JPWO2024048187A5 - - Google Patents

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Publication number
JPWO2024048187A5
JPWO2024048187A5 JP2024544062A JP2024544062A JPWO2024048187A5 JP WO2024048187 A5 JPWO2024048187 A5 JP WO2024048187A5 JP 2024544062 A JP2024544062 A JP 2024544062A JP 2024544062 A JP2024544062 A JP 2024544062A JP WO2024048187 A5 JPWO2024048187 A5 JP WO2024048187A5
Authority
JP
Japan
Prior art keywords
semiconductor device
surface electrode
principal surface
wire
positioning member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024544062A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024048187A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/028284 external-priority patent/WO2024048187A1/ja
Publication of JPWO2024048187A1 publication Critical patent/JPWO2024048187A1/ja
Publication of JPWO2024048187A5 publication Critical patent/JPWO2024048187A5/ja
Pending legal-status Critical Current

Links

JP2024544062A 2022-09-02 2023-08-02 Pending JPWO2024048187A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022139667 2022-09-02
PCT/JP2023/028284 WO2024048187A1 (ja) 2022-09-02 2023-08-02 半導体装置、および、半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPWO2024048187A1 JPWO2024048187A1 (https=) 2024-03-07
JPWO2024048187A5 true JPWO2024048187A5 (https=) 2025-05-14

Family

ID=90099246

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024544062A Pending JPWO2024048187A1 (https=) 2022-09-02 2023-08-02

Country Status (2)

Country Link
JP (1) JPWO2024048187A1 (https=)
WO (1) WO2024048187A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005236019A (ja) * 2004-02-19 2005-09-02 Fuji Electric Holdings Co Ltd 半導体装置の製造方法
JP6200759B2 (ja) * 2013-10-09 2017-09-20 株式会社日立製作所 半導体装置およびその製造方法
JP2018019000A (ja) * 2016-07-29 2018-02-01 株式会社ケーヒン パワー半導体モジュール

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