English (en)
Inventor
Kohei Tanikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of DE112022003485T5 publication Critical patent/DE112022003485T5/de
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/658—Shapes or dispositions of interconnections for devices provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/752—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/755—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a laterally-adjacent insulating package substrate, interpose or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/791—Package configurations characterised by the relative positions of pads or connectors relative to package parts of direct-bonded pads
    • H10W90/792—Package configurations characterised by the relative positions of pads or connectors relative to package parts of direct-bonded pads between multiple chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/791—Package configurations characterised by the relative positions of pads or connectors relative to package parts of direct-bonded pads
    • H10W90/794—Package configurations characterised by the relative positions of pads or connectors relative to package parts of direct-bonded pads between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE112022003485.8T 2021-08-10 2022-07-15 Halbleiterbauteil Pending DE112022003485T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021130765 2021-08-10
JP2021-130765 2021-08-10
PCT/JP2022/027807 WO2023017708A1 (ja) 2021-08-10 2022-07-15 半導体装置

Publications (1)

Publication Number Publication Date
DE112022003485T5 true DE112022003485T5 (de) 2024-05-16

Family

ID=85200477

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112022003485.8T Pending DE112022003485T5 (de) 2021-08-10 2022-07-15 Halbleiterbauteil

Country Status (5)

Country Link
US (1) US20240105578A1 (https=)
JP (1) JPWO2023017708A1 (https=)
CN (1) CN117652023A (https=)
DE (1) DE112022003485T5 (https=)
WO (1) WO2023017708A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024224995A1 (ja) * 2023-04-25 2024-10-31 ローム株式会社 半導体装置および半導体装置の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6228490B2 (ja) * 2014-03-04 2017-11-08 ローム株式会社 半導体装置および半導体装置の製造方法
JPWO2019187700A1 (ja) * 2018-03-26 2021-02-12 パナソニックＩｐマネジメント株式会社 半導体モジュール
JP7284566B2 (ja) * 2018-10-29 2023-05-31 ローム株式会社 半導体装置
DE112021002615T5 (de) * 2020-08-05 2023-03-23 Rohm Co., Ltd. Halbleiterbauteil

Also Published As

Publication number Publication date
CN117652023A (zh) 2024-03-05
JPWO2023017708A1 (https=) 2023-02-16
WO2023017708A1 (ja) 2023-02-16
US20240105578A1 (en) 2024-03-28

Similar Documents

Publication Publication Date Title
DE10310809B4 (de) Leistungshalbleitereinrichtung
DE102014118836B4 (de) Halbleiter-packaging-anordnung und halbleiter-package
DE102008051965B4 (de) Bauelement mit mehreren Halbleiterchips
DE102013207804B4 (de) Verfahren zum Herstellen eines Leistungsmoduls mit mittels Lichtbogenschweissen direkt verbundenen, wärmeleitenden Strukturen
DE112014001487B4 (de) Halbleitermodul
DE102007006447B4 (de) Elektronisches Modul und Verfahren zur Herstellung des elektronischen Moduls
DE112018006370B4 (de) Halbleitereinrichtung
DE102015118633A1 (de) Ein Leistungshalbleitermodul mit einem Direct Copper Bonded Substrat und einem integrierten passiven Bauelement und ein integriertes Leistungsmodul
DE102016109853A1 (de) Chipträger und Halbleitervorrichtung mit Umverteilungsstrukturen mit verbesserter thermischer und elektrischer Leistung
DE102020127327B4 (de) Gestapeltes Transistorchip-Package mit Source-Kopplung
DE102006008632A1 (de) Leistungshalbleiterbauteil und Verfahren zu dessen Herstellung
DE102019108988B3 (de) Leistungshalbleitermodul und verfahren zur herstellung desselben
DE102016000264B4 (de) Halbleiterchipgehäuse, das sich lateral erstreckende Anschlüsse umfasst, und Verfahren zur Herstellung desselben
DE102018104509A1 (de) Halbleitervorrichtung
DE102022120081A1 (de) Leistungsschaltungsmodul
DE112023001614T5 (de) Halbleitervorrichtung
DE102021125094A1 (de) Halbleitergehäuse mit einem chip-träger mit einem pad-offset-merkmal
DE112021002397T5 (de) Halbleitermodul
DE112022002286T5 (de) Verbindungsstruktur und halbleiterbauteil
DE112022002743T5 (de) Halbleitervorrichtung
DE112022002551T5 (de) Halbleiterbauteil
DE112022006171T5 (de) Halbleitervorrichtung
DE102016223651A1 (de) Halbleitermodul und halbleitervorrichtung
DE112022003485T5 (de) Halbleiterbauteil
DE102020125371B4 (de) Package mit Pad, welches eine offene Aussparung hat

Legal Events

Date Code Title Description
R012 Request for examination validly filed
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0025070000

Ipc: H10D0080200000